5M570ZF256C4N - MAX V CPLD 570 LE 159 I/O 152MHz | Altera / Intel
MPN: 5M570ZF256C4N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.85 | $12.85 |
| 10 | $11.42 | $114.20 |
| 100 | $9.18 | $918.00 |
| 500 | $7.65 | $3,825.00 |
| 1,000 | $6.42 | $6,420.00 |
Drop-in alternatives for 5M570ZF256C4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5M570ZF256C5N
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View Datasheet →5M570ZF256A5N
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View Datasheet →5M570ZF256I5N
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View Datasheet →5M2210ZF256C4N
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View Datasheet →5M1270ZF256C4N
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View Datasheet →5M570ZF256C4N Maximum Ratings & Electrical Characteristics
| Family | MAX V |
| Device Logic Elements | 570 |
| Number of Macrocells | 440 |
| Number of Logic Array Blocks (LABs) | 57 |
| User Flash Memory | 8192 bits (8 Kbit) |
| Number of Programmable I/Os | 159 |
| Maximum Operating Frequency | 152 MHz |
| Pin-to-Pin Logic Delay (tPD) | 9.5 ns |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V (nominal 1.8 V) |
| I/O Bank Supply (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Operating Temperature | 0 °C to +85 °C (Commercial, C4) |
| Package | FBGA-256 (17 mm × 17 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1) / In-System Programmable |
| RoHS Status | Compliant |
5M570ZF256C4N fbga-256 (17 mm × 17 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for 5M570ZF256C4N (fbga-256 (17 mm × 17 mm, 1.0 mm pitch) package) with 256 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5M570ZF256C4N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 256 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M570ZF256C4N is suitable for 6 applications: Multi-Rail Power Sequence Controller, I2C/SPI-to-GPIO Bus Bridge, Industrial I/O Expansion and Level Shifting, LED Matrix Row/Column Driver, Board Management and Housekeeping Controller, Consumer HMI Touch and Key-Scan Controller.
Multi-Rail Power Sequence Controller
The 5M570ZF256C4N is well suited for board-level power-sequencing logic because its multi-voltage I/O banks (1.2/1.5/1.8/2.5/3.3 V) can directly monitor and drive PG/EN lines of regulators at different logic levels without external level shifters. Its instant-on Flash-based configuration and deterministic 9.5 ns pin-to-pin delay allow the CPLD to assert enables in a fixed, repeatable order within microseconds of VCCINT reaching regulation - critical for processors and ASICs that require specific rail sequencing. In a typical 6-rail design, the 570 LE and 440 macrocells easily absorb the sequencing state machine plus per-rail timing trim. Low standby current (sub-100 µA typical) also keeps the always-on housekeeping path affordable in battery-backed systems.
Recommended
I2C/SPI-to-GPIO Bus Bridge
The 5M570ZF256C4N's 159 programmable I/Os and 570 LE are well matched to bus-bridging tasks between low-pin-count microcontrollers and high-fanout peripheral buses. Using JTAG-configurable I/O standards on each bank, a single device can translate between a 1.8 V SPI master and 3.3 V GPIO expanders, or split a single I2C bus into multiple addressable segments. The 9.5 ns propagation delay adds only a small deterministic offset to SPI clock-to-output timing, simplifying protocol margin analysis. 8 Kbits of user Flash also lets the bridge store identity, calibration, or revision metadata readable over JTAG or the host interface.
Recommended
Industrial I/O Expansion and Level Shifting
The 5M570ZF256C4N consolidates dozens of 74-series level-shifters and glue-logic gates into a single programmable device, simplifying industrial PLC backplanes and sensor aggregators. Its four I/O banks can each run at a different voltage (1.2 V to 3.3 V) so the CPLD simultaneously interfaces 1.8 V MCUs, 3.3 V ADCs, and 5 V-tolerant opto-isolated inputs. JTAG in-system programmability allows late-PCB respins without reworking the BOM, and the commercial 0 °C to +85 °C range covers most factory-floor enclosures. The 256-ball FBGA package supports high I/O density while keeping board area smaller than discrete equivalents.
Recommended
LED Matrix Row/Column Driver
The 5M570ZF256C4N's deterministic 9.5 ns delay and 152 MHz maximum internal frequency suit multiplexed LED-matrix scanning, where row/column switching must occur with predictable timing to avoid ghosting. With 159 I/Os available, the device can directly drive an 8-row × 16-column (or larger) matrix without external driver buffers, and its user Flash (8 Kbit) can store per-panel calibration and gamma tables. The low standby current of the MAX V family keeps idle current low in always-on signage applications.
Recommended
Board Management and Housekeeping Controller
The 5M570ZF256C4N is frequently deployed as a board-management controller that monitors voltages, temperatures, and fan tachometers, and asserts system resets or interrupts as needed. Its combination of 440 macrocells (for state machines and counters), 159 I/Os (for sensor fan-in), and instant-on Flash configuration (no external boot memory) keeps board-management functions deterministic from the first power-on cycle. Multi-voltage I/O banks let the CPLD sit directly on a 1.0 V / 1.8 V / 3.3 V mixed-rail board without glue logic. JTAG support enables in-field firmware updates for post-silicon board revisions.
Recommended
Consumer HMI Touch and Key-Scan Controller
The 5M570ZF256C4N is used as the key-scan and human-machine-interface controller in consumer appliances and smart-home panels, where its 159 I/Os can directly scan 8×16 or larger key matrices plus drive LCD segment lines. The 9.5 ns pin-to-pin delay supports debounce and scanning at microsecond rates, eliminating perceptible button latency. Multi-voltage I/O banks let the CPLD bridge between a 1.8 V application processor and 3.3 V LCD segments, and the 8 Kbit user Flash can hold UI strings, calibration constants, and product SKUs. Low power consumption keeps standby battery drain low in always-listening devices.
Recommended
Recommended Products Summary
Engineering reference data for 5M570ZF256C4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M570ZF256C5N | 5M570ZF256A5N | 5M570ZF256I5N | 5M2210ZF256C4N | 5M1270ZF256C4N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FBGA-256 | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| Logic Elements | 570 | 570 | 570 | 570 | 2210 (+288%) | 1270 (+123%) |
| Macrocells | 440 | 440 | 440 | 440 | 1700 | 980 |
| Number of I/Os | 159 | 159 | 159 | 159 | 212 (+33%) | 212 |
| Max Frequency | 152 MHz | 152 MHz | 152 MHz | 152 MHz | 152 MHz | 152 MHz |
| tPD (pin-to-pin delay) | 9.5 ns | 7.0 ns (faster) | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns |
| Operating Temperature | 0 °C to +85 °C (C4) | 0 °C to +85 °C (C5) | Automotive grade | -40 °C to +100 °C (I5) | 0 °C to +85 °C (C4) | 0 °C to +85 °C (C4) |
| User Flash Memory | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
Key Differentiators
- Highest-density 570 LE variant in the MAX V family on a single FBGA-256 footprint (vs 5M2210ZF256C4N)
- Commercial 0 °C to +85 °C C4 speed grade with 9.5 ns pin-to-pin delay (vs 5M570ZF256C5N)
- Instant-on non-volatile Flash configuration (vs Generic SRAM-based FPGA)
Design Notes
The 5M570ZF256C4N requires a clean 1.8 V core rail (VCCINT 1.71 V to 1.89 V); place a 1 µF X7R decoupling capacitor within 5 mm of each VCCINT ball and a 0.1 µF X7R within 2 mm of every VCCIO bank pin. Add a bulk 10 µF to 22 µF tantalum or ceramic capacitor near the package to absorb inrush during JTAG programming. Each I/O bank has an independent VCCIO pin group; never leave a VCCIO pin floating - tie each to its nominal rail or noise will propagate into the I/O logic.
The FBGA-256 package has a 1.0 mm ball pitch and requires 4-layer PCB with micro-via-in-pad or sub-0.1 mm dog-bone fan-out for reliable assembly. Match the footprint to the Intel/Altera-recommended land pattern (non-solder-mask-defined pads, 0.5 mm diameter) and use ENIG or OSP surface finish. Thermal performance is adequate for the CPLD's low power (sub-100 µA standby); no external heatsink is needed but keep the central thermal pad array stitched to an inner ground plane for signal return and thermal spreading.
Do not exceed the absolute maximum VCCINT of 1.89 V; even brief overshoot during hot-plug can damage the core. The user-I/O banks are grouped by VCCIO voltage - mixing 1.2 V and 3.3 V signals in the same bank is not allowed and will damage the I/O drivers. The 8 Kbit user Flash has a finite endurance (~1000 program/erase cycles typical) - do not place frequently-changing variables there; use the SRAM-style logic-array memory instead. JTAG chain ordering matters: if multiple JTAG devices share TCK/TMS, put the CPLD at the end of the chain closest to TDO so its TDO can drive cleanly into the next device's TDI without stubs.
Compliance Information
RoHS compliant per Altera/Intel product page. Lead-free FBGA-256 package. Not AEC-Q100 qualified - for automotive, choose the 5M570ZF256A5N grade variant.
