Mitsubishi Electric

CM600DY-24T330G - 1200V 600A Dual IGBT Module | Mitsubishi

MPN: CM600DY-24T330G ✓ 啟用中
1200 V Vdss 600 A Id Thick Metal Substrate (TMS) Package
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CM600DY-24T330G 概覽

The Mitsubishi Electric CM600DY-24T330G is a 1200 V, 600 A dual (half-bridge) IGBT module from the T-Series standard-type lineup, built on Mitsubishi's 7th-generation CSTBT (Carrier Stored Trench Bipolar Transistor) technology and supplied with PC-TIM (pre-applied thermal interface material) for improved thermal contact.

An IGBT (Insulated Gate Bipolar Transistor) module is a power semiconductor device that combines MOSFET gate-drive simplicity with bipolar transistor current-handling capability. Within the power electronics hierarchy, it sits above discrete IGBTs and forms the switching core of voltage regulators, motor drives, and power conversion systems. The insulated-type package allows the module's baseplate to be mounted directly to a grounded heatsink while keeping the power circuit isolated.

Key features include the high-current dual configuration (600 A per switch at 1200 V blocking), the CM600DY industry-standard dual pin-out and footprint, and Thick Metal Substrate (TMS) package technology that eliminates the typical large substrate solder layer, a common failure point, improving thermal cycling lifetime. The RFC (Relax Field Cathode) diodes co-packaged with each IGBT reduce reverse-recovery losses.

The 7th-generation CSTBT die delivers low saturation voltage and switching loss, and ultrasonic terminal bonding with internal bus structure improves package inductance compared with earlier generations. Typical applications include industrial motor drives, inverters for large drives, UPS systems, welding power supplies, and high-power switching converters where a half-bridge topology is required.

Design consideration: with PC-TIM pre-applied, no separate thermal grease is required, but the -330G suffix variant should be verified against thermal-resistance requirements; the suffix distinguishes the PC-TIM-equipped version from the standard CM600DY-24T.

This page synthesizes distributor availability, same-family drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.

直接替換替代品,適用於 CM600DY-24T330G — 相同封裝,腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號: CM600DY-24T330G (相同外形與佔位) — 差異在於 Mounting Type, Package Type, Series.

Mitsubishi Electric
Mounting Type: Chassis Mount (screw terminals)
Package Type: Insulated chassis-mount module
Series: T-Series Standard Type
比較對象 CM600DY-24T330G →

CM600DY-24T

✅ 直接替換
Mitsubishi Electric
📦 Insulated chassis-mount dual module
Dual (Half-Bridge) · 1200 V · 600 A · T-Series Standard Type

聯絡詢價

查看資料表 →

CM600DY-24A

✅ 直接替換
📦 Insulated chassis-mount dual module
older die generation (3670 W dual, per Powerex/DigiKey listing); higher conduction/switching losses vs 7th-gen CSTBT; same CM600DY footprint

📋 參考替代品(不在目錄中)

CM600DY-24NFH

✅ 直接替換
📦 Insulated chassis-mount dual module
NFH-series die optimized for different switching-speed trade-off; verify terminal arrangement; same CM600 dual footprint class

📋 參考替代品(不在目錄中)

CM600DY-24A

✅ 直接替換
📦 Insulated chassis-mount dual module
Powerex-built equivalent, 1200 V / 600 A / 3670 W dual per DigiKey; same industry-standard pin-out and footprint; earlier die generation

📋 參考替代品(不在目錄中)

CM600DU-24NFH

✅ 直接替換
📦 Insulated chassis-mount dual module
U-series NFH generation with different loss/switching-speed profile; same CM600 1200 V / 600 A class; verify terminal layout

📋 參考替代品(不在目錄中)

CM600DY-24T330G 最大額定值與電氣特性

Configuration Dual (Half-Bridge)
Collector-Emitter Voltage (VCES) 1200 V
Continuous Collector Current (IC) 600 A
Series T-Series, 7th Generation Standard Type
IGBT Technology CSTBT (Carrier Stored Trench Bipolar Transistor)
Diode Technology RFC diode
Thermal Interface PC-TIM pre-applied (-330G suffix)
Package Technology Thick Metal Substrate (TMS)
Package Type Insulated chassis-mount power module
安裝類型 Chassis Mount (screw-terminal)
Isolation Insulated type baseplate
Intended Use High power switching use

CM600DY-24T330G insulated chassis-mount power module 腳位配置指南

CM600DY-24T330G(insulated chassis-mount power module 封裝)的腳位配置。 此功率元件具有閘極、汲極與源極端子。對於非極性封裝,請參閱製造商資料表以取得確切的第 1 腳方向與佈局詳細資訊。常見應用包括電源設計、馬達驅動與負載切換。

CM600DY-24T330G 的 insulated chassis-mount power module 封裝腳位圖

無詳細腳位定義資料: CM600DY-24T330G.

請參閱 資料表 以查看完整腳位配置。

安全工作區

DC 連續操作

典型應用

CM600DY-24T330G 適用於 6 應用s: Industrial Motor Drives, UPS and Power Conversion Inverters, Welding Power Supplies, Elevator and Hoist Drives, High-Power DC-DC Converters, Wind and Renewable Energy Converters.

🏭

Industrial Motor Drives

The CM600DY-24T330G fits large variable-frequency drives where 1200 V blocking and 600 A continuous current per switch are required, typically for motors in the hundreds of kW class on 400-690 V AC lines. Two or three dual modules assemble a complete three-phase inverter bridge. The 7th-generation CSTBT die reduces VCE(sat), cutting conduction losses at full drive current, while RFC diodes limit reverse-recovery losses during PWM switching. The TMS substrate improves power-cycling lifetime against repetitive load swings, and the PC-TIM interface ensures consistent heatsink contact across production units, reducing thermal variation between drive channels.

⚡

UPS and Power Conversion Inverters

In uninterruptible power supplies and central inverters, the half-bridge configuration of the CM600DY-24T330G directly implements the phase legs of the output stage. Its 1200 V rating covers 400 V AC systems with ample margin, and the 600 A rating supports high-power single-module legs. CSTBT technology lowers on-state losses during extended battery-backup operation at high load, improving overall UPS efficiency. The insulated baseplate allows grounded heatsink mounting for safety compliance, and PC-TIM provides predictable junction-to-heatsink thermal resistance, which simplifies derating calculations across the fleet of installed units in a data-center power room.

🔧

Welding Power Supplies

High-current welding inverters benefit from the CM600DY-24T330G's 600 A capability and robust thermal cycling design. Welding loads impose severe repetitive current pulses and rapid temperature swings; the Thick Metal Substrate (TMS) construction removes the large substrate solder layer that is a common fatigue failure point in conventional modules, directly extending service life. The RFC diodes handle the freewheeling currents during chopping operation with low recovery loss. PC-TIM maintains stable thermal contact even after repeated thermal excursions, and the industry-standard CM600DY footprint allows drop-in use in existing welding-platform designs already tooled for this module family.

🏭

Elevator and Hoist Drives

Elevator traction and hoist drives require regenerative-capable inverters with high reliability and long service life. The CM600DY-24T330G's dual configuration supports the motor bridge, and its 1200 V / 600 A ratings cover medium-to-large geared and gearless traction machines on 400 V supplies. The 7th-generation CSTBT die keeps junction temperatures lower at rated load, which extends module lifetime under the daily stop-start duty cycles typical of vertical transport. Thermal cycling endurance of the TMS package is a decisive advantage here, as elevator drives experience thousands of deep thermal cycles per year, making substrate-solder-free construction a meaningful reliability improvement.

⚡

High-Power DC-DC Converters

In high-power DC-DC stages such as battery chargers, electrolysis supplies, and traction auxiliary converters, the CM600DY-24T330G serves as the primary switching element in full-bridge or half-bridge topologies. The 1200 V blocking voltage suits 700-800 V DC bus systems, and the 600 A rating handles the high primary currents of low-ratio converters. CSTBT's flat VCE(sat) characteristic over current and temperature keeps conduction losses predictable across the operating envelope, and RFC diodes reduce turn-off recovery spikes at the transformer primary. PC-TIM assembly simplifies high-volume production where thermal interface consistency directly affects converter derating margins.

💡

Wind and Renewable Energy Converters

Grid-side and generator-side converters in small and medium wind turbines and renewable power systems operate at 690 V AC class, where 1200 V IGBTs with adequate margin are the standard choice. The CM600DY-24T330G's half-bridge format assembles into three-phase LCL-filtered grid converters, and its 600 A rating supports converter ratings in the several-hundred-kW class. Low conduction loss from CSTBT die improves annual energy yield, while the module's thermal-cycle endurance addresses the constantly varying power input characteristic of wind applications. The insulated package and industry-standard footprint ease heatsink and busbar integration in converter cabinets.

What is the CM600DY-24T330G IGBT module?
The CM600DY-24T330G is a Mitsubishi Electric T-Series standard-type dual (half-bridge) IGBT module rated 1200 V and 600 A, built on 7th-generation CSTBT IGBT technology and supplied with pre-applied PC-TIM thermal interface material. According to the Mitsubishi Electric product page and Richardson RFPD listing, it is intended for high-power switching applications in an insulated chassis-mount package with industry-standard pin-out.
What is the difference between CM600DY-24T330G and CM600DY-24T?
The only difference is the thermal interface: the CM600DY-24T330G (suffix #330G) ships with PC-TIM pre-applied thermal interface material, while the standard CM600DY-24T ships without it. Both share the same die, 1200 V / 600 A ratings, dual half-bridge configuration, and industry-standard footprint. According to Mouser, both are listed as T-Series standard-type dual IGBT modules; the PC-TIM version simplifies heatsink assembly and improves thermal contact consistency.
What are the key specifications of CM600DY-24T330G that engineers should know?
The key specifications are: 1200 V collector-emitter blocking voltage (VCES), 600 A continuous collector current per switch, dual (half-bridge) configuration, 7th-generation CSTBT IGBT die, RFC co-packaged diodes, Thick Metal Substrate (TMS) package technology, insulated chassis-mount package, and PC-TIM pre-applied interface. These figures come from the Mitsubishi Electric datasheet and the US Semiconductor Division product page. Exact VCE(sat) and thermal resistance values should be confirmed in the datasheet PDF.
Where can I buy CM600DY-24T330G online?
The CM600DY-24T330G is available from authorized distributors including Mouser (listed as CM600DY-24T#330G), Richardson RFPD, and Radwell International, as well as the Mitsubishi Electric US Semiconductor & Device Division channel. As of 2026-10-11, stock and pricing should be verified directly on distributor pages, since high-power module inventory moves in factory lot quantities. Prices on this page are estimates as of 2026-10-11 and should be confirmed with a distributor quote.
What is the price of CM600DY-24T330G?
High-power IGBT modules in the CM600DY class typically sell in the several-hundred-dollar range per unit at quantity one. As of 2026-10-11, exact distributor pricing for the CM600DY-24T330G must be confirmed on Mouser or Richardson RFPD, as these modules are often quoted rather than shelf-priced. The tier prices shown on this page are estimates; volume pricing at 100+ units is usually negotiated through the manufacturer's distribution channel.
What is the best drop-in replacement for CM600DY-24T330G?
The best drop-in replacement is the standard CM600DY-24T (same die, same footprint, no PC-TIM) - simply add thermal grease during assembly. The Powerex CM600DY-24A, a 1200 V, 600 A, 3670 W dual IGBT module, follows the same CM600DY dual industry-standard pin-out and footprint and is the closest cross-supplier equivalent. Always verify the PC-TIM variant and gate-drive compatibility against the respective datasheets before substitution, because the A-generation die has different switching characteristics.
Is the Powerex CM600DY-24A equivalent to the Mitsubishi CM600DY-24T330G?
The Powerex CM600DY-24A is a functional equivalent in the same CM600DY dual package: 1200 V, 600 A, half-bridge, chassis-mount, per its DigiKey listing (3670 W power dissipation rating). Powerex is Mitsubishi Electric's power-module partner, and the pin-out and footprint are industry standard. However, the -24A is an earlier-generation die with higher losses than the 7th-generation CSTBT die in the -24T, so thermal and efficiency margins should be re-checked. It is not a true PC-TIM variant.
CM600DY-24T330G vs CM600DY-24A - which is better for a motor drive?
For a new motor drive design, the CM600DY-24T330G is better: its 7th-generation CSTBT die and RFC diodes deliver lower VCE(sat) and lower switching losses than the older CM600DY-24A generation, and the PC-TIM interface improves heatsink thermal contact. The CM600DY-24A suits legacy service replacement where an existing board was designed around it. Both share 1200 V, 600 A ratings and the same dual chassis-mount footprint, so mechanical interchange is straightforward.
When should I choose CM600DY-24T330G over CM600DU-24NFH?
Choose the CM600DY-24T330G when your design targets the standard-type T-Series loss profile and the classic CM600DY screw-terminal footprint with PC-TIM for simplified thermal assembly. The CM600DU-24NFH belongs to the U/NFH series, which is optimized for different switching-speed and loss trade-offs and may have a different terminal arrangement. If your application is general-purpose high-power switching at moderate frequency, the standard T-Series part is the appropriate and typically more available choice; verify terminal layout before committing a PCB or busbar design.
Where can I download the CM600DY-24T330G datasheet PDF?
The official datasheet PDF is available on the Mitsubishi Electric global website at mitsubishielectric.com under the T-Series IGBT module datasheets (cm600dy-24t_e.pdf). The same document applies to the PC-TIM #330G variant, which is distinguished by ordering suffix rather than a separate datasheet. Darrah Electric also hosts a mirror of the CM600DY-24T data sheet. Always use the manufacturer link as the authoritative source since distributor-hosted copies may not reflect the latest revision.
Where can I find the CM600DY-24T330G pinout?
The CM600DY-24T330G uses the industry-standard CM600DY dual (half-bridge) terminal arrangement with screw-terminal power connections (DC+ input, DC- input, AC/U, AC/V, AC/W-type outputs per half-bridge topology) and blade terminals for gate and emitter auxiliary connections. The exact terminal positions and auxiliary emitter/gate assignments are illustrated in the mechanical outline section of the Mitsubishi CM600DY-24T datasheet PDF. Because this is a screw-terminal power module rather than an IC package, consult the datasheet drawing for precise terminal coordinates.
Does the CM600DY-24T330G need thermal grease?
No - the CM600DY-24T330G has PC-TIM pre-applied thermal interface material on the baseplate, so separate thermal grease is not required at assembly. This is the main distinction from the standard CM600DY-24T, which requires user-applied thermal grease. PC-TIM provides consistent bond-line thickness and repeatable thermal contact, which is valuable in production. Note that the module is still not designed to run dry: it must be mounted to a properly sized heatsink with the specified screw torque per the datasheet.
What is the CM600DY-24T330G used for?
The CM600DY-24T330G is used for high-power switching applications requiring a 1200 V, 600 A half-bridge: industrial variable-frequency motor drives, large inverters, UPS power stages, welding power supplies, and DC-AC/DC-DC conversion stages in heavy industry. Its dual configuration allows two modules to build a full three-phase bridge with three units. The CSTBT 7th-generation die keeps conduction losses low at the 600 A rating, and the TMS substrate improves thermal cycling lifetime in drive applications.
Is CM600DY-24T330G the same as CM600DY-24T?
Essentially yes - they are the same semiconductor. The CM600DY-24T330G corresponds to Mitsubishi ordering code CM600DY-24T#330G, which per Mouser is the T-Series standard-type dual IGBT module WITH PC-TIM pre-applied. The plain CM600DY-24T is the identical module without PC-TIM. Electrical characteristics, die generation, pin-out, and footprint are the same; only the supplied thermal interface differs. Select the -330G variant for production lines that want to eliminate grease application as a process step.
Is the CM600DY-24T330G RoHS compliant and still in production?
The CM600DY-24T330G is listed as an active catalog item by Mitsubishi Electric and is stocked by Mouser and Richardson RFPD as of 2026-10-11, indicating active production status. RoHS status for this specific ordering suffix is not stated in the retrieved data and should be confirmed on the Mitsubishi Electric product page or with the distributor before design-in. High-power modules of this family are generally offered in lead-free versions for current production, but this must be verified rather than assumed.

工程參考資料,適用於 CM600DY-24T330G — 比較、設計指引及合規資訊。

選型指南

Choose the CM600DY-24T330G when you need the latest-generation 1200 V / 600 A half-bridge in the industry-standard CM600DY footprint with factory-applied PC-TIM for consistent thermal assembly - ideal for new motor-drive, UPS, welding, and renewable converter designs. Choose the plain CM600DY-24T if your process already applies thermal grease and you want the identical die without the PC-TIM premium. Choose the Powerex/Mitsubishi CM600DY-24A only for legacy service replacement, since its older die dissipates more at 600 A. NFH-generation parts (CM600DY-24NFH, CM600DU-24NFH) trade conduction loss against switching speed - verify terminal layout and loss curves before substituting. In all cases, confirm exact thermal resistance, VCE(sat), and terminal drawings from the current official datasheet.

與替代品比較

參數 本產品 CM600DY-24T CM600DY-24A CM600DY-24NFH CM600DU-24NFH
Package Insulated chassis-mount dual module (CM600DY footprint) Same CM600DY footprint - identical Same CM600DY footprint - identical Same CM600DY footprint class - verify terminals CM600 U-series footprint class - verify terminals
Brand Mitsubishi Electric Mitsubishi Electric Mitsubishi Electric / Powerex Mitsubishi Electric Mitsubishi Electric
Configuration Dual (Half-Bridge) Dual (Half-Bridge) Dual (Half-Bridge) Dual (Half-Bridge) Dual (Half-Bridge)
VCES 1200 V 1200 V 1200 V 1200 V 1200 V
IC (Continuous) 600 A 600 A 600 A 600 A 600 A
IGBT Die Generation 7th Generation CSTBT 7th Generation CSTBT Earlier generation (higher losses) NFH generation NFH generation

主要差異化特點

  • 7th-generation CSTBT die with lowest conduction loss in the CM600DY family (對比CM600DY-24A)
  • PC-TIM pre-applied thermal interface eliminates grease application (對比CM600DY-24T)
  • TMS substrate removes substrate solder layer failure mode (對比CM600DY-24A)

設計說明

The -330G variant ships with PC-TIM pre-applied, so do not apply thermal grease on top of it - doing so can increase thermal resistance rather than reduce it. Mount the module to a flat heatsink (datasheet flatness spec) with the manufacturer-specified screw torque and sequence. Estimated: at 600 A conduction duty with typical 7th-gen CSTBT VCE(sat) around 1.7-2.0 V, per-switch conduction loss can approach 1 kW class; heatsink selection must be based on the exact datasheet Rth(j-c) and VCE(sat) values rather than these estimates. Verify all thermal figures in the official CM600DY-24T datasheet before finalizing heatsink design.

Keep the gate-drive loop short and use independent, isolated gate drivers per switch with separate turn-on/turn-off gate resistors to control di/dt. The module's internal bus structure and ultrasonic terminal bonding reduce parasitic inductance, but the external DC bus decoupling still matters: place a snubber or film capacitor close to the module DC terminals to limit VCE overshoot during turn-off at high current. Negative gate bias (typically around -5 V to -10 V for IGBT modules) is recommended during off-state to prevent parasitic turn-on from dv/dt induced gate currents in the half-bridge leg.

Do not substitute the CM600DY-24A or NFH-generation parts into a -24T design without re-evaluating switching loss and gate-charge differences - the older generations dissipate measurably more and may exceed thermal limits in a margin-tight design. Also confirm the ordering suffix: CM600DY-24T330G equals CM600DY-24T#330G (with PC-TIM); ordering the plain CM600DY-24T by mistake leaves the assembly line without the pre-applied interface material. Always download the current datasheet revision from mitsubishielectric.com rather than relying on distributor-hosted copies.

合規資訊

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
無鉛
Unknown
無鹵
Unknown
衝突礦產
Unknown

Compliance status not stated in retrieved web data; confirm on Mitsubishi Electric product page or with distributor before design-in.

資料驗證日期: 2026-10-11 — 資料由 XAIPART 元件工程團隊驗證及整理

相關搜尋

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相關元件與詞彙

Mitsubishi Electric CM600DY-24T330G CM600DY-24T CM600DY-24A CM600DY-24NFH CM600DU-24NFH Powerex IGBT module CSTBT RFC diode PC-TIM TMS (Thick Metal Substrate) half-bridge dual IGBT module T-Series insulated chassis-mount package 1200 V 600 A industrial motor drives UPS inverter Mouser Richardson RFPD safe operating area
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