CM600DY-24T330G - 1200V 600A Dual IGBT Module | Mitsubishi
Teilenummer: CM600DY-24T330G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $585 | $585,00 |
| 10 | $552 | $5.520,00 |
| 100 | $521 | $52.100,00 |
| 500 | $495 | $247.500,00 |
| 1.000 | $468 | $468.000,00 |
CM600DY-24T330G Übersicht
An IGBT (Insulated Gate Bipolar Transistor) module is a power semiconductor device that combines MOSFET gate-drive simplicity with bipolar transistor current-handling capability. Within the power electronics hierarchy, it sits above discrete IGBTs and forms the switching core of voltage regulators, motor drives, and power conversion systems. The insulated-type package allows the module's baseplate to be mounted directly to a grounded heatsink while keeping the power circuit isolated.
Key features include the high-current dual configuration (600 A per switch at 1200 V blocking), the CM600DY industry-standard dual pin-out and footprint, and Thick Metal Substrate (TMS) package technology that eliminates the typical large substrate solder layer, a common failure point, improving thermal cycling lifetime. The RFC (Relax Field Cathode) diodes co-packaged with each IGBT reduce reverse-recovery losses.
The 7th-generation CSTBT die delivers low saturation voltage and switching loss, and ultrasonic terminal bonding with internal bus structure improves package inductance compared with earlier generations. Typical applications include industrial motor drives, inverters for large drives, UPS systems, welding power supplies, and high-power switching converters where a half-bridge topology is required.
Design consideration: with PC-TIM pre-applied, no separate thermal grease is required, but the -330G suffix variant should be verified against thermal-resistance requirements; the suffix distinguishes the PC-TIM-equipped version from the standard CM600DY-24T.
This page synthesizes distributor availability, same-family drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für CM600DY-24T330G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit CM600DY-24T330G (gleiche Bauform und Footprint) – abweichend in Mounting Type, Package Type, Series.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
CM600DY-24T
✅ Drop-In✓ Auf Lager
$1 / Stück
Datenblatt ansehen →CM600DY-24A
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
CM600DY-24NFH
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
CM600DY-24A
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
CM600DU-24NFH
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
CM600DY-24T330G Grenzwerte & elektrische Eigenschaften
| Configuration | Dual (Half-Bridge) |
| Collector-Emitter Voltage (VCES) | 1200 V |
| Continuous Collector Current (IC) | 600 A |
| Series | T-Series, 7th Generation Standard Type |
| IGBT Technology | CSTBT (Carrier Stored Trench Bipolar Transistor) |
| Diode Technology | RFC diode |
| Thermal Interface | PC-TIM pre-applied (-330G suffix) |
| Package Technology | Thick Metal Substrate (TMS) |
| Package Type | Insulated chassis-mount power module |
| Montageart | Chassis Mount (screw-terminal) |
| Isolation | Insulated type baseplate |
| Intended Use | High power switching use |
CM600DY-24T330G insulated chassis-mount power module Pinbelegungsleitfaden
Pinbelegung für CM600DY-24T330G (insulated chassis-mount power module-Gehäuse). Dieses Leistungsbauteil verfügt über Gate-, Drain- und Source-Anschlüsse. Bei nicht gepolten Gehäusen entnehmen Sie die genaue Ausrichtung von Pin 1 und Footprint-Details dem Herstellerdatenblatt. Typische Anwendungen sind Netzteilentwurf, Motoransteuerung und Lastschaltung.
Keine detaillierten Pinbelegungsdaten verfügbar für CM600DY-24T330G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Sicherer Arbeitsbereich
Typische Anwendungen
CM600DY-24T330G ist geeignet für 6 Anwendungs: Industrial Motor Drives, UPS and Power Conversion Inverters, Welding Power Supplies, Elevator and Hoist Drives, High-Power DC-DC Converters, Wind and Renewable Energy Converters.
Industrial Motor Drives
The CM600DY-24T330G fits large variable-frequency drives where 1200 V blocking and 600 A continuous current per switch are required, typically for motors in the hundreds of kW class on 400-690 V AC lines. Two or three dual modules assemble a complete three-phase inverter bridge. The 7th-generation CSTBT die reduces VCE(sat), cutting conduction losses at full drive current, while RFC diodes limit reverse-recovery losses during PWM switching. The TMS substrate improves power-cycling lifetime against repetitive load swings, and the PC-TIM interface ensures consistent heatsink contact across production units, reducing thermal variation between drive channels.
Empfohlen
UPS and Power Conversion Inverters
In uninterruptible power supplies and central inverters, the half-bridge configuration of the CM600DY-24T330G directly implements the phase legs of the output stage. Its 1200 V rating covers 400 V AC systems with ample margin, and the 600 A rating supports high-power single-module legs. CSTBT technology lowers on-state losses during extended battery-backup operation at high load, improving overall UPS efficiency. The insulated baseplate allows grounded heatsink mounting for safety compliance, and PC-TIM provides predictable junction-to-heatsink thermal resistance, which simplifies derating calculations across the fleet of installed units in a data-center power room.
Empfohlen
Welding Power Supplies
High-current welding inverters benefit from the CM600DY-24T330G's 600 A capability and robust thermal cycling design. Welding loads impose severe repetitive current pulses and rapid temperature swings; the Thick Metal Substrate (TMS) construction removes the large substrate solder layer that is a common fatigue failure point in conventional modules, directly extending service life. The RFC diodes handle the freewheeling currents during chopping operation with low recovery loss. PC-TIM maintains stable thermal contact even after repeated thermal excursions, and the industry-standard CM600DY footprint allows drop-in use in existing welding-platform designs already tooled for this module family.
Empfohlen
Elevator and Hoist Drives
Elevator traction and hoist drives require regenerative-capable inverters with high reliability and long service life. The CM600DY-24T330G's dual configuration supports the motor bridge, and its 1200 V / 600 A ratings cover medium-to-large geared and gearless traction machines on 400 V supplies. The 7th-generation CSTBT die keeps junction temperatures lower at rated load, which extends module lifetime under the daily stop-start duty cycles typical of vertical transport. Thermal cycling endurance of the TMS package is a decisive advantage here, as elevator drives experience thousands of deep thermal cycles per year, making substrate-solder-free construction a meaningful reliability improvement.
Empfohlen
High-Power DC-DC Converters
In high-power DC-DC stages such as battery chargers, electrolysis supplies, and traction auxiliary converters, the CM600DY-24T330G serves as the primary switching element in full-bridge or half-bridge topologies. The 1200 V blocking voltage suits 700-800 V DC bus systems, and the 600 A rating handles the high primary currents of low-ratio converters. CSTBT's flat VCE(sat) characteristic over current and temperature keeps conduction losses predictable across the operating envelope, and RFC diodes reduce turn-off recovery spikes at the transformer primary. PC-TIM assembly simplifies high-volume production where thermal interface consistency directly affects converter derating margins.
Empfohlen
Wind and Renewable Energy Converters
Grid-side and generator-side converters in small and medium wind turbines and renewable power systems operate at 690 V AC class, where 1200 V IGBTs with adequate margin are the standard choice. The CM600DY-24T330G's half-bridge format assembles into three-phase LCL-filtered grid converters, and its 600 A rating supports converter ratings in the several-hundred-kW class. Low conduction loss from CSTBT die improves annual energy yield, while the module's thermal-cycle endurance addresses the constantly varying power input characteristic of wind applications. The insulated package and industry-standard footprint ease heatsink and busbar integration in converter cabinets.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für CM600DY-24T330G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | CM600DY-24T | CM600DY-24A | CM600DY-24NFH | CM600DU-24NFH |
|---|---|---|---|---|---|
| Package | Insulated chassis-mount dual module (CM600DY footprint) | Same CM600DY footprint - identical | Same CM600DY footprint - identical | Same CM600DY footprint class - verify terminals | CM600 U-series footprint class - verify terminals |
| Brand | Mitsubishi Electric | Mitsubishi Electric | Mitsubishi Electric / Powerex | Mitsubishi Electric | Mitsubishi Electric |
| Configuration | Dual (Half-Bridge) | Dual (Half-Bridge) | Dual (Half-Bridge) | Dual (Half-Bridge) | Dual (Half-Bridge) |
| VCES | 1200 V | 1200 V | 1200 V | 1200 V | 1200 V |
| IC (Continuous) | 600 A | 600 A | 600 A | 600 A | 600 A |
| IGBT Die Generation | 7th Generation CSTBT | 7th Generation CSTBT | Earlier generation (higher losses) | NFH generation | NFH generation |
Wichtigste Unterscheidungsmerkmale
- 7th-generation CSTBT die with lowest conduction loss in the CM600DY family (vs. CM600DY-24A)
- PC-TIM pre-applied thermal interface eliminates grease application (vs. CM600DY-24T)
- TMS substrate removes substrate solder layer failure mode (vs. CM600DY-24A)
Designhinweise
The -330G variant ships with PC-TIM pre-applied, so do not apply thermal grease on top of it - doing so can increase thermal resistance rather than reduce it. Mount the module to a flat heatsink (datasheet flatness spec) with the manufacturer-specified screw torque and sequence. Estimated: at 600 A conduction duty with typical 7th-gen CSTBT VCE(sat) around 1.7-2.0 V, per-switch conduction loss can approach 1 kW class; heatsink selection must be based on the exact datasheet Rth(j-c) and VCE(sat) values rather than these estimates. Verify all thermal figures in the official CM600DY-24T datasheet before finalizing heatsink design.
Keep the gate-drive loop short and use independent, isolated gate drivers per switch with separate turn-on/turn-off gate resistors to control di/dt. The module's internal bus structure and ultrasonic terminal bonding reduce parasitic inductance, but the external DC bus decoupling still matters: place a snubber or film capacitor close to the module DC terminals to limit VCE overshoot during turn-off at high current. Negative gate bias (typically around -5 V to -10 V for IGBT modules) is recommended during off-state to prevent parasitic turn-on from dv/dt induced gate currents in the half-bridge leg.
Do not substitute the CM600DY-24A or NFH-generation parts into a -24T design without re-evaluating switching loss and gate-charge differences - the older generations dissipate measurably more and may exceed thermal limits in a margin-tight design. Also confirm the ordering suffix: CM600DY-24T330G equals CM600DY-24T#330G (with PC-TIM); ordering the plain CM600DY-24T by mistake leaves the assembly line without the pre-applied interface material. Always download the current datasheet revision from mitsubishielectric.com rather than relying on distributor-hosted copies.
Compliance-Informationen
Compliance status not stated in retrieved web data; confirm on Mitsubishi Electric product page or with distributor before design-in.
