DCM3717S60E13G5TN1 - 750W 40-60V to 12.2V Non-Iso PoL | Vicor
MPN： DCM3717S60E13G5TN1 ✓ 啟用中DCM3717S60E13G5TN1 概覽
A non-isolated point-of-load (PoL) DC-DC converter module is a high-density power component that steps a higher intermediate bus voltage down to a low, well-regulated rail that sits immediately adjacent to a load IC such as a CPU, GPU, ASIC, or FPGA. The DCM family sits in the power-management hierarchy: DC-DC converter -> non-isolated PoL module -> voltage regulator -> power management IC -> semiconductor. By eliminating the isolation barrier and integrating magnetics, switching FETs, and control within a single SM-ChiP package, these modules deliver far higher power density than discrete buck designs while simplifying EMI, thermal, and layout work for the system engineer.
Key features include 750 W continuous / 900 W transient peak output power, 61.5 A continuous load current, 96.5% to 97.0% peak efficiency, and parallelable operation for higher power. The SM-ChiP surface-mount package enables top-side cooling and reflow soldering while exposing a low thermal resistance path for cold-plate or heatsink attachment in dense compute, networking, and industrial platforms.
Architecturally, the ZVS buck-boost front stage produces a regulated bus that feeds the SAC secondary stage; the SAC operates as a soft-switched resonant topology that delivers clean, low-noise output without the large output LC filters required by conventional buck converters. The result is fast transient response and tight regulation suitable for powering low-voltage, high-current silicon with minimal bulk capacitance.
Typical applications include 48 V direct-to-point-of-load conversion for AI accelerator cards, GPU and CPU core rails in hyperscale servers, telecom and networking switch fabrics, industrial 48 V bus systems, and battery or renewable-energy intermediate bus architectures. Compared with discrete multi-phase buck regulators, the DCM3717S60E13G5TN1 removes PCB area, switching losses, and magnetics design effort from the engineer's plate.
When designing with this part, ensure adequate cold-plate or top-side thermal management - the SM-ChiP package is intended for surface-mount solder attachment plus an external thermal spreader. Confirm that input bulk capacitance meets the datasheet's low-impedance requirement at the 40 V to 60 V rail, and observe polarity marking before reflow.
This page consolidates Vicor datasheet parameters, real-time distributor pricing, drop-in DCM-family alternatives, and practical design notes not assembled in any single source, giving engineers a one-stop reference for the DCM3717S60E13G5TN1.
直接替換替代品，適用於 DCM3717S60E13G5TN1 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： DCM3717S60E13G5TN1 （相同外形與佔位） — 差異在於 Mounting Type, Package, Peak Efficiency, Continuous Output Current, Continuous Output Power.
DCM3717S60D13K0TN1
✅ 直接替換聯絡詢價
查看資料表 →DCM3717S60E13G5TN1-STD
✅ 直接替換📋 參考替代品（不在目錄中）
DCM3735S60E13G5TN1
✅ 直接替換📋 參考替代品（不在目錄中）
DCM3717S60E13F5TN1
✅ 直接替換📋 參考替代品（不在目錄中）
DCM3717E60E13G5TN1
✅ 直接替換📋 參考替代品（不在目錄中）
DCM3717S60E13G5TN1 最大額定值與電氣特性
| 拓撲 | ZVS buck-boost + Sine Amplitude Converter (SAC) |
| Isolation | Non-isolated |
| 輸入電壓範圍 | 40 V to 60 V |
| 輸出電壓範圍 | 10.0 V to 12.5 V (12.2 V nominal trim) |
| Continuous Output Power | 750 W |
| Peak Output Power | 900 W (transient) |
| Continuous Output Current | 61.5 A |
| Peak Efficiency | 96.5% to 97.0% |
| 封裝 | SM-ChiP (surface-mount ChiP) |
| 安裝類型 | Surface Mount with top-side thermal interface |
| 輸出類型 | Regulated, adjustable trim |
| 輸出數量 | 1 |
| Parallelable | Yes (for higher output power) |
| RoHS 狀態 | Compliant |
DCM3717S60E13G5TN1 sm-chip (surface-mount chip) 腳位配置指南
DCM3717S60E13G5TN1（sm-chip (surface-mount chip) 封裝）的腳位配置。 此功率元件具有閘極、汲極與源極端子。對於非極性封裝，請參閱製造商資料表以取得確切的第 1 腳方向與佈局詳細資訊。常見應用包括電源設計、馬達驅動與負載切換。
無詳細腳位定義資料： DCM3717S60E13G5TN1.
請參閱 資料表 以查看完整腳位配置。
典型應用
DCM3717S60E13G5TN1 適用於 6 應用s: 48V Direct-to-PoL for AI Accelerator Cards, Hyperscale Server CPU/GPU Core Rails, Telecom and Networking Switch Fabrics, Industrial 48V Bus Systems, Battery and Renewable Intermediate Bus, High-Performance Computing and Test Equipment.
48V Direct-to-PoL for AI Accelerator Cards
The DCM3717S60E13G5TN1 is purpose-built for 48 V direct-to-point-of-load conversion on AI accelerator and GPU cards. Its 40 V to 60 V input accepts the standard 48 V telecom/intermediate bus directly, eliminating the bulky 48 V-to-12 V isolation stage. The 750 W continuous and 900 W transient peak power, paired with 61.5 A of continuous current at a 12.2 V nominal output, comfortably feeds high-current GPU/ASIC core rails. The ZVS-plus-SAC topology delivers 96.5% to 97.0% peak efficiency, which directly reduces cold-plate burden in liquid-cooled racks. Compared with discrete multi-phase buck regulators, the SM-ChiP integration removes PCB area, magnetics design effort, and EMI filter complexity from the engineer's plate.
推薦
Hyperscale Server CPU/GPU Core Rails
Hyperscale servers with 48 V rack distribution use the DCM3717S60E13G5TN1 to step down to 12 V intermediate or directly to 12.2 V point-of-load rails. Its 750 W continuous rating supports a full CPU socket or a pair of high-end GPUs from a single module, and units parallel for higher output. The SM-ChiP package enables top-side cold-plate attachment, the dominant cooling architecture in modern hyperscale racks. The ZVS switching plus Sine Amplitude Converter secondary stage keeps output noise low enough to feed downstream buck converters or directly power the silicon, while 97% peak efficiency reduces data-center PUE. Engineers value the deterministic, repeatable layout versus tuning a discrete multi-phase regulator.
推薦
Telecom and Networking Switch Fabrics
In telecom and networking switches, the DCM3717S60E13G5TN1 takes the standard -48 V nominal bus (rectified to +48 V to +60 V) and produces a tightly regulated 12.2 V rail for switch ASICs, PHYs, and timing cards. Its 750 W continuous rating supports aggregate switch fabric power per card slot. Non-isolated PoL architecture eliminates bulky isolation transformers, freeing board space for high-density SerDes routing. The wide 40 V to 60 V input tolerates battery backup transients, while 96.5%+ efficiency keeps thermal headroom for sealed, fan-less chassis. Compared with brick converters, the SM-ChiP form factor enables denser card-edge designs.
推薦
Industrial 48V Bus Systems
Industrial PLCs, motion controllers, and 48 V factory-automation backplanes use the DCM3717S60E13G5TN1 to deliver 12.2 V to motor-driver and sensor-hub subsystems. The 750 W continuous rating covers multi-axis motion systems, while the 900 W transient headroom handles motor inrush peaks. The SM-ChiP surface-mount package supports automated reflow assembly in volume production, and the wide 40 V to 60 V input tolerates rectified industrial bus variation. The module's high efficiency reduces cabinet cooling load and enables sealed enclosures. Drop-in SM-ChiP variants simplify qualification across product families sharing the same PCB card.
推薦
Battery and Renewable Intermediate Bus
Battery energy storage and renewable-energy systems use an intermediate 48 V bus that the DCM3717S60E13G5TN1 steps to 12.2 V for downstream battery-management, inverter control, and monitoring electronics. Its 40 V to 60 V input range accommodates battery voltage variation during charge/discharge cycles without losing regulation. 96.5%+ efficiency is critical in energy-harvesting and battery-powered deployments where every watt of conversion loss reduces usable capacity. The compact SM-ChiP form factor enables integration into space-constrained battery enclosures and outdoor inverter cabinets.
推薦
High-Performance Computing and Test Equipment
ATE load boards, FPGA prototyping systems, and high-performance compute platforms use the DCM3717S60E13G5TN1 to power FPGAs, high-speed ADCs/DACs, and data-acquisition ASICs. Its 750 W continuous and 900 W transient peak rating covers FPGA+ADC/DAC combinations, while the clean SAC post-regulated output keeps noise low for sensitive measurement circuits. The 40 V to 60 V input lets the same module operate from laboratory 48 V supplies or system rails. The SM-ChiP package enables repeatable, reflow-compatible assembly for production test systems where reliability and channel-to-channel consistency matter.
推薦
推薦產品摘要
工程參考資料，適用於 DCM3717S60E13G5TN1 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | DCM3717S60D13K0TN1 | DCM3717S60E13G5TN1-STD | DCM3735S60E13G5TN1 | DCM3717S60E13F5TN1 | DCM3717E60E13G5TN1 |
|---|---|---|---|---|---|---|
| Brand | Vicor | Vicor | Vicor | Vicor | Vicor | Vicor |
| Package | SM-ChiP | SM-ChiP - same | SM-ChiP - same | SM-ChiP - same | SM-ChiP - same | SM-ChiP evaluation board |
| Continuous Output Power | 750 W | 1000 W | 750 W | 750 W | 750 W | 750 W (evaluation board) |
| Output Current (continuous) | 61.5 A | 82 A | 61.5 A | 61.5 A | 61.5 A | 61.5 A |
| Output Voltage | 10.0 V to 12.5 V (12.2 V nom) | 10.0 V to 12.5 V (12.2 V nom) | 10.0 V to 12.5 V (12.2 V nom) | 10.0 V to 12.5 V (12.2 V nom) | 10.0 V to 12.5 V (12.2 V nom) | 10.0 V to 12.5 V (12.2 V nom) |
| Input Voltage Range | 40 V to 60 V | 40 V to 60 V | 40 V to 60 V | 40 V to 60 V | 40 V to 60 V | 40 V to 60 V |
| Topology | ZVS buck-boost + SAC | ZVS buck-boost + SAC | ZVS buck-boost + SAC | ZVS buck-boost + SAC | ZVS buck-boost + SAC | ZVS buck-boost + SAC |
| Peak Efficiency | 96.5% to 97.0% | 96.5% to 97.0% | 96.5% to 97.0% | 96.5% to 97.0% | 96.5% to 97.0% | 96.5% to 97.0% |
主要差異化特點
- Highest power density in the DCM3717 family at this input range (對比Discrete multi-phase buck regulator)
- True 48 V direct-to-PoL without isolation stage (對比Brick converter + downstream buck)
- ZVS switching plus SAC post-regulation (對比Conventional hard-switched buck)
設計說明
The SM-ChiP package of the DCM3717S60E13G5TN1 is intended for surface-mount solder plus a top-side thermal interface (cold plate or heatsink). At 96.5% to 97.0% peak efficiency the converter dissipates only 2.5% to 3.5% of through-power, but at 750 W continuous that still means roughly 19 W to 26 W of loss to remove. Use the recommended cold-plate torque and thermal interface material from Vicor to keep junction temperatures within the rated operating envelope. Estimated: at 750 W and 96.7% efficiency, internal loss is approximately 25.4 W.
Follow the Vicor SM-ChiP land pattern exactly as documented in the datasheet. Place input bulk capacitance as close as possible to the input terminals to keep the 40 V to 60 V bus low-impedance; insufficient input capacitance is the most common cause of instability in DCM modules. Keep the output capacitor loop tight and use low-ESR ceramic or polymer parts to exploit the SAC stage's fast transient response.
Route the analog trim and enable signals away from switching-node copper to avoid noise coupling. The DCM3717S60E13G5TN1 exposes a top thermal pad - keep signal traces and vias out of this region. Use a 4-layer or higher stackup with a solid inner ground plane beneath the module to provide a low-impedance return path and to spread heat. Consult the Vicor DCM3717 layout application note for full via and copper-pour guidance.
Do not assume the SM-ChiP package is a drop-in across the entire DCM37xx family - different SKUs have different power ratings (DCM3717 vs DCM3735) and different output voltage trims. Verify that the chosen variant matches your load's continuous and peak current. Also, do not parallel DCM units without following Vicor's paralleling guidance: current sharing requires specific sense-pin wiring that differs from the standard standalone hookup.
合規資訊
RoHS and REACH compliance per Vicor product page. AEC-Q100 not applicable for this industrial/data-center module. Confirm halogen-free status directly with Vicor for the latest environmental compliance attestations.
