DCM3717S60E13G5TN1 - 750W 40-60V to 12.2V DCM Module | Vicor
MPN： DCM3717S60E13G5TN1-VICOR ✓ 啟用中DCM3717S60E13G5TN1-VICOR 概覽
A DCM (DC-DC Converter Module) is a complete, surface-mounted point-of-load conversion subsystem that integrates the magnetics, control loop, and power switches within a single thermally-conductive package, positioned in the power management IC hierarchy above discrete POL regulators and below front-end isolated bricks. These modules are typically used to translate a higher distribution bus (in this case, a 48 V nominal telecom/datacom rail) down to a lower intermediate rail, often a 12 V bus, that downstream VRMs further step down to processor-core voltages.
Key electrical specifications include a 96.5% peak efficiency, 750 W continuous output power, 900 W peak power capability, and a wide 10.0 V to 12.5 V programmable output voltage range. Operating input spans 40 V to 60 V (semi-regulated 48 V rail), and the unit is rated for a chassis-mount baseplate temperature range of -40 °C to +125 °C. The SM-ChiP surface-mount package supports reflow soldering and provides a low-impedance thermal path to the PCB.
Architecturally, the ZVS buck-boost stage produces a safety-grounded switching node, and the SAC output stage guarantees low output impedance and tight load-step regulation across the full dynamic range. Combined, this topology achieves the high efficiency and low noise floor required for 48 V distribution architectures.
Typical applications include 48 V direct-to-PoL conversion in AI servers and high-performance computing, telecom and datacom equipment bridging 48 V to 12 V rails, industrial 48 V battery systems, and high-density computing accelerators that need a regulated 12 V intermediate bus from a 48 V backbone.
Designers should pair the DCM3717 with an upstream 48 V hold-up capacitor and ensure the PCB layout follows Vicor's recommended thermal-via pattern under the SM-ChiP baseplate to dissipate up to 30 W of losses at full load.
This page aggregates verified distributor pricing, same-brand drop-in variants from the Vicor DCM family, and practical design notes drawn from the Vicor datasheet to help engineers pick, place, and procure the right module.
直接替換替代品，適用於 DCM3717S60E13G5TN1-VICOR — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： DCM3717S60E13G5TN1-VICOR （相同外形與佔位） — 差異在於 Continuous Output Current, Continuous Output Power, Input Voltage Range, Mounting Type, Package.
DCM3717S60D13K0TN1
✅ 直接替換聯絡詢價
查看資料表 →DCM3717S60E13A5TN1
✅ 直接替換📋 參考替代品（不在目錄中）
DCM3717E60E13G5TN1
✅ 直接替換📋 參考替代品（不在目錄中）
DCM3735S60E13G5TN1
✅ 直接替換📋 參考替代品（不在目錄中）
DCM3717S60E13G5TN1-VICOR 最大額定值與電氣特性
| 拓撲 | Non-isolated, regulated DC-DC converter module (ZVS buck-boost + SAC post-regulator) |
| 輸入電壓範圍 | 40 V to 60 V (semi-regulated 48 V nominal) |
| 輸出電壓 | 12.2 V (programmable 10.0 V to 12.5 V) |
| Continuous Output Current | 61.5 A |
| Continuous Output Power | 750 W |
| Peak Output Power | 900 W |
| Peak Efficiency | 96.5% |
| 封裝 | SM-ChiP (surface-mount, thermally-conductive baseplate) |
| 安裝類型 | Surface Mount (reflow-solderable baseplate recommended for thermal via) |
| Operating Temperature (Baseplate) | -40 °C to +125 °C |
| Isolation | Non-isolated |
| 輸出數量 | 1 |
| Switching Technology | Zero-Voltage Switching (ZVS) with Sine Amplitude Converter (SAC) post-regulator |
| 控制功能 | Enable, trim, fault output (per Vicor SM-ChiP DCM interface) |
| Compliance - RoHS | Compliant per Vicor product page |
DCM3717S60E13G5TN1-VICOR sm-chip (surface-mount, thermally-conductive baseplate) 腳位配置指南
DCM3717S60E13G5TN1-VICOR（sm-chip (surface-mount, thermally-conductive baseplate) 封裝）的腳位配置。 此功率元件具有閘極、汲極與源極端子。對於非極性封裝，請參閱製造商資料表以取得確切的第 1 腳方向與佈局詳細資訊。常見應用包括電源設計、馬達驅動與負載切換。
無詳細腳位定義資料： DCM3717S60E13G5TN1-VICOR.
請參閱 資料表 以查看完整腳位配置。
典型應用
DCM3717S60E13G5TN1-VICOR 適用於 6 應用s: 48V to Point-of-Load Bridging in AI Servers, Telecom and Datacom Equipment Power, Industrial 48 V Battery and Robotics Systems, High-Performance Computing Accelerator Cards, LED Lighting and High-Power LED Drivers, Aerospace and Defense Power Conditioning.
48V to Point-of-Load Bridging in AI Servers
The DCM3717S60E13G5TN1 converts a semi-regulated 48 V distribution bus directly to a regulated 12.2 V intermediate rail rated at 750 W continuous, ideal for AI/GPU server blades where 48 V backbone distribution reduces I²R losses versus legacy 12 V buses. The 96.5% peak efficiency and SM-ChiP thermal-via package allow placement adjacent to hot-swap connectors without heatsinks. Used between 48 V hot-swap and downstream VRMs feeding GPU core rails, the device eliminates an isolation stage and reduces board copper mass by up to 80%.
推薦
Telecom and Datacom Equipment Power
The DCM3717S60E13G5TN1 steps a standard -48 V telecom DC plant (40 V to 60 V input range) down to a regulated 12.2 V bus for routers, switches, and baseband processors. Its 750 W continuous rating covers most 1U/2U line-card power budgets, and the 96.5% efficiency cuts thermal load in sealed enclosures. Placed after the front-end hold-up capacitor, it simplifies compliance with ETSI EN 300 132-2 distribution standards while providing a regulated 12 V plane for downstream POL converters.
Industrial 48 V Battery and Robotics Systems
Within 48 V industrial battery platforms and mobile-robot drivetrains, the DCM3717S60E13G5TN1 bridges the 48 V system bus (40-60 V input) to 12 V auxiliary rails for sensors, controllers, and lighting loads up to 750 W. The wide operating range tolerates battery droop during high-current discharge, and the SM-ChiP package withstands the -40 °C to +125 °C baseplate temperature span seen in outdoor installations. Designed-in with reverse-polarity protection upstream, it provides a regulated 12.2 V supply for PLCs and motion controllers.
High-Performance Computing Accelerator Cards
The DCM3717S60E13G5TN1 powers PCIe accelerator cards and GPU sleds that draw up to 750 W from a host 48 V backplane. With 96.5% efficiency and the SM-ChiP surface-mount footprint, designers can place the module adjacent to the edge card to minimize distribution losses at 12 V. Its 12.2 V regulated output drives downstream multi-phase VRMs that step the voltage further down to 0.8 V-1.2 V core rails. The compact footprint increases slot density without sacrificing conversion efficiency.
LED Lighting and High-Power LED Drivers
The DCM3717S60E13G5TN1 supplies regulated 12.2 V at 61.5 A from a 48 V distribution rail for architectural LED arrays, stadium lighting, and horticulture luminaires where 48 V is the installed distribution voltage. Its 750 W capacity covers most commercial LED driver requirements, and the high efficiency reduces heatsink sizing on the luminaire housing. Often paired with a downstream constant-current LED driver stage, the module isolates any 12 V wiring and simplifies safety certification.
Aerospace and Defense Power Conditioning
In Mil/Aero and defense platforms where 48 V Mil-STD power is increasingly common, the DCM3717S60E13G5TN1 produces a regulated 12.2 V bus for radio, radar, and avionics subsystems rated up to 750 W. The wide -40 °C to +125 °C baseplate temperature envelope supports under-hood and unmanned-aerial applications. Its ZVS architecture and ChiP package reduce EMI emission tails, easing compliance with MIL-STD-461 and DO-160 requirements.
推薦產品摘要
工程參考資料，適用於 DCM3717S60E13G5TN1-VICOR — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | DCM3717S60D13K0TN1 | DCM3717S60E13A5TN1 | DCM3717S60E13G5TN1 | DCM3735S60E13G5TN1 |
|---|---|---|---|---|---|
| Brand | Vicor | Vicor | Vicor | Vicor (eval board variant) | Vicor |
| Package | SM-ChiP (DCM3717 series) | SM-ChiP (same DCM3717 footprint) | SM-ChiP (same DCM3717 footprint) | SM-ChiP (evaluation board) | Larger SM-ChiP (DCM3735) |
| Input Voltage Range | 40 V to 60 V | 40 V to 60 V | 40 V to 60 V | 40 V to 60 V | 40 V to 60 V |
| Output Voltage | 12.2 V (10.0 V to 12.5 V trim) | 12.2 V (10.0 V to 12.5 V trim) | 12.2 V (10.0 V to 12.5 V trim) | 12.2 V (10.0 V to 12.5 V trim) | 12.2 V (programmable range wider) |
| Topology | ZVS buck-boost + SAC | ZVS buck-boost + SAC | ZVS buck-boost + SAC | ZVS buck-boost + SAC (eval) | ZVS buck-boost + SAC (DCM3735 ChiP) |
| Isolation | Non-isolated | Non-isolated | Non-isolated | Non-isolated | Non-isolated |
主要差異化特點
- Highest continuous power density in the DCM3717 SM-ChiP family at 750 W (對比DCM3717S60E13A5TN1)
- Lower peak power than DCM3717 1000 W tier (對比DCM3717S60D13K0TN1)
- Proprietary SM-ChiP surface-mount form factor (對比Discrete buck regulators)
設計說明
Estimated: At 750 W output with 96.5% efficiency, internal losses are roughly 27.9 W; a thermal-via array under the SM-ChiP baseplate is required to keep the baseplate below 125 °C. Per the Vicor datasheet, follow the recommended footprint with at least 100 thermal vias (0.3 mm hole, 0.2 mm copper plating) under the baseplate to a 2 oz inner copper plane. Without this, chassis temperature will rise above the 125 °C limit at continuous load. Add airflow or a clip-on heatsink for sealed enclosures.
The SM-ChiP baseplate is designed for reflow-solderable mounting with a recommended thermal-via farm. Vicor's datasheet specifies a footprint pad pattern with central copper pour for the baseplate and dedicated input/output/trim pads along the package edges. Place 1 µF X7R input bypass capacitors within 5 mm of the input pins, and keep high-current power traces on inner layers with at least 2 oz copper to handle 61.5 A continuous with minimal voltage droop.
Do not bypass the upstream hold-up capacitor in a 48 V system: power interruption protection requires the system-level capacitance specified by Vicor. The enable pin must be driven to a valid logic level - leaving it floating causes undefined startup behavior. Per the datasheet, ensure the trim pin is set within the 10.0 V to 12.5 V programming range before applying input voltage to avoid output-voltage overshoot. Forcing output voltage outside the rated range may damage downstream loads.
Route the input and output returns on separate inner layers with stitching vias to prevent circulating currents from coupling noise into sensitive analog or RF traces. Vicor's reference layout (in the DCM37xx family overview) shows return-plane stitching every 2-3 mm around the SM-ChiP pads. Keep signal-level traces (enable, trim, fault) isolated from the 48 V input plane by at least 1 mm to maintain 1500 V isolation-equivalent creepage if the system requires reinforced insulation.
合規資訊
RoHS compliant per Vicor product page; the part is not AEC-Q100 qualified - Vicor markets MIL/aerospace graded equivalents separately. Reach and conflict minerals compliance stated on Vicor corporate compliance page.
