DSPIC33EV64GM104T-I/ML - 16-bit 5V 70 MIPS DSC | Microchip
MPN： DSPIC33EV64GM104T-I/ML ✓ 啟用中DSPIC33EV64GM104T-I/ML 概覽
A digital signal controller combines the computational strengths of a microcontroller (MCU) with the math capability of a digital signal processor (DSP). Within the power-management hierarchy, a DSC such as this sits above a basic MCU: it executes deterministic control loops (PLL, motor control, power conversion) while providing general-purpose peripherals like CAN, UART and SPI. The dsPIC33EV family belongs to Microchip's 16-bit dsPIC33E architecture and is specifically designed for harsh-environment operation.
Key features include a 5V-tolerant operating range of 4.5V to 5.5V, which removes the need for a separate 3.3V rail in industrial and automotive 12V/24V systems; up to six PWM outputs for motor control; SENT protocol support for automotive sensor interfaces; and on-chip operational amplifiers that reduce external analog component count. The 64KB ECC Flash provides single-bit error correction for functional-safety oriented designs, and the device is listed by Microchip as Functional Safety (FuSa) capable.
Architecturally, the dsPIC33EV core is a modified Harvard 16-bit CMOS engine with DSP multiply-accumulate instructions, four DMA channels and seven timers, enabling deterministic real-time execution. Speed derating applies with temperature: DC to 70 MIPS at 0C to +85C, 60 MIPS at -40C to +125C, and 40 MIPS at up to +150C for the E-grade variants. The -I grade used here covers -40C to +125C.
Typical applications include automotive touch and control units, industrial motor drives and inverters, and appliance control boards where 5V noise immunity and CAN connectivity are required.
Design tip: at 70 MIPS the core runs from an internal PLL fed by a 7.37 MHz FRC oscillator, so verify flash wait-state and ECC settings in the configuration words when migrating speed grades.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 DSPIC33EV64GM104T-I/ML — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： DSPIC33EV64GM104T-I/ML （相同外形與佔位） — 差異在於 Package, Packaging, Operating Temperature, CAN, Core.
DSPIC33EV32GM104T-I/ML
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →DSPIC33EV64GM104T-H/ML
✅ 直接替換📋 參考替代品（不在目錄中）
DSPIC33EV128GM104T-I/ML
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →DSPIC33EV256GM104T-I/ML
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
DSPIC33EV64GM104-I/ML
✅ 直接替換聯絡詢價
查看資料表 →DSPIC33EV64GM104T-I/ML 最大額定值與電氣特性
| Core Architecture | 16-bit dsPIC33E DSC (modified Harvard) |
| Max MIPS | 70 MIPS |
| Supply Voltage Range | 4.5 V to 5.5 V |
| Flash Memory | 64 KB (22K x 24) with ECC |
| SRAM | 8 KB |
| 封裝 | 44-QFN (8x8 mm) exposed pad |
| 工作溫度 | -40C to +125C (I grade) |
| PWM Outputs | Up to 6 |
| CAN | Yes (ECAN) |
| SENT Interface | Yes |
| On-chip Op Amps | Yes |
| DMA Channels | 4 |
| Timers | 7 |
| Process Technology | CMOS |
| Functional Safety Support | FuSa (Functional Safety) capable |
| 安裝類型 | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Target Applications | Automotive, industrial, appliances (harsh environments) |
DSPIC33EV64GM104T-I/ML 44-qfn (8x8 mm) exposed pad 腳位配置指南
DSPIC33EV64GM104T-I/ML（44-qfn (8x8 mm) exposed pad 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： DSPIC33EV64GM104T-I/ML.
請參閱 資料表 以查看完整腳位配置。
典型應用
DSPIC33EV64GM104T-I/ML 適用於 6 應用s: Automotive Control Units, Industrial Motor Drives and Inverters, Power Conversion and Digital Power Supplies, Appliance Control Boards, Automotive Sensor Signal Conditioning, Industrial Automation and CAN Networking.
Automotive Control Units
The DSPIC33EV64GM104T-I/ML fits automotive sensor and control units because it combines a 5V-noise-immune core with SENT protocol support and ECAN networking on a single die. Microchip explicitly positions the dsPIC33EV GM family for automotive touch and control units operating in harsh environments with noise and vibration. The 64KB ECC Flash corrects single-bit memory errors for functional-safety oriented designs, and the -40C to +125C I-grade rating covers under-hood adjacent zones. In a typical node, the SENT module reads digital sensors while the ECAN interface reports to the vehicle bus, with the four DMA channels offloading message handling to keep the 60 MIPS loop deterministic.
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Industrial Motor Drives and Inverters
This controller suits motor drive applications through up to six PWM outputs, DSP multiply-accumulate instructions for field-oriented control (FOC), and on-chip op amps that amplify shunt-current signals without external amplifier ICs. The 5V supply provides wide noise margins in electrically noisy inverter cabinets, and the 70 MIPS core executes current-loop control at multi-kilohertz rates with deterministic latency. ECC Flash protects the control firmware against bit upsets from switching transients. Designers should use the seven timers for complementary PWM dead-time generation and ADC trigger synchronization, and exploit the four DMA channels to stream ADC current samples directly to RAM, freeing CPU cycles for the speed loop and CAN communications.
推薦
Power Conversion and Digital Power Supplies
Digital power supplies benefit from this DSC's combination of high-resolution PWM, fast ADC and DSP math in a 5V device. The dsPIC33EV core implements voltage-mode or average-current-mode control loops at switching frequencies of tens to hundreds of kilohertz, while the ECC-protected 64KB Flash safely stores compensation coefficients and fault logs. The on-chip op amps condition current-shunt signals, reducing BOM cost versus an external amplifier. Because the part runs directly from a 5V auxiliary rail common in switch-mode power supplies, no additional LDO is needed. The ECAN module enables digital power supplies in telecom rectifiers to report telemetry on a CAN bus, and the -40C to +125C rating covers outdoor power infrastructure.
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Appliance Control Boards
Home and commercial appliances demand low-cost controllers with strong EMI immunity, motor-control peripherals and robust I/O - exactly the profile Microchip cites for the dsPIC33EV family (appliances, industrial and automotive harsh environments). Running the core at 5V gives the DSPIC33EV64GM104T-I/ML superior noise immunity on appliance PCBs near relays, triacs and switched motors, compared with 3.3V MCUs. The six PWM outputs drive BLDC compressor or fan motors, the op amps condition NTC or shunt feedback, and 64KB Flash holds UI state machines and fault diagnostics. The 44-QFN 8x8 package keeps board area compact while the exposed pad aids heat dissipation from the 70 MIPS core.
推薦
Automotive Sensor Signal Conditioning
The SENT interface and on-chip op amps make this DSC a natural fit for automotive sensor acquisition nodes. SENT (Single Edge Nibble Transmission) is the standard point-to-point protocol connecting sensors to ECUs, and hardware support removes software timing burden from the core. The internal op amps amplify resistive-bridge or shunt signals before the ADC, and the DSP MAC instructions implement digital filtering and linearization of thermocouple, pressure or position data. The 5V supply directly powers legacy 5V sensor bridges without level shifting. With -40C to +125C operation, ECC Flash for measurement integrity, and CAN for ECU connectivity, one 44-QFN device replaces an analog front-end plus MCU combination.
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Industrial Automation and CAN Networking
In factory automation nodes, the ECAN module of the DSPIC33EV64GM104T-I/ML links I/O and actuator boards onto industrial CAN networks, while the 70 MIPS core handles local sequencing, protocol processing and closed-loop control. The 5V I/O directly interfaces with industrial sensors, PLC signals and optocouplers without level translators, improving robustness on long cable runs. Seven timers generate precise gating and measurement intervals, and four DMA channels service UART, SPI and CAN traffic with minimal CPU load. The FuSa capability and ECC Flash support safety-relevant I/O modules, and the -40C to +125C package rating tolerates unventilated control cabinets mounted next to drives and power electronics.
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推薦產品摘要
工程參考資料，適用於 DSPIC33EV64GM104T-I/ML — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | DSPIC33EV32GM104T-I/ML | DSPIC33EV64GM104T-H/ML | DSPIC33EV128GM104T-I/ML | DSPIC33EV256GM104T-I/ML | DSPIC33EV64GM104-I/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) exposed pad | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB (22K x 24) ECC | 32 KB ECC | 64 KB ECC | 128 KB ECC | 256 KB ECC | 64 KB ECC |
| RAM | 8 KB | 4 KB | 8 KB | 16 KB | 32 KB | 8 KB |
| Max MIPS | 70 MIPS (0C to +85C) | 70 MIPS | 70 MIPS (40 MIPS to +150C) | 70 MIPS | 70 MIPS | 70 MIPS |
| Operating Temperature | -40C to +125C (I grade) | -40C to +125C | -40C to +150C | -40C to +125C | -40C to +125C | -40C to +125C |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| Peripherals (CAN/SENT/PWM/OpAmps) | ECAN, SENT, 6x PWM, op amps, 4 DMA, 7 timers | Same peripheral set | Same peripheral set | Same peripheral set | Same peripheral set | Same peripheral set |
主要差異化特點
- Largest flash in the drop-in footprint at lowest cost point (對比DSPIC33EV32GM104T-I/ML)
- Full-speed industrial temperature operation (對比DSPIC33EV64GM104T-H/ML)
- Cost-efficient code headroom vs top-of-family (對比DSPIC33EV256GM104T-I/ML)
設計說明
The dsPIC33EV core requires a regulated 4.5V-5.5V supply. Provide separate VDD/VSS pairs per datasheet grouping with 0.1uF ceramic decoupling at each pair plus one bulk 10uF capacitor near the 44-QFN. On boards with noisy motors or inverters, add a ferrite bead between the 5V rail and VDD to suppress conducted EMI. Note the speed-temperature derating: design the clock configuration for 60 MIPS if the full -40C to +125C I-grade range is used, reserving 70 MIPS for the 0C to +85C window per the family datasheet operating conditions.
The 8x8 mm 44-QFN exposed pad is the primary thermal and ground path. Solder the exposed pad to a ground pour with an array of thermal vias (typically 3x3 or 4x4) to keep junction temperature low at 70 MIPS operation and to provide a low-inductance ground reference for the CAN and PWM outputs. Keep the ICSP programming pins (PGD/PGC) and MCLR routed to a 5-pin header even in production designs to permit in-circuit reprogramming and diagnostics without desoldering the QFN.
Do not substitute the /MR 6x6 mm QFN variant onto a /ML 8x8 mm land pattern - the footprints are mechanically incompatible. Verify configuration words (oscillator source, ECC settings, watchdog) when migrating code between flash-size family members such as the 32KB and 64KB GM104 parts, since memory bounds and config addresses differ. Finally, when using SENT and ECAN simultaneously, check the pin-mapping (RPx remappable pins) in the datasheet I/O table to avoid peripheral pin conflicts during firmware porting.
合規資訊
RoHS/lead-free status inferred from current-production Microchip QFN parts; formal environmental documents should be downloaded from Microchip's product page. AEC-Q100 qualification is not explicitly stated in the provided data for this MPN - verify with Microchip for automotive-grade requirements.