EFM32G800F128G-E-D1I - 32MHz Cortex-M3 MCU | Silicon Labs
MPN： EFM32G800F128G-E-D1I ✓ 啟用中EFM32G800F128G-E-D1I 概覽
A microcontroller is an integrated circuit that combines a processor core, program memory, data memory, and peripherals such as timers, serial interfaces, analog blocks, and interrupt controllers. The EFM32G family belongs to the broader embedded-control hierarchy of microcontroller ICs and uses the ARM Cortex-M3 processor architecture for compact, real-time control systems.
Key characteristics include a 32-bit single-core Cortex-M3 processor, 128 KB of flash organized as 128K x 8, and operation from a 1.98 V to 3.8 V supply. According to the Silicon Labs EFM32G datasheet, the Gecko family consumes as little as 0.6 uA in Stop mode and 180 uA/MHz in Run mode, supporting applications where standby energy use is a primary design constraint.
The EFM32G architecture combines autonomous peripherals with substantial analog and digital integration. Peripheral operation can continue with reduced processor intervention, helping deterministic control systems manage time-critical tasks. The Cortex-M3 core also supports efficient exception handling, while the integrated analog and communication resources reduce the component count required for sensor acquisition, industrial monitoring, and connected embedded products.
Typical uses include low-power sensor nodes, battery-operated measurement instruments, industrial condition-monitoring equipment, compact control modules, and energy-harvesting products. The 128 KB flash capacity is suitable for moderate firmware images containing drivers, protocol stacks, application logic, and update services without requiring external program memory.
The die package requires a package-specific assembly process, so the pin assignment, bonding plan, and exposed-pad requirements must be confirmed before layout. Use the EFM32G datasheet and EFM32G reference manual for die markings, pad locations, programming procedures, peripheral details, and production test requirements.
This page consolidates the verified device identity, electrical envelope, power characteristics, die-package considerations, commercial ordering information, and design guidance into a single engineering reference for engineers evaluating the EFM32G800F128G-E-D1I for an embedded module or wafer-level design.
直接替換替代品，適用於 EFM32G800F128G-E-D1I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此產品無可直接替換的替代品。
申請替代品EFM32G800F128G-E-D1I 最大額定值與電氣特性
| Product Type | 32-bit ARM Cortex-M3 Gecko Microcontroller |
| Manufacturer | Silicon Labs |
| Series | EFM32G Gecko |
| Processor Core | ARM Cortex-M3, 32-bit single-core |
| Maximum CPU Frequency | 32 MHz |
| Flash Memory | 128 KB (128K x 8) |
| Supply Voltage Range | 1.98 V to 3.8 V |
| Device Package | Unpackaged die |
| Architecture | EFM32G Gecko |
| Stop Mode Current | 0.6 uA |
| Run Mode Current | 180 uA/MHz |
| Analog Interfaces | Integrated analog and digital resources per the EFM32G family datasheet |
| Autonomous Peripherals | Supported |
| 安裝類型 | Die assembly required |
EFM32G800F128G-E-D1I unpackaged die 腳位配置指南
EFM32G800F128G-E-D1I（unpackaged die 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EFM32G800F128G-E-D1I.
請參閱 資料表 以查看完整腳位配置。
典型應用
EFM32G800F128G-E-D1I 適用於 6 應用s: Battery-Powered Sensor Nodes, Industrial Condition Monitoring, Compact Energy-Harvesting Products, Portable Measurement Instruments, Low-Power Communications Modules, Automated Control and Actuator Systems.
Battery-Powered Sensor Nodes
The EFM32G800F128G-E-D1I fits battery-powered sensor nodes that require deterministic control without a continuous processor load. Its 32 MHz ARM Cortex-M3 core processes measurements from integrated analog resources, while the EFM32G family's Stop-mode consumption of 0.6 uA can reduce standby demand. The 128 KB flash holds device drivers, sampling logic, and low-power firmware. A custom die package also lets a product designer minimize board area in a remote environmental or asset-monitoring unit.
推薦
Industrial Condition Monitoring
The EFM32G800F128G-E-D1I supports industrial condition-monitoring equipment that must sample sensors and evaluate vibration, temperature, or equipment-health data. Its 32-bit Cortex-M3 processor provides the arithmetic capacity for filtering and local feature extraction, while 128 KB of flash accommodates control firmware and parameter tables. Die-level integration reduces the physical footprint of a compact gateway or sensor module, and Stop-mode operation helps limit energy use between measurement intervals.
推薦
Compact Energy-Harvesting Products
The EFM32G800F128G-E-D1I is appropriate for energy-harvesting products where harvested power is intermittent and the microcontroller must remain available for brief processing bursts. The EFM32G family's 180 uA/MHz Run-mode consumption and 0.6 uA Stop-mode figure make low-power scheduling important, while autonomous peripherals can reduce the need for continuous CPU intervention. Custom die packaging is particularly useful when the controller must share a very small PCB with the energy-harvesting front end.
推薦
Portable Measurement Instruments
The EFM32G800F128G-E-D1I can serve as the control core of a portable measurement instrument requiring an ARM Cortex-M3 processor and compact firmware storage. The 128 KB flash accommodates calibration tables, acquisition routines, and a user interface state machine, while the 1.98 V to 3.8 V supply range supports low-voltage battery regulation. Die assembly permits integration behind a display and keypad in a handheld enclosure with limited board area.
推薦
Low-Power Communications Modules
The EFM32G800F128G-E-D1I is suited to compact communications modules that balance protocol processing with strict standby-power limits. A 32 MHz Cortex-M3 core can handle lightweight serial protocols and control-plane tasks, while the EFM32G family's autonomous peripherals support efficient data movement. The bare-die format allows radio, antenna, and power-management circuitry to share a compact module. Firmware and board qualification must validate the complete RF and low-power behavior.
推薦
Automated Control and Actuator Systems
The EFM32G800F128G-E-D1I fits compact automated control and actuator systems that combine local decision logic with peripheral sensing. Its Cortex-M3 core executes control algorithms at up to 32 MHz, and the 128 KB flash stores state-machine logic and calibration parameters. Integrated analog and digital resources simplify implementation around sensors and actuators, while custom die integration reduces interconnect length in space-constrained modules. Production validation should cover timing margins, thermal behavior, and production-test coverage.
推薦
推薦產品摘要
工程參考資料，適用於 EFM32G800F128G-E-D1I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 |
|---|---|
| Manufacturer | Silicon Labs |
| Package | Unpackaged die |
| Processor Core | ARM Cortex-M3 |
| CPU Frequency | 32 MHz |
| Flash Memory | 128 KB (128K x 8) |
| Supply Voltage | 1.98 V to 3.8 V |
| Stop Mode Current | 0.6 uA |
| Run Mode Current | 180 uA/MHz |
主要差異化特點
- Ultra-low standby power for embedded designs (對比EFM32G800F128G-E-D1I compared with a generic 32 MHz Cortex-M3 MCU)
- Compact die-level integration (對比EFM32G800F128G-E-D1I compared with a packaged EFM32G800 ordering code)
- Integrated autonomous peripherals (對比EFM32G800F128G-E-D1I compared with a processor-centered general-purpose MCU architecture)
設計說明
Do not treat this ordering code as a standard leaded-package MCU. EFM32G800F128G-E-D1I is delivered as an unpackaged die, so a conventional PCB symbol and numbered-pin footprint cannot be used directly. Establish the bonding plan, die orientation, pad locations, and package assembly method from the applicable Silicon Labs documentation before releasing a layout. A wrong die orientation or pad map can render an otherwise correct circuit nonfunctional.
Design the power tree around the EFM32G family's 1.98 V to 3.8 V operating range and avoid leaving the device at a rail voltage merely because the source can supply a higher voltage. Use Stop mode during long idle periods and disable unused peripherals where firmware permits. The manufacturer cites 0.6 uA in Stop mode and 180 uA/MHz in Run mode, but module-level battery life also depends on regulator efficiency, sensor current, and radio activity.
For die-based products, heat removal depends on the selected package, die attach, board construction, and copper area rather than a molded package's integrated lead frame. Validate the worst-case ambient temperature, processor duty cycle, and I/O activity during system qualification. Keep the die's assembly area clear of thermally isolated hotspots and provide a deliberate path from the assembled die into the module's thermal structure.
Decoupling must be designed against the exact power pins and reference layout specified for the EFM32G family. Place the required bypass capacitors directly at the relevant supply and ground connection points, and route return current without long loops beneath the assembled die. Because the part is a bare die, the substrate, bonding rules, and pad geometry can materially change current-loop behavior compared with a molded-package MCU.
合規資訊
Die-level ordering code. Request product-specific environmental, material, and quality documentation from Silicon Labs for the assembled customer configuration.
