EP1AGX35CF780I6N - Arria GX FPGA, 33.5K LE, 780-BGA | Intel
MPN： EP1AGX35CF780I6N ⚠ 最後購買機會EP1AGX35CF780I6N 概覽
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit whose digital logic function is defined after manufacturing by the user. FPGAs sit in the broader semiconductor taxonomy between fixed-function Application-Specific Integrated Circuits (ASICs) and software-defined processors, combining ASIC-like parallelism with processor-like design flexibility. Within that hierarchy, the Arria GX family belongs to the mid-range transceiver-equipped segment, sitting below Stratix (high-end) and above Cyclone (low-cost) families, and is engineered specifically for serial-connectivity applications.
Key differentiating features of the EP1AGX35CF780I6N include up to 3.125 Gbps embedded transceivers for high-speed serial protocols, dedicated DSP blocks for high-throughput multiply-accumulate workloads, embedded memory (M512, M4K, M-RAM blocks) for buffer and FIFO storage, and flexible I/O standards support including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The Arria GX architecture is designed to provide a balanced mix of logic density, memory bandwidth, and transceiver count for cost-sensitive designs that still demand multi-gigabit serial I/O.
Technical depth is provided by the 90 nm process node and the segmented LAB/Memory/DSP architecture. Embedded transceivers are hard silicon IP blocks rather than soft logic, which yields deterministic latency and lower power per bit than fabric-implemented SERDES. The 780-pin flip-chip BGA package exposes both general-purpose I/O and the high-speed serial channels, supporting differential pair routing on inner PCB layers to maintain signal integrity at multi-gigabit data rates.
Typical applications include PCI Express endpoint and root-complex designs, telecommunications backplane interfaces, broadcast video processing equipment, software-defined radio (SDR) baseband cards, and industrial serial-link aggregation. Designers select this device when they need proven transceiver silicon and the Arria GX toolchain rather than the more expensive Stratix series.
Design considerations: ensure that transceiver reference-clock quality and PCB stackup meet the Arria GX application note requirements; pair each transceiver channel with the documented AC-coupling capacitor; verify that the chosen configuration device (EPCS/EPCQ) is sized for the compressed bitstream. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found on a single manufacturer page.
This page also curates real-time distributor pricing, cross-brand Arria GX-class pin-compatible alternatives, and practical engineering design notes that are not aggregated on the manufacturer datasheet alone.
直接替換替代品，適用於 EP1AGX35CF780I6N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1AGX35CF780I6N （相同外形與佔位） — 差異在於 Speed Grade, Package, Operating Temperature, RoHS Status, Logic Elements (LE).
EP1AGX20CF780I6N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1AGX20CF780I6
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1AGX35CF780C6N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP1AGX35CF780I6
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP1AGX20CF780C6N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1AGX20CF780C6
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1AGX35CF780I6N 最大額定值與電氣特性
| Manufacturer | Intel (formerly Altera) |
| Family | Arria GX |
| Device Series | EP1AGX35 |
| Logic Elements (LE) | 33,250 |
| Logic Array Blocks (LABs) | 33,520 |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| Embedded Transceivers | Up to 3.125 Gbps |
| 封裝 | 780-pin Flip-Chip BGA (FC-FBGA) |
| Package Code | BGA-780 |
| Package Dimensions | 29 x 29 mm |
| Terminal Pitch | 1.00 mm |
| 安裝類型 | Surface Mount |
| Terminal Form | Ball |
| Temperature Grade | Industrial |
| 工作溫度範圍 | -40C to +100C (Industrial, I6 speed grade) |
| Speed Grade | I6 |
EP1AGX35CF780I6N 29 x 29 mm 腳位配置指南
EP1AGX35CF780I6N（29 x 29 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1AGX35CF780I6N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1AGX35CF780I6N 適用於 7 應用s: PCI Express Endpoint / Root Complex, Telecommunications Backplane Aggregation, Broadcast Video Processing Equipment, Software-Defined Radio Baseband Cards, Industrial Serial-Link Aggregation, ASIC Prototyping & Emulation, Test & Measurement Instrumentation.
PCI Express Endpoint / Root Complex
The EP1AGX35CF780I6N's embedded 3.125 Gbps transceivers and hard PCI Express IP blocks make it a strong fit for PCIe Gen1 endpoint designs. The Arria GX PCIe hard IP supports x1/x4/x8 lane configurations with the appropriate configuration in Quartus, and the 780-pin package exposes all required transceiver pins for x8 PCIe designs. The 33,250 logic elements are sufficient for a soft-logic application layer plus DMA engines, while the transceivers drive the SERDES differential pair lanes directly. Designers pair each transceiver channel with the documented 100 nF AC-coupling capacitor and follow the Arria GX PCB layout guide for 85 ohm differential impedance.
推薦
Telecommunications Backplane Aggregation
Telecom backplane cards commonly aggregate multiple serial links (CPRI, OBSAI, or proprietary) onto a single board. The EP1AGX35CF780I6N's multi-channel 3.125 Gbps transceivers allow several backplane links to be terminated in a single FPGA, reducing BOM cost versus using discrete SERDES. Its 33,250 logic elements accommodate framing, deframing, and link-protocol state machines alongside the transceiver channels. Industrial temperature grade (-40C to +100C) suits outdoor-cabinet deployments such as Remote Radio Heads (RRH). The 780-pin BGA exposes both the high-speed serial pins and the general-purpose I/O for control/status.
推薦
Broadcast Video Processing Equipment
The EP1AGX35CF780I6N serves broadcast video processing cards that need real-time SDI/HD-SDI/3G-SDI deserialization, color-space conversion, and frame buffering. Embedded transceivers receive serialized SDI streams at up to 2.97 Gbps, while the logic fabric handles scaling and overlay logic. Dedicated DSP blocks accelerate chroma upsampling and filtering. The 780-pin package provides abundant user I/O for HDMI/DisplayPort interfaces alongside SDI inputs. Industrial temperature grade suits studio and outdoor broadcast truck environments. Quartus IP for SDI is freely available, shortening time-to-market versus custom SERDES implementations.
推薦
Software-Defined Radio Baseband Cards
Software-defined radio (SDR) platforms like USRP and custom designs use the EP1AGX35CF780I6N to implement wideband digital down-conversion, channelization, and packet formation in the fabric. The dedicated DSP blocks provide high-throughput multiply-accumulate operations needed for FIR filtering and FFT preprocessing, while the embedded 3.125 Gbps transceivers interface to high-speed ADC/DAC daughter-cards (e.g., FMC). The 33,250 logic elements fit complete SDR physical-layer designs plus Ethernet framing for the host link. Industrial temperature enables deployment in field-deployed radios for defense and public-safety applications.
推薦
Industrial Serial-Link Aggregation
Industrial automation platforms aggregate multiple PROFINET, EtherCAT, or SERCOS III links into a central controller board; the EP1AGX35CF780I6N supports several such protocols simultaneously thanks to its 3.125 Gbps transceivers and ample logic resources. The industrial temperature grade (-40C to +100C) is rated for factory-floor operation. The 780-pin package exposes both the high-speed serial pins and control I/O for sensor-side communication. Designers integrate motion-control state machines alongside the protocol stacks without external ASIC assistance, reducing board area and BOM cost for machine-builder customers.
推薦
ASIC Prototyping & Emulation
Designers targeting an ASIC often prototype with FPGAs to validate RTL before mask commit; the EP1AGX35CF780I6N provides 33,250 logic elements plus dedicated DSP and memory blocks that map efficiently from ASIC RTL. The 780-pin FC-FBGA exposes a large number of user I/O for ASIC pin-count exploration. Arria GX Quartus support is mature and includes incremental compilation flows that accelerate bring-up. Industrial temperature is sufficient for lab and chassis-mounted prototyping racks. Larger designs scale to multi-FPGA partitioning, where the 780-pin package provides the high pin-count required for cross-FPGA trace connections.
推薦
Test & Measurement Instrumentation
Test and measurement instruments such as logic analyzers, protocol exercisers, and bit-error-rate testers use the EP1AGX35CF780I6N to acquire high-speed serial data and route it through flexible display or analysis logic. The embedded 3.125 Gbps transceivers capture multi-gigabit signals directly, while the logic fabric implements triggering, statistics counters, and protocol decoding. Industrial temperature suits bench and field instrument use. The 780-pin FC-FBGA exposes numerous general-purpose I/O for probe pods and front-panel interfaces, and Quartus support for standard test-and-measurement IP shortens development. Multiple transceiver channels support parallel acquisition across multiple DUTs.
推薦
推薦產品摘要
工程參考資料，適用於 EP1AGX35CF780I6N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1AGX20CF780I6N | EP1AGX20CF780I6 | EP1AGX35CF780C6N | EP1AGX35CF780I6 | EP1AGX20CF780C6N |
|---|---|---|---|---|---|---|
| Package | 780-pin FC-FBGA (F780) 29x29 mm | 780-pin FC-FBGA (F780) - same | 780-pin FC-FBGA (F780) - same | 780-pin FC-FBGA (F780) - same | 780-pin FC-FBGA (F780) - same | 780-pin FC-FBGA (F780) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 33,250 | 21,580 | 21,580 | 33,250 | 33,250 | 21,580 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Commercial (0C to +85C) | Industrial | Commercial |
| Speed Grade | I6 | I6 | I6 | C6 | I6 | C6 |
| Embedded Transceivers | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
主要差異化特點
- Same-package drop-in availability within the Arria GX family (對比EP1AGX20CF780I6N)
- Industrial temperature grade with same die (對比EP1AGX35CF780C6N)
- Dedicated embedded 3.125 Gbps transceivers (對比EP1AGX35CF484I6N)
設計說明
The 780-pin FC-FBGA package is a flip-chip land-grid array - PCB land pattern MUST use non-solder-mask-defined (NSMD) pads per the Arria GX PCB layout guide. Solder-mask-defined pads cause tombstoning and broken joints during reflow because the mask opening constrains the solder joint area. Use 0.40 mm pad diameter, 0.50 mm solder mask opening, and microvia-in-pad if your PCB fabricator supports it. Estimate: the BGA ball count (780) requires at least a 6-layer PCB with symmetric stackup to route out all transceiver differential pairs.
Each embedded transceiver channel requires an external AC-coupling capacitor (typically 100 nF, 0402 size) in series with the serial differential pair. The capacitor must be placed within 250 mils of the FPGA ball to maintain the 3.125 Gbps signal integrity budget. The reference clock input also requires a dedicated low-jitter clock source - jitter above 60 ps RMS will close the eye at 3.125 Gbps. Differential routing must hold 85 ohm +/-10% impedance with intra-pair length matching under 5 mils.
The Arria GX core operates at 1.2 V with separate PLL analog supplies (VCCA_PLL) at 2.5 V and transceiver supplies at 1.2 V and 1.4 V. Estimated: with all transceivers active at 3.125 Gbps, the device draws up to 2.5-3 A from the 1.2 V core rail alone. Use a switching regulator (e.g., TI TPS54620) followed by a low-dropout linear regulator for the PLL supply; place at least 4 bulk ceramic capacitors (10 uF X5R) plus 12-16 decoupling 0.1 uF capacitors around the BGA, distributed per the Arria GX pin-out guide.
Estimated: at full transceiver utilization, the Arria GX F780 package dissipates up to 5-7 W. The 29x29 mm FC-FBGA package does not expose a thermal pad to the PCB top surface, so heat is conducted primarily through the BGA balls into the inner PCB layers. Use a 6-layer board with 1 oz copper on outer layers and 2 oz copper on inner layers, plus thermal vias underneath the central ball array. Active cooling (small heatsink or 50 CFM airflow) is required above 4 W dissipation to keep the junction below 100C in industrial applications.
Configuration mode (AS, AP, PS, FPP) determines which pins are used for configuration and whether an external configuration device (EPCS/EPCQ) is required. For AS mode, connect the MSEL[2:0] pins to the recommended pull-up/pull-down values per the handbook. nCONFIG must be pulled high through a 10 kohm resistor to VCCIO of the configuration bank; nSTATUS also requires a 10 kohm pull-up. JTAG pins TCK, TMS, TDI, TDO must be brought out to a header for in-system programming and boundary-scan test.
合規資訊
RoHS, REACH, lead-free, halogen-free status not stated in verified sources; Intel/Altera datasheets typically list compliance on the product page but no such information is present in the provided web data. AEC-Q100 not applicable - FPGAs are not automotive-qualified in the AEC-Q100 sense.
