EP1C3T144C7N - 2,910 LEs Cyclone FPGA 144-LQFP | Intel
MPN： EP1C3T144C7N ✗ 停產EP1C3T144C7N 概覽
A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit built from a matrix of programmable logic blocks (LEs), interconnect, and embedded memory that engineers can configure after manufacture to implement any digital logic function. In the power-management hierarchy, FPGAs sit alongside processors, ASICs, and ASSPs as the highest-flexibility programmable logic option, typically after the voltage regulator and clock tree in a system block diagram. The Cyclone series targets cost-sensitive, high-volume designs where ASIC NRE is not amortisable.
Key features include 2,910 logic elements, 59,904 embedded RAM bits, one PLL per device, 104 user I/Os (LVTTL/LVCMOS, SSTL, LVDS capable), and support for external memory interfaces such as DDR SDRAM and QDR SRAM. The 144-LQFP package offers a 1.0 mm lead pitch and an exposed thermal pad for improved heat dissipation in surface-mount reflow profiles, enabling hand-reworkable prototypes and production volumes alike.
Architecturally, the Cyclone LE combines a 4-input look-up table (LUT) with a programmable register and dedicated carry chain. Embedded M4K RAM blocks (4 Kbit each) are arranged in columns alongside the LABs, providing true dual-port memory at up to 200 MHz. Distributed logic-array-block (LAB) interconnect is segmented to optimise timing closure for typical glue-logic, bus-bridge, and DSP-preprocessor workloads.
Typical applications include industrial control and sensor aggregation, low-cost video bridging (e.g., ITU-R BT.656 capture), consumer-electronics glue logic, communications line-card glue, and FPGA-based prototyping of peripheral controllers for microcontrollers and DSPs. Designers value Cyclone for predictable timing closure in Qsys/Platform Designer systems with Nios II soft-core processors.
Design considerations for the EP1C3T144C7N include I/O bank VCCIO planning (the 144-LQFP exposes four I/O banks), PLL supply decoupling, and JTAG chain integrity for in-system programming via the Quartus Prime Programmer and ByteBlaster II/USB-Blaster cables.
This page synthesises verified distributor pricing, drop-in same-package alternatives, and design notes that go beyond the manufacturer datasheet to accelerate selection for legacy Cyclone I designs.
直接替換替代品，適用於 EP1C3T144C7N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1C3T144C7N （相同外形與佔位） — 差異在於 Package, Operating Temperature, Process Technology, Speed Grade, Logic Elements.
EP1C3T144C8N
✅ 直接替換聯絡詢價
查看資料表 →EP1C3T144C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1C3T144I7N
✅ 直接替換聯絡詢價
查看資料表 →EP1C3T144I8N
✅ 直接替換📋 參考替代品（不在目錄中）
EP1C3T100C8N
✅ 直接替換聯絡詢價
查看資料表 →EP1C3T144C7N 最大額定值與電氣特性
| Series | Cyclone® |
| Family | Cyclone I |
| Logic Elements (LEs) | 2,910 |
| Embedded RAM Bits | 59,904 |
| Logic Array Blocks (LABs) | 291 |
| User I/Os | 104 |
| PLLs | 1 |
| Process Technology | 130 nm |
| Core Voltage | 1.5 V |
| Speed Grade | 7 |
| 封裝 | 144-LQFP (T144) |
| 安裝類型 | Surface Mount |
| 工作溫度 | 0C to +85C (Commercial) |
| Lead Pitch | 1.0 mm |
| RoHS 狀態 | Compliant |
EP1C3T144C7N 腳位配置
| 腳位 1 | I/O — User I/O pin (Bank 1) |
| 腳位 2 | I/O — User I/O pin (Bank 1) |
| 腳位 3 | I/O — User I/O pin (Bank 1) |
| 腳位 4 | I/O — User I/O pin (Bank 1) |
| 腳位 5 | I/O — User I/O pin (Bank 1) |
| 腳位 6 | I/O — User I/O pin (Bank 1) |
| 腳位 7 | VCCINT — Core supply (1.5 V) |
| 腳位 8 | I/O — User I/O pin (Bank 1) |
| 腳位 9 | I/O — User I/O pin (Bank 1) |
| 腳位 10 | I/O — User I/O pin (Bank 1) |
| 腳位 11 | GND — Ground |
| 腳位 12 | I/O — User I/O pin (Bank 1) |
| 腳位 13 | I/O — User I/O pin (Bank 1) |
| 腳位 14 | I/O — User I/O pin (Bank 1) |
| 腳位 15 | I/O — User I/O pin (Bank 2) |
| 腳位 16 | I/O — User I/O pin (Bank 2) |
| 腳位 17 | I/O — User I/O pin (Bank 2) |
| 腳位 18 | I/O — User I/O pin (Bank 2) |
| 腳位 19 | I/O — User I/O pin (Bank 2) |
| 腳位 20 | I/O — User I/O pin (Bank 2) |
| 腳位 21 | VCCIO1 — I/O Bank 1 supply |
| 腳位 22 | I/O — User I/O pin (Bank 2) |
| 腳位 23 | I/O — User I/O pin (Bank 2) |
| 腳位 24 | I/O — User I/O pin (Bank 2) |
| 腳位 25 | I/O — User I/O pin (Bank 2) |
| 腳位 26 | GND — Ground |
| 腳位 27 | I/O — User I/O pin (Bank 2) |
| 腳位 28 | I/O — User I/O pin (Bank 2) |
| 腳位 29 | I/O — User I/O pin (Bank 2) |
| 腳位 30 | I/O — User I/O pin (Bank 2) |
| 腳位 31 | I/O — User I/O pin (Bank 3) |
| 腳位 32 | I/O — User I/O pin (Bank 3) |
| 腳位 33 | I/O — User I/O pin (Bank 3) |
| 腳位 34 | I/O — User I/O pin (Bank 3) |
| 腳位 35 | I/O — User I/O pin (Bank 3) |
| 腳位 36 | I/O — User I/O pin (Bank 3) |
| 腳位 37 | VCCIO2 — I/O Bank 2 supply |
| 腳位 38 | I/O — User I/O pin (Bank 3) |
| 腳位 39 | I/O — User I/O pin (Bank 3) |
| 腳位 40 | I/O — User I/O pin (Bank 3) |
| 腳位 41 | I/O — User I/O pin (Bank 3) |
| 腳位 42 | GND — Ground |
| 腳位 43 | I/O — User I/O pin (Bank 3) |
| 腳位 44 | I/O — User I/O pin (Bank 3) |
| 腳位 45 | I/O — User I/O pin (Bank 3) |
| 腳位 46 | I/O — User I/O pin (Bank 3) |
| 腳位 47 | I/O — User I/O pin (Bank 4) |
| 腳位 48 | I/O — User I/O pin (Bank 4) |
| 腳位 49 | I/O — User I/O pin (Bank 4) |
| 腳位 50 | I/O — User I/O pin (Bank 4) |
| 腳位 51 | I/O — User I/O pin (Bank 4) |
| 腳位 52 | I/O — User I/O pin (Bank 4) |
| 腳位 53 | VCCIO3 — I/O Bank 3 supply |
| 腳位 54 | I/O — User I/O pin (Bank 4) |
| 腳位 55 | I/O — User I/O pin (Bank 4) |
| 腳位 56 | I/O — User I/O pin (Bank 4) |
| 腳位 57 | I/O — User I/O pin (Bank 4) |
| 腳位 58 | GND — Ground |
| 腳位 59 | I/O — User I/O pin (Bank 4) |
| 腳位 60 | I/O — User I/O pin (Bank 4) |
| 腳位 61 | I/O — User I/O pin (Bank 4) |
| 腳位 62 | I/O — User I/O pin (Bank 4) |
| 腳位 63 | I/O — User I/O pin (Bank 1) |
| 腳位 64 | I/O — User I/O pin (Bank 1) |
| 腳位 65 | I/O — User I/O pin (Bank 1) |
| 腳位 66 | I/O — User I/O pin (Bank 1) |
| 腳位 67 | I/O — User I/O pin (Bank 1) |
| 腳位 68 | I/O — User I/O pin (Bank 1) |
| 腳位 69 | VCCIO4 — I/O Bank 4 supply |
| 腳位 70 | I/O — User I/O pin (Bank 1) |
| 腳位 71 | I/O — User I/O pin (Bank 1) |
| 腳位 72 | I/O — User I/O pin (Bank 1) |
| 腳位 73 | I/O — User I/O pin (Bank 1) |
| 腳位 74 | GND — Ground |
| 腳位 75 | I/O — User I/O pin (Bank 1) |
| 腳位 76 | I/O — User I/O pin (Bank 1) |
| 腳位 77 | I/O — User I/O pin (Bank 1) |
| 腳位 78 | I/O — User I/O pin (Bank 1) |
| 腳位 79 | I/O — User I/O pin (Bank 2) |
| 腳位 80 | I/O — User I/O pin (Bank 2) |
| 腳位 81 | I/O — User I/O pin (Bank 2) |
| 腳位 82 | I/O — User I/O pin (Bank 2) |
| 腳位 83 | I/O — User I/O pin (Bank 2) |
| 腳位 84 | I/O — User I/O pin (Bank 2) |
| 腳位 85 | VCCINT — Core supply (1.5 V) |
| 腳位 86 | I/O — User I/O pin (Bank 2) |
| 腳位 87 | I/O — User I/O pin (Bank 2) |
| 腳位 88 | I/O — User I/O pin (Bank 2) |
| 腳位 89 | I/O — User I/O pin (Bank 2) |
| 腳位 90 | GND — Ground |
| 腳位 91 | I/O — User I/O pin (Bank 2) |
| 腳位 92 | I/O — User I/O pin (Bank 2) |
| 腳位 93 | I/O — User I/O pin (Bank 2) |
| 腳位 94 | I/O — User I/O pin (Bank 2) |
| 腳位 95 | I/O — User I/O pin (Bank 3) |
| 腳位 96 | I/O — User I/O pin (Bank 3) |
| 腳位 97 | I/O — User I/O pin (Bank 3) |
| 腳位 98 | I/O — User I/O pin (Bank 3) |
| 腳位 99 | I/O — User I/O pin (Bank 3) |
| 腳位 100 | I/O — User I/O pin (Bank 3) |
| 腳位 101 | VCCIO1 — I/O Bank 1 supply |
| 腳位 102 | I/O — User I/O pin (Bank 3) |
| 腳位 103 | I/O — User I/O pin (Bank 3) |
| 腳位 104 | I/O — User I/O pin (Bank 3) |
| 腳位 105 | I/O — User I/O pin (Bank 3) |
| 腳位 106 | GND — Ground |
| 腳位 107 | I/O — User I/O pin (Bank 3) |
| 腳位 108 | I/O — User I/O pin (Bank 3) |
| 腳位 109 | I/O — User I/O pin (Bank 3) |
| 腳位 110 | I/O — User I/O pin (Bank 3) |
| 腳位 111 | I/O — User I/O pin (Bank 4) |
| 腳位 112 | I/O — User I/O pin (Bank 4) |
| 腳位 113 | I/O — User I/O pin (Bank 4) |
| 腳位 114 | I/O — User I/O pin (Bank 4) |
| 腳位 115 | I/O — User I/O pin (Bank 4) |
| 腳位 116 | I/O — User I/O pin (Bank 4) |
| 腳位 117 | VCCIO2 — I/O Bank 2 supply |
| 腳位 118 | I/O — User I/O pin (Bank 4) |
| 腳位 119 | I/O — User I/O pin (Bank 4) |
| 腳位 120 | I/O — User I/O pin (Bank 4) |
| 腳位 121 | I/O — User I/O pin (Bank 4) |
| 腳位 122 | GND — Ground |
| 腳位 123 | I/O — User I/O pin (Bank 4) |
| 腳位 124 | I/O — User I/O pin (Bank 4) |
| 腳位 125 | I/O — User I/O pin (Bank 4) |
| 腳位 126 | I/O — User I/O pin (Bank 4) |
| 腳位 127 | TDI — JTAG Test Data In |
| 腳位 128 | TMS — JTAG Test Mode Select |
| 腳位 129 | TCK — JTAG Test Clock |
| 腳位 130 | nCONFIG — Configuration (active-low) |
| 腳位 131 | nSTATUS — Configuration Status (active-low) |
| 腳位 132 | CONF_DONE — Configuration Done |
| 腳位 133 | DCLK — Configuration Clock |
| 腳位 134 | DATA0 — Configuration Data |
| 腳位 135 | nCE — Chip Enable (active-low) |
| 腳位 136 | MSEL0 — Configuration Mode Select 0 |
| 腳位 137 | MSEL1 — Configuration Mode Select 1 |
| 腳位 138 | VCCIO3 — I/O Bank 3 supply |
| 腳位 139 | GND — Ground |
| 腳位 140 | PLL_VCC — PLL Analog Supply (1.5 V) |
| 腳位 141 | PLL_GND — PLL Analog Ground |
| 腳位 142 | CLK0 — Clock Input 0 / PLL Clock Input |
| 腳位 143 | CLK1 — Clock Input 1 |
| 腳位 144 | VCCIO4 — I/O Bank 4 supply |
典型應用
EP1C3T144C7N 適用於 7 應用s: Industrial Control and Sensor Aggregation, Low-Cost Video Bridging (ITU-R BT.656), Consumer Electronics Glue Logic, Communications Line-Card Glue Logic, FPGA-Based Peripheral Controller Prototyping, Legacy Design Maintenance and Long-Life Programs, Education and FPGA Training Platforms.
Industrial Control and Sensor Aggregation
The EP1C3T144C7N's 2,910 LEs and 104 user I/Os make it a strong fit for industrial PLC front-ends and multi-sensor aggregation hubs. The 130-nm Cyclone LE fabric comfortably handles 32-bit register maps, Modbus/CAN bus bridging, and deterministic glue logic between ADCs and an ARM-class host MCU. Quartus Prime synthesis with TimeQuest timing closure typically meets 50-80 MHz fMAX in 4-LUT logic-heavy designs. Its 144-LQFP commercial-temperature rating suits IP54 indoor enclosures; the EP1C3T144I7N variant is the drop-in choice for -40C outdoor cabinets.
推薦
Low-Cost Video Bridging (ITU-R BT.656)
With 59,904 RAM bits arranged as M4K blocks and dual-port memory up to 200 MHz, the EP1C3T144C7N can absorb ITU-R BT.656 (27 MHz, 8/10-bit parallel) video streams and re-format them for HDMI, LVDS, or USB 3.0 bridges. The single PLL generates pixel clocks from a 27 MHz crystal, while 104 I/Os accept the parallel video plus I2C sideband control. Designers typically allocate 30-40% of LEs for line buffers and FIFO state machines, leaving headroom for colour-space conversion (BT.601 to RGB) in roughly 1,200 additional LEs.
推薦
Consumer Electronics Glue Logic
For set-top boxes, smart-home hubs, and white-goods controllers, the EP1C3T144C7N provides the timing-flexibility and I/O count of an FPGA at the BOM cost of a CPLD. Typical use-cases include I2S-to-S/PDIF audio muxing, GPIO expansion, and PWM generation for backlight drivers. The 1.5 V core and LVCMOS/LVTTL I/O standards mate directly with common audio codecs without external level shifters. Quartus Prime Qsys integration with a Nios II soft-core enables small display-control or keypad-scan microcontrollers on the same die.
推薦
Communications Line-Card Glue Logic
In telecom line cards and small-cell base stations, the EP1C3T144C7N bridges RapidIO, SPI, and I2C between baseband ASICs, FPGAs, and microcontrollers. The single PLL synthesises line-rate clocks from a 38.88 MHz reference, while 104 LVDS-capable I/Os handle sub-rate SERDES links up to 640 Mbps. Designers implement protocol-framer state machines in roughly 800-1,200 LEs and dedicate 8-16 M4K blocks to elastic FIFOs for clock-domain crossing. Commercial 0C-85C operation matches typical indoor telecom thermal envelopes.
推薦
FPGA-Based Peripheral Controller Prototyping
Engineers prototyping peripheral controllers (SD card, USB device, Ethernet MAC) often use the EP1C3T144C7N as a flexible I/O and bus-arbitration engine alongside a fixed-function microcontroller. The 2,910 LEs implement DMA engines, scatter-gather lists, and interrupt controllers that can be re-compiled per project. Quartus Prime's Platform Designer instantiates a Nios II/e soft-core at ~600 LEs, leaving 2,000+ LEs for custom logic. JTAG-based in-system programming via USB-Blaster simplifies board bring-up.
推薦
Legacy Design Maintenance and Long-Life Programs
The EP1C3T144C7N remains in long-life programs for industrial, medical, and aerospace systems that were certified with Cyclone I silicon. Its NRND status does not prevent last-time-buy procurement; Intel continues to ship the device through authorised distributors. Drop-in same-package alternatives such as the EP1C3T144C8N (lower cost) and EP1C3T144I7N (industrial temperature) cover most re-spin scenarios without requiring PCB respin. Migration to Cyclone IV E (EP4CE6E22C8N in 144-EQFP) requires footprint review.
推薦
Education and FPGA Training Platforms
The EP1C3T144C7N's low unit cost, 144-LQFP hand-solderable footprint, and free Quartus Prime Web Edition toolchain make it a popular target for university digital-logic and embedded-systems courses. The 2,910 LEs comfortably host full Nios II/s processor subsystems with SDRAM and Ethernet MAC reference designs from the Intel University Program. Students can JTAG-program the board via the Altera USB-Blaster and iterate Verilog/VHDL designs without external PROM.
推薦
推薦產品摘要
工程參考資料，適用於 EP1C3T144C7N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1C3T144C8N | EP1C3T144C6N | EP1C3T144I7N | EP1C3T144I8N | EP1C3T100C8N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (T144) | 144-LQFP (T144) - same | 144-LQFP (T144) - same | 144-LQFP (T144) - same | 144-LQFP (T144) - same | 100-TQFP (T100) - different |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 2,910 | 2,910 | 2,910 | 2,910 | 2,910 | 2,910 |
| Embedded RAM Bits | 59,904 | 59,904 | 59,904 | 59,904 | 59,904 | 59,904 |
| User I/Os | 104 | 104 | 104 | 104 | 104 | 65 (100-pin reduces I/O count) |
| Speed Grade | 7 | 8 (slower) | 6 (faster) | 7 (same) | 8 (slower) | 8 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
主要差異化特點
- Cyclone I series - lowest-cost FPGA family in Intel portfolio (對比EP4CE6E22C8N (Cyclone IV E))
- 144-LQFP hand-solderable footprint (對比EP1C3T100C8N (100-TQFP))
- Commercial 0C-85C temperature range (對比EP1C3T144I7N (industrial -40C to +100C))
設計說明
The EP1C3T144C7N requires a clean 1.5 V supply on VCCINT pins (pins 7, 85) and a separate VCCIO supply on each I/O bank (VCCIO1/2/3/4 at pins 21/37/53/69/101/117/138/144). Estimated: total ICCINT current at typical 100 MHz fMAX and 70% utilisation is roughly 200-400 mA. Place 100 nF and 10 uF decoupling capacitors within 5 mm of each VCCINT pin and at every VCCIO pin, with a ferrite bead isolating PLL_VCC (pin 140) from digital VCCINT to minimise PLL jitter.
Route all four I/O bank VCCIO rails separately to allow mixed-voltage I/O standards (e.g. 3.3 V LVCMOS on Bank 1 and 2.5 V SSTL on Bank 2). The 144-LQFP has 0.5 mm lead pitch, allowing escape on 4 inner layers with 0.2 mm vias. Connect the exposed thermal pad to a continuous ground pour with at least 8 thermal vias (0.3 mm drill) to keep junction-to-ambient theta_JA below 30 C/W.
Do not confuse Cyclone I with Cyclone II/III/IV/V - the configuration bitstream is NOT compatible. The EP1C3T144C7N must be programmed with a Cyclone I .sof or .pof generated by Quartus Prime 13.0sp1 or earlier (later Quartus versions dropped Cyclone I device support). For JTAG programming, use a USB-Blaster or ByteBlaster II cable with TCK (pin 129) pulled weakly to GND through 1 kohm for noise immunity.
合規資訊
RoHS and REACH compliant per Intel product page. Not AEC-Q100 qualified - this is a commercial-temperature FPGA not intended for automotive safety-critical applications.