EP1C3T144C7N - 2,910 LEs Cyclone FPGA 144-LQFP | Intel
Référence : EP1C3T144C7N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $24.5 | $24,50 |
| 10 | $22.05 | $220,50 |
| 100 | $19.6 | $1 960,00 |
| 500 | $17.85 | $8 925,00 |
| 1 000 | $16.2 | $16 200,00 |
EP1C3T144C7N Présentation
A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit built from a matrix of programmable logic blocks (LEs), interconnect, and embedded memory that engineers can configure after manufacture to implement any digital logic function. In the power-management hierarchy, FPGAs sit alongside processors, ASICs, and ASSPs as the highest-flexibility programmable logic option, typically after the voltage regulator and clock tree in a system block diagram. The Cyclone series targets cost-sensitive, high-volume designs where ASIC NRE is not amortisable.
Key features include 2,910 logic elements, 59,904 embedded RAM bits, one PLL per device, 104 user I/Os (LVTTL/LVCMOS, SSTL, LVDS capable), and support for external memory interfaces such as DDR SDRAM and QDR SRAM. The 144-LQFP package offers a 1.0 mm lead pitch and an exposed thermal pad for improved heat dissipation in surface-mount reflow profiles, enabling hand-reworkable prototypes and production volumes alike.
Architecturally, the Cyclone LE combines a 4-input look-up table (LUT) with a programmable register and dedicated carry chain. Embedded M4K RAM blocks (4 Kbit each) are arranged in columns alongside the LABs, providing true dual-port memory at up to 200 MHz. Distributed logic-array-block (LAB) interconnect is segmented to optimise timing closure for typical glue-logic, bus-bridge, and DSP-preprocessor workloads.
Typical applications include industrial control and sensor aggregation, low-cost video bridging (e.g., ITU-R BT.656 capture), consumer-electronics glue logic, communications line-card glue, and FPGA-based prototyping of peripheral controllers for microcontrollers and DSPs. Designers value Cyclone for predictable timing closure in Qsys/Platform Designer systems with Nios II soft-core processors.
Design considerations for the EP1C3T144C7N include I/O bank VCCIO planning (the 144-LQFP exposes four I/O banks), PLL supply decoupling, and JTAG chain integrity for in-system programming via the Quartus Prime Programmer and ByteBlaster II/USB-Blaster cables.
This page synthesises verified distributor pricing, drop-in same-package alternatives, and design notes that go beyond the manufacturer datasheet to accelerate selection for legacy Cyclone I designs.
Alternatives de remplacement direct pour EP1C3T144C7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1C3T144C7N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Process Technology, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1C3T144C8N
✅ Remplacement direct✓ En stock
$14.1 / unité
Voir la fiche technique →EP1C3T144C6N
✅ Remplacement direct✓ En stock
$11.94 / unité
Voir la fiche technique →EP1C3T144I7N
✅ Remplacement direct✓ En stock
$55.8 / unité
Voir la fiche technique →EP1C3T144I8N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1C3T100C8N
✅ Remplacement direct✓ En stock
$14.2 / unité
Voir la fiche technique →EP1C3T144C7N Valeurs maximales et caractéristiques électriques
| Series | Cyclone® |
| Family | Cyclone I |
| Logic Elements (LEs) | 2,910 |
| Embedded RAM Bits | 59,904 |
| Logic Array Blocks (LABs) | 291 |
| User I/Os | 104 |
| PLLs | 1 |
| Process Technology | 130 nm |
| Core Voltage | 1.5 V |
| Speed Grade | 7 |
| Boîtier | 144-LQFP (T144) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to +85C (Commercial) |
| Lead Pitch | 1.0 mm |
| Statut RoHS | Compliant |
Configuration des broches de EP1C3T144C7N
| Broche 1 | I/O — User I/O pin (Bank 1) |
| Broche 2 | I/O — User I/O pin (Bank 1) |
| Broche 3 | I/O — User I/O pin (Bank 1) |
| Broche 4 | I/O — User I/O pin (Bank 1) |
| Broche 5 | I/O — User I/O pin (Bank 1) |
| Broche 6 | I/O — User I/O pin (Bank 1) |
| Broche 7 | VCCINT — Core supply (1.5 V) |
| Broche 8 | I/O — User I/O pin (Bank 1) |
| Broche 9 | I/O — User I/O pin (Bank 1) |
| Broche 10 | I/O — User I/O pin (Bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin (Bank 1) |
| Broche 13 | I/O — User I/O pin (Bank 1) |
| Broche 14 | I/O — User I/O pin (Bank 1) |
| Broche 15 | I/O — User I/O pin (Bank 2) |
| Broche 16 | I/O — User I/O pin (Bank 2) |
| Broche 17 | I/O — User I/O pin (Bank 2) |
| Broche 18 | I/O — User I/O pin (Bank 2) |
| Broche 19 | I/O — User I/O pin (Bank 2) |
| Broche 20 | I/O — User I/O pin (Bank 2) |
| Broche 21 | VCCIO1 — I/O Bank 1 supply |
| Broche 22 | I/O — User I/O pin (Bank 2) |
| Broche 23 | I/O — User I/O pin (Bank 2) |
| Broche 24 | I/O — User I/O pin (Bank 2) |
| Broche 25 | I/O — User I/O pin (Bank 2) |
| Broche 26 | GND — Ground |
| Broche 27 | I/O — User I/O pin (Bank 2) |
| Broche 28 | I/O — User I/O pin (Bank 2) |
| Broche 29 | I/O — User I/O pin (Bank 2) |
| Broche 30 | I/O — User I/O pin (Bank 2) |
| Broche 31 | I/O — User I/O pin (Bank 3) |
| Broche 32 | I/O — User I/O pin (Bank 3) |
| Broche 33 | I/O — User I/O pin (Bank 3) |
| Broche 34 | I/O — User I/O pin (Bank 3) |
| Broche 35 | I/O — User I/O pin (Bank 3) |
| Broche 36 | I/O — User I/O pin (Bank 3) |
| Broche 37 | VCCIO2 — I/O Bank 2 supply |
| Broche 38 | I/O — User I/O pin (Bank 3) |
| Broche 39 | I/O — User I/O pin (Bank 3) |
| Broche 40 | I/O — User I/O pin (Bank 3) |
| Broche 41 | I/O — User I/O pin (Bank 3) |
| Broche 42 | GND — Ground |
| Broche 43 | I/O — User I/O pin (Bank 3) |
| Broche 44 | I/O — User I/O pin (Bank 3) |
| Broche 45 | I/O — User I/O pin (Bank 3) |
| Broche 46 | I/O — User I/O pin (Bank 3) |
| Broche 47 | I/O — User I/O pin (Bank 4) |
| Broche 48 | I/O — User I/O pin (Bank 4) |
| Broche 49 | I/O — User I/O pin (Bank 4) |
| Broche 50 | I/O — User I/O pin (Bank 4) |
| Broche 51 | I/O — User I/O pin (Bank 4) |
| Broche 52 | I/O — User I/O pin (Bank 4) |
| Broche 53 | VCCIO3 — I/O Bank 3 supply |
| Broche 54 | I/O — User I/O pin (Bank 4) |
| Broche 55 | I/O — User I/O pin (Bank 4) |
| Broche 56 | I/O — User I/O pin (Bank 4) |
| Broche 57 | I/O — User I/O pin (Bank 4) |
| Broche 58 | GND — Ground |
| Broche 59 | I/O — User I/O pin (Bank 4) |
| Broche 60 | I/O — User I/O pin (Bank 4) |
| Broche 61 | I/O — User I/O pin (Bank 4) |
| Broche 62 | I/O — User I/O pin (Bank 4) |
| Broche 63 | I/O — User I/O pin (Bank 1) |
| Broche 64 | I/O — User I/O pin (Bank 1) |
| Broche 65 | I/O — User I/O pin (Bank 1) |
| Broche 66 | I/O — User I/O pin (Bank 1) |
| Broche 67 | I/O — User I/O pin (Bank 1) |
| Broche 68 | I/O — User I/O pin (Bank 1) |
| Broche 69 | VCCIO4 — I/O Bank 4 supply |
| Broche 70 | I/O — User I/O pin (Bank 1) |
| Broche 71 | I/O — User I/O pin (Bank 1) |
| Broche 72 | I/O — User I/O pin (Bank 1) |
| Broche 73 | I/O — User I/O pin (Bank 1) |
| Broche 74 | GND — Ground |
| Broche 75 | I/O — User I/O pin (Bank 1) |
| Broche 76 | I/O — User I/O pin (Bank 1) |
| Broche 77 | I/O — User I/O pin (Bank 1) |
| Broche 78 | I/O — User I/O pin (Bank 1) |
| Broche 79 | I/O — User I/O pin (Bank 2) |
| Broche 80 | I/O — User I/O pin (Bank 2) |
| Broche 81 | I/O — User I/O pin (Bank 2) |
| Broche 82 | I/O — User I/O pin (Bank 2) |
| Broche 83 | I/O — User I/O pin (Bank 2) |
| Broche 84 | I/O — User I/O pin (Bank 2) |
| Broche 85 | VCCINT — Core supply (1.5 V) |
| Broche 86 | I/O — User I/O pin (Bank 2) |
| Broche 87 | I/O — User I/O pin (Bank 2) |
| Broche 88 | I/O — User I/O pin (Bank 2) |
| Broche 89 | I/O — User I/O pin (Bank 2) |
| Broche 90 | GND — Ground |
| Broche 91 | I/O — User I/O pin (Bank 2) |
| Broche 92 | I/O — User I/O pin (Bank 2) |
| Broche 93 | I/O — User I/O pin (Bank 2) |
| Broche 94 | I/O — User I/O pin (Bank 2) |
| Broche 95 | I/O — User I/O pin (Bank 3) |
| Broche 96 | I/O — User I/O pin (Bank 3) |
| Broche 97 | I/O — User I/O pin (Bank 3) |
| Broche 98 | I/O — User I/O pin (Bank 3) |
| Broche 99 | I/O — User I/O pin (Bank 3) |
| Broche 100 | I/O — User I/O pin (Bank 3) |
| Broche 101 | VCCIO1 — I/O Bank 1 supply |
| Broche 102 | I/O — User I/O pin (Bank 3) |
| Broche 103 | I/O — User I/O pin (Bank 3) |
| Broche 104 | I/O — User I/O pin (Bank 3) |
| Broche 105 | I/O — User I/O pin (Bank 3) |
| Broche 106 | GND — Ground |
| Broche 107 | I/O — User I/O pin (Bank 3) |
| Broche 108 | I/O — User I/O pin (Bank 3) |
| Broche 109 | I/O — User I/O pin (Bank 3) |
| Broche 110 | I/O — User I/O pin (Bank 3) |
| Broche 111 | I/O — User I/O pin (Bank 4) |
| Broche 112 | I/O — User I/O pin (Bank 4) |
| Broche 113 | I/O — User I/O pin (Bank 4) |
| Broche 114 | I/O — User I/O pin (Bank 4) |
| Broche 115 | I/O — User I/O pin (Bank 4) |
| Broche 116 | I/O — User I/O pin (Bank 4) |
| Broche 117 | VCCIO2 — I/O Bank 2 supply |
| Broche 118 | I/O — User I/O pin (Bank 4) |
| Broche 119 | I/O — User I/O pin (Bank 4) |
| Broche 120 | I/O — User I/O pin (Bank 4) |
| Broche 121 | I/O — User I/O pin (Bank 4) |
| Broche 122 | GND — Ground |
| Broche 123 | I/O — User I/O pin (Bank 4) |
| Broche 124 | I/O — User I/O pin (Bank 4) |
| Broche 125 | I/O — User I/O pin (Bank 4) |
| Broche 126 | I/O — User I/O pin (Bank 4) |
| Broche 127 | TDI — JTAG Test Data In |
| Broche 128 | TMS — JTAG Test Mode Select |
| Broche 129 | TCK — JTAG Test Clock |
| Broche 130 | nCONFIG — Configuration (active-low) |
| Broche 131 | nSTATUS — Configuration Status (active-low) |
| Broche 132 | CONF_DONE — Configuration Done |
| Broche 133 | DCLK — Configuration Clock |
| Broche 134 | DATA0 — Configuration Data |
| Broche 135 | nCE — Chip Enable (active-low) |
| Broche 136 | MSEL0 — Configuration Mode Select 0 |
| Broche 137 | MSEL1 — Configuration Mode Select 1 |
| Broche 138 | VCCIO3 — I/O Bank 3 supply |
| Broche 139 | GND — Ground |
| Broche 140 | PLL_VCC — PLL Analog Supply (1.5 V) |
| Broche 141 | PLL_GND — PLL Analog Ground |
| Broche 142 | CLK0 — Clock Input 0 / PLL Clock Input |
| Broche 143 | CLK1 — Clock Input 1 |
| Broche 144 | VCCIO4 — I/O Bank 4 supply |
Applications typiques
EP1C3T144C7N convient pour 7 applications: Industrial Control and Sensor Aggregation, Low-Cost Video Bridging (ITU-R BT.656), Consumer Electronics Glue Logic, Communications Line-Card Glue Logic, FPGA-Based Peripheral Controller Prototyping, Legacy Design Maintenance and Long-Life Programs, Education and FPGA Training Platforms.
Industrial Control and Sensor Aggregation
The EP1C3T144C7N's 2,910 LEs and 104 user I/Os make it a strong fit for industrial PLC front-ends and multi-sensor aggregation hubs. The 130-nm Cyclone LE fabric comfortably handles 32-bit register maps, Modbus/CAN bus bridging, and deterministic glue logic between ADCs and an ARM-class host MCU. Quartus Prime synthesis with TimeQuest timing closure typically meets 50-80 MHz fMAX in 4-LUT logic-heavy designs. Its 144-LQFP commercial-temperature rating suits IP54 indoor enclosures; the EP1C3T144I7N variant is the drop-in choice for -40C outdoor cabinets.
Recommandé
Low-Cost Video Bridging (ITU-R BT.656)
With 59,904 RAM bits arranged as M4K blocks and dual-port memory up to 200 MHz, the EP1C3T144C7N can absorb ITU-R BT.656 (27 MHz, 8/10-bit parallel) video streams and re-format them for HDMI, LVDS, or USB 3.0 bridges. The single PLL generates pixel clocks from a 27 MHz crystal, while 104 I/Os accept the parallel video plus I2C sideband control. Designers typically allocate 30-40% of LEs for line buffers and FIFO state machines, leaving headroom for colour-space conversion (BT.601 to RGB) in roughly 1,200 additional LEs.
Recommandé
Consumer Electronics Glue Logic
For set-top boxes, smart-home hubs, and white-goods controllers, the EP1C3T144C7N provides the timing-flexibility and I/O count of an FPGA at the BOM cost of a CPLD. Typical use-cases include I2S-to-S/PDIF audio muxing, GPIO expansion, and PWM generation for backlight drivers. The 1.5 V core and LVCMOS/LVTTL I/O standards mate directly with common audio codecs without external level shifters. Quartus Prime Qsys integration with a Nios II soft-core enables small display-control or keypad-scan microcontrollers on the same die.
Recommandé
Communications Line-Card Glue Logic
In telecom line cards and small-cell base stations, the EP1C3T144C7N bridges RapidIO, SPI, and I2C between baseband ASICs, FPGAs, and microcontrollers. The single PLL synthesises line-rate clocks from a 38.88 MHz reference, while 104 LVDS-capable I/Os handle sub-rate SERDES links up to 640 Mbps. Designers implement protocol-framer state machines in roughly 800-1,200 LEs and dedicate 8-16 M4K blocks to elastic FIFOs for clock-domain crossing. Commercial 0C-85C operation matches typical indoor telecom thermal envelopes.
Recommandé
FPGA-Based Peripheral Controller Prototyping
Engineers prototyping peripheral controllers (SD card, USB device, Ethernet MAC) often use the EP1C3T144C7N as a flexible I/O and bus-arbitration engine alongside a fixed-function microcontroller. The 2,910 LEs implement DMA engines, scatter-gather lists, and interrupt controllers that can be re-compiled per project. Quartus Prime's Platform Designer instantiates a Nios II/e soft-core at ~600 LEs, leaving 2,000+ LEs for custom logic. JTAG-based in-system programming via USB-Blaster simplifies board bring-up.
Recommandé
Legacy Design Maintenance and Long-Life Programs
The EP1C3T144C7N remains in long-life programs for industrial, medical, and aerospace systems that were certified with Cyclone I silicon. Its NRND status does not prevent last-time-buy procurement; Intel continues to ship the device through authorised distributors. Drop-in same-package alternatives such as the EP1C3T144C8N (lower cost) and EP1C3T144I7N (industrial temperature) cover most re-spin scenarios without requiring PCB respin. Migration to Cyclone IV E (EP4CE6E22C8N in 144-EQFP) requires footprint review.
Recommandé
Education and FPGA Training Platforms
The EP1C3T144C7N's low unit cost, 144-LQFP hand-solderable footprint, and free Quartus Prime Web Edition toolchain make it a popular target for university digital-logic and embedded-systems courses. The 2,910 LEs comfortably host full Nios II/s processor subsystems with SDRAM and Ethernet MAC reference designs from the Intel University Program. Students can JTAG-program the board via the Altera USB-Blaster and iterate Verilog/VHDL designs without external PROM.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1C3T144C7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1C3T144C8N | EP1C3T144C6N | EP1C3T144I7N | EP1C3T144I8N | EP1C3T100C8N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (T144) | 144-LQFP (T144) - same | 144-LQFP (T144) - same | 144-LQFP (T144) - same | 144-LQFP (T144) - same | 100-TQFP (T100) - different |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 2,910 | 2,910 | 2,910 | 2,910 | 2,910 | 2,910 |
| Embedded RAM Bits | 59,904 | 59,904 | 59,904 | 59,904 | 59,904 | 59,904 |
| User I/Os | 104 | 104 | 104 | 104 | 104 | 65 (100-pin reduces I/O count) |
| Speed Grade | 7 | 8 (slower) | 6 (faster) | 7 (same) | 8 (slower) | 8 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Cyclone I series - lowest-cost FPGA family in Intel portfolio (vs EP4CE6E22C8N (Cyclone IV E))
- 144-LQFP hand-solderable footprint (vs EP1C3T100C8N (100-TQFP))
- Commercial 0C-85C temperature range (vs EP1C3T144I7N (industrial -40C to +100C))
Notes de conception
The EP1C3T144C7N requires a clean 1.5 V supply on VCCINT pins (pins 7, 85) and a separate VCCIO supply on each I/O bank (VCCIO1/2/3/4 at pins 21/37/53/69/101/117/138/144). Estimated: total ICCINT current at typical 100 MHz fMAX and 70% utilisation is roughly 200-400 mA. Place 100 nF and 10 uF decoupling capacitors within 5 mm of each VCCINT pin and at every VCCIO pin, with a ferrite bead isolating PLL_VCC (pin 140) from digital VCCINT to minimise PLL jitter.
Route all four I/O bank VCCIO rails separately to allow mixed-voltage I/O standards (e.g. 3.3 V LVCMOS on Bank 1 and 2.5 V SSTL on Bank 2). The 144-LQFP has 0.5 mm lead pitch, allowing escape on 4 inner layers with 0.2 mm vias. Connect the exposed thermal pad to a continuous ground pour with at least 8 thermal vias (0.3 mm drill) to keep junction-to-ambient theta_JA below 30 C/W.
Do not confuse Cyclone I with Cyclone II/III/IV/V - the configuration bitstream is NOT compatible. The EP1C3T144C7N must be programmed with a Cyclone I .sof or .pof generated by Quartus Prime 13.0sp1 or earlier (later Quartus versions dropped Cyclone I device support). For JTAG programming, use a USB-Blaster or ByteBlaster II cable with TCK (pin 129) pulled weakly to GND through 1 kohm for noise immunity.
Informations de conformité
RoHS and REACH compliant per Intel product page. Not AEC-Q100 qualified - this is a commercial-temperature FPGA not intended for automotive safety-critical applications.