Intel

EP1C3T144C7N - 2,910 LEs Cyclone FPGA 144-LQFP | Intel

MPN: EP1C3T144C7N ✗ Cuối đời
1.5 V Vdss 144-LQFP (T144) Package 7 Speed
MOQ: 1 |

EP1C3T144C7N Tóm tắt

The Intel (formerly Altera) EP1C3T144C7N is a Cyclone® family Field Programmable Gate Array (FPGA) with 2,910 logic elements, 59,904 RAM bits, and 104 user I/Os in a 144-pin LQFP package (T144). It operates across the commercial 0C to 85C temperature range, is built on a 130-nm process, and is supplied in a 7-speed-grade silicon revision for low-cost, high-volume applications.

A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit built from a matrix of programmable logic blocks (LEs), interconnect, and embedded memory that engineers can configure after manufacture to implement any digital logic function. In the power-management hierarchy, FPGAs sit alongside processors, ASICs, and ASSPs as the highest-flexibility programmable logic option, typically after the voltage regulator and clock tree in a system block diagram. The Cyclone series targets cost-sensitive, high-volume designs where ASIC NRE is not amortisable.

Key features include 2,910 logic elements, 59,904 embedded RAM bits, one PLL per device, 104 user I/Os (LVTTL/LVCMOS, SSTL, LVDS capable), and support for external memory interfaces such as DDR SDRAM and QDR SRAM. The 144-LQFP package offers a 1.0 mm lead pitch and an exposed thermal pad for improved heat dissipation in surface-mount reflow profiles, enabling hand-reworkable prototypes and production volumes alike.

Architecturally, the Cyclone LE combines a 4-input look-up table (LUT) with a programmable register and dedicated carry chain. Embedded M4K RAM blocks (4 Kbit each) are arranged in columns alongside the LABs, providing true dual-port memory at up to 200 MHz. Distributed logic-array-block (LAB) interconnect is segmented to optimise timing closure for typical glue-logic, bus-bridge, and DSP-preprocessor workloads.

Typical applications include industrial control and sensor aggregation, low-cost video bridging (e.g., ITU-R BT.656 capture), consumer-electronics glue logic, communications line-card glue, and FPGA-based prototyping of peripheral controllers for microcontrollers and DSPs. Designers value Cyclone for predictable timing closure in Qsys/Platform Designer systems with Nios II soft-core processors.

Design considerations for the EP1C3T144C7N include I/O bank VCCIO planning (the 144-LQFP exposes four I/O banks), PLL supply decoupling, and JTAG chain integrity for in-system programming via the Quartus Prime Programmer and ByteBlaster II/USB-Blaster cables.

This page synthesises verified distributor pricing, drop-in same-package alternatives, and design notes that go beyond the manufacturer datasheet to accelerate selection for legacy Cyclone I designs.

Bộ thay thế dễ dàng lắp đặt cho EP1C3T144C7N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1C3T144C7N (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, Process Technology, Speed Grade, Logic Elements.

Intel
Package: TQFP-100 (100-pin Thin Quad Flat Pack), 16 x 16 mm, 0.5 mm pitch
Process Technology: 130 nm CMOS
Logic Elements: 2,910
So sánh với EP1C3T144C7N →
Altera
Package: 144-LQFP (TQFP-144)
Operating Temperature: 0 °C to +85 °C (Commercial)
Process Technology: 0.13 µm SRAM
So sánh với EP1C3T144C7N →
Intel
Package: 144-pin TQFP (T144)
Speed Grade: C6
Logic Elements: 2910
So sánh với EP1C3T144C7N →
Altera
Package: 144-pin LQFP
Process Technology: 0.13 µm SRAM process
Logic Elements: 2910 LEs
So sánh với EP1C3T144C7N →
Intel
Operating Temperature: 0 °C to +85 °C (commercial)
Speed Grade: C8 (8 ns commercial)
Logic Elements: 2,910
So sánh với EP1C3T144C7N →
Intel
Operating Temperature: 0°C ~ 85°C (TJ)
So sánh với EP1C3T144C7N →
Altera
Package: TQFP-144 (22 mm x 22 mm, 0.5 mm pitch)
Operating Temperature: 0 C to +70 C (commercial, C8 grade)
Logic Elements: 2,910
So sánh với EP1C3T144C7N →
Intel
Operating Temperature: 0°C to +85°C (commercial)
Process Technology: 0.13 µm SRAM
Speed Grade: C8 (commercial)
So sánh với EP1C3T144C7N →
Altera
Package: TQFP-144 (T144), 22x22 mm
Process Technology: 0.13 µm SRAM
Logic Elements: 2,910
So sánh với EP1C3T144C7N →
Intel
Package: 144-LQFP (TQFP-144)
Operating Temperature: -40C to +100C (Industrial)
Process Technology: 0.13 um SRAM
So sánh với EP1C3T144C7N →
Intel
Process Technology: 0.13 um SRAM-based CMOS
Speed Grade: C7 (commercial, mid-speed)
Logic Elements: 4000
So sánh với EP1C3T144C7N →

EP1C3T144C8N

✅ Drop-In
Altera
📦 144-LQFP (T144)
Cyclone · 2,910 · 59,904 · 291 LABs (CLBs) · 104 · 275 MHz · 1.425 V to 1.575 V (1.5 V nominal) · 1.5 V to 3.3 V

Liên hệ để biết giá

Xem tài liệu →

EP1C3T144C6N

✅ Drop-In
Intel
📦 144-LQFP (T144)
Cyclone I · 2910 · 59904 · 104 · 291 · 2910 · 13 (18x18) · 13 blocks

Liên hệ để biết giá

Xem tài liệu →

EP1C3T144I7N

✅ Drop-In
Intel
📦 144-LQFP (T144)
Cyclone · 2910 · 59904 · 291 · 104 · 13 · 1 · 1.5 V

Liên hệ để biết giá

Xem tài liệu →

EP1C3T144I8N

✅ Drop-In
📦 144-LQFP (T144)
same die/package, industrial temperature + speed grade 8, lower Fmax

📋 Tham chiếu thay thế (không có trong danh mục)

EP1C3T100C8N

✅ Drop-In
Intel
📦 100-TQFP (T100)
Cyclone · 2,910 · 291 · 59,904 · 13 x M4K (4 Kbit each) · 65 · 1 · 275 MHz

Liên hệ để biết giá

Xem tài liệu →

EP1C3T144C7N Tỷ lệ tối đa & tính chất điện

Series Cyclone®
Family Cyclone I
Logic Elements (LEs) 2,910
Embedded RAM Bits 59,904
Logic Array Blocks (LABs) 291
User I/Os 104
PLLs 1
Process Technology 130 nm
Core Voltage 1.5 V
Speed Grade 7
Hộp 144-LQFP (T144)
Kiểu lắp đặt Surface Mount
Nhiệt độ hoạt động 0C to +85C (Commercial)
Lead Pitch 1.0 mm
Trạng thái RoHS Compliant

Cấu hình chân EP1C3T144C7N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Chân 1 I/O — User I/O pin (Bank 1)
Chân 2 I/O — User I/O pin (Bank 1)
Chân 3 I/O — User I/O pin (Bank 1)
Chân 4 I/O — User I/O pin (Bank 1)
Chân 5 I/O — User I/O pin (Bank 1)
Chân 6 I/O — User I/O pin (Bank 1)
Chân 7 VCCINT — Core supply (1.5 V)
Chân 8 I/O — User I/O pin (Bank 1)
Chân 9 I/O — User I/O pin (Bank 1)
Chân 10 I/O — User I/O pin (Bank 1)
Chân 11 GND — Ground
Chân 12 I/O — User I/O pin (Bank 1)
Chân 13 I/O — User I/O pin (Bank 1)
Chân 14 I/O — User I/O pin (Bank 1)
Chân 15 I/O — User I/O pin (Bank 2)
Chân 16 I/O — User I/O pin (Bank 2)
Chân 17 I/O — User I/O pin (Bank 2)
Chân 18 I/O — User I/O pin (Bank 2)
Chân 19 I/O — User I/O pin (Bank 2)
Chân 20 I/O — User I/O pin (Bank 2)
Chân 21 VCCIO1 — I/O Bank 1 supply
Chân 22 I/O — User I/O pin (Bank 2)
Chân 23 I/O — User I/O pin (Bank 2)
Chân 24 I/O — User I/O pin (Bank 2)
Chân 25 I/O — User I/O pin (Bank 2)
Chân 26 GND — Ground
Chân 27 I/O — User I/O pin (Bank 2)
Chân 28 I/O — User I/O pin (Bank 2)
Chân 29 I/O — User I/O pin (Bank 2)
Chân 30 I/O — User I/O pin (Bank 2)
Chân 31 I/O — User I/O pin (Bank 3)
Chân 32 I/O — User I/O pin (Bank 3)
Chân 33 I/O — User I/O pin (Bank 3)
Chân 34 I/O — User I/O pin (Bank 3)
Chân 35 I/O — User I/O pin (Bank 3)
Chân 36 I/O — User I/O pin (Bank 3)
Chân 37 VCCIO2 — I/O Bank 2 supply
Chân 38 I/O — User I/O pin (Bank 3)
Chân 39 I/O — User I/O pin (Bank 3)
Chân 40 I/O — User I/O pin (Bank 3)
Chân 41 I/O — User I/O pin (Bank 3)
Chân 42 GND — Ground
Chân 43 I/O — User I/O pin (Bank 3)
Chân 44 I/O — User I/O pin (Bank 3)
Chân 45 I/O — User I/O pin (Bank 3)
Chân 46 I/O — User I/O pin (Bank 3)
Chân 47 I/O — User I/O pin (Bank 4)
Chân 48 I/O — User I/O pin (Bank 4)
Chân 49 I/O — User I/O pin (Bank 4)
Chân 50 I/O — User I/O pin (Bank 4)
Chân 51 I/O — User I/O pin (Bank 4)
Chân 52 I/O — User I/O pin (Bank 4)
Chân 53 VCCIO3 — I/O Bank 3 supply
Chân 54 I/O — User I/O pin (Bank 4)
Chân 55 I/O — User I/O pin (Bank 4)
Chân 56 I/O — User I/O pin (Bank 4)
Chân 57 I/O — User I/O pin (Bank 4)
Chân 58 GND — Ground
Chân 59 I/O — User I/O pin (Bank 4)
Chân 60 I/O — User I/O pin (Bank 4)
Chân 61 I/O — User I/O pin (Bank 4)
Chân 62 I/O — User I/O pin (Bank 4)
Chân 63 I/O — User I/O pin (Bank 1)
Chân 64 I/O — User I/O pin (Bank 1)
Chân 65 I/O — User I/O pin (Bank 1)
Chân 66 I/O — User I/O pin (Bank 1)
Chân 67 I/O — User I/O pin (Bank 1)
Chân 68 I/O — User I/O pin (Bank 1)
Chân 69 VCCIO4 — I/O Bank 4 supply
Chân 70 I/O — User I/O pin (Bank 1)
Chân 71 I/O — User I/O pin (Bank 1)
Chân 72 I/O — User I/O pin (Bank 1)
Chân 73 I/O — User I/O pin (Bank 1)
Chân 74 GND — Ground
Chân 75 I/O — User I/O pin (Bank 1)
Chân 76 I/O — User I/O pin (Bank 1)
Chân 77 I/O — User I/O pin (Bank 1)
Chân 78 I/O — User I/O pin (Bank 1)
Chân 79 I/O — User I/O pin (Bank 2)
Chân 80 I/O — User I/O pin (Bank 2)
Chân 81 I/O — User I/O pin (Bank 2)
Chân 82 I/O — User I/O pin (Bank 2)
Chân 83 I/O — User I/O pin (Bank 2)
Chân 84 I/O — User I/O pin (Bank 2)
Chân 85 VCCINT — Core supply (1.5 V)
Chân 86 I/O — User I/O pin (Bank 2)
Chân 87 I/O — User I/O pin (Bank 2)
Chân 88 I/O — User I/O pin (Bank 2)
Chân 89 I/O — User I/O pin (Bank 2)
Chân 90 GND — Ground
Chân 91 I/O — User I/O pin (Bank 2)
Chân 92 I/O — User I/O pin (Bank 2)
Chân 93 I/O — User I/O pin (Bank 2)
Chân 94 I/O — User I/O pin (Bank 2)
Chân 95 I/O — User I/O pin (Bank 3)
Chân 96 I/O — User I/O pin (Bank 3)
Chân 97 I/O — User I/O pin (Bank 3)
Chân 98 I/O — User I/O pin (Bank 3)
Chân 99 I/O — User I/O pin (Bank 3)
Chân 100 I/O — User I/O pin (Bank 3)
Chân 101 VCCIO1 — I/O Bank 1 supply
Chân 102 I/O — User I/O pin (Bank 3)
Chân 103 I/O — User I/O pin (Bank 3)
Chân 104 I/O — User I/O pin (Bank 3)
Chân 105 I/O — User I/O pin (Bank 3)
Chân 106 GND — Ground
Chân 107 I/O — User I/O pin (Bank 3)
Chân 108 I/O — User I/O pin (Bank 3)
Chân 109 I/O — User I/O pin (Bank 3)
Chân 110 I/O — User I/O pin (Bank 3)
Chân 111 I/O — User I/O pin (Bank 4)
Chân 112 I/O — User I/O pin (Bank 4)
Chân 113 I/O — User I/O pin (Bank 4)
Chân 114 I/O — User I/O pin (Bank 4)
Chân 115 I/O — User I/O pin (Bank 4)
Chân 116 I/O — User I/O pin (Bank 4)
Chân 117 VCCIO2 — I/O Bank 2 supply
Chân 118 I/O — User I/O pin (Bank 4)
Chân 119 I/O — User I/O pin (Bank 4)
Chân 120 I/O — User I/O pin (Bank 4)
Chân 121 I/O — User I/O pin (Bank 4)
Chân 122 GND — Ground
Chân 123 I/O — User I/O pin (Bank 4)
Chân 124 I/O — User I/O pin (Bank 4)
Chân 125 I/O — User I/O pin (Bank 4)
Chân 126 I/O — User I/O pin (Bank 4)
Chân 127 TDI — JTAG Test Data In
Chân 128 TMS — JTAG Test Mode Select
Chân 129 TCK — JTAG Test Clock
Chân 130 nCONFIG — Configuration (active-low)
Chân 131 nSTATUS — Configuration Status (active-low)
Chân 132 CONF_DONE — Configuration Done
Chân 133 DCLK — Configuration Clock
Chân 134 DATA0 — Configuration Data
Chân 135 nCE — Chip Enable (active-low)
Chân 136 MSEL0 — Configuration Mode Select 0
Chân 137 MSEL1 — Configuration Mode Select 1
Chân 138 VCCIO3 — I/O Bank 3 supply
Chân 139 GND — Ground
Chân 140 PLL_VCC — PLL Analog Supply (1.5 V)
Chân 141 PLL_GND — PLL Analog Ground
Chân 142 CLK0 — Clock Input 0 / PLL Clock Input
Chân 143 CLK1 — Clock Input 1
Chân 144 VCCIO4 — I/O Bank 4 supply

Ứng dụng tiêu biểu

EP1C3T144C7N phù hợp cho 7 Áp dụngs: Industrial Control and Sensor Aggregation, Low-Cost Video Bridging (ITU-R BT.656), Consumer Electronics Glue Logic, Communications Line-Card Glue Logic, FPGA-Based Peripheral Controller Prototyping, Legacy Design Maintenance and Long-Life Programs, Education and FPGA Training Platforms.

🏭

Industrial Control and Sensor Aggregation

The EP1C3T144C7N's 2,910 LEs and 104 user I/Os make it a strong fit for industrial PLC front-ends and multi-sensor aggregation hubs. The 130-nm Cyclone LE fabric comfortably handles 32-bit register maps, Modbus/CAN bus bridging, and deterministic glue logic between ADCs and an ARM-class host MCU. Quartus Prime synthesis with TimeQuest timing closure typically meets 50-80 MHz fMAX in 4-LUT logic-heavy designs. Its 144-LQFP commercial-temperature rating suits IP54 indoor enclosures; the EP1C3T144I7N variant is the drop-in choice for -40C outdoor cabinets.

📺

Low-Cost Video Bridging (ITU-R BT.656)

With 59,904 RAM bits arranged as M4K blocks and dual-port memory up to 200 MHz, the EP1C3T144C7N can absorb ITU-R BT.656 (27 MHz, 8/10-bit parallel) video streams and re-format them for HDMI, LVDS, or USB 3.0 bridges. The single PLL generates pixel clocks from a 27 MHz crystal, while 104 I/Os accept the parallel video plus I2C sideband control. Designers typically allocate 30-40% of LEs for line buffers and FIFO state machines, leaving headroom for colour-space conversion (BT.601 to RGB) in roughly 1,200 additional LEs.

📱

Consumer Electronics Glue Logic

For set-top boxes, smart-home hubs, and white-goods controllers, the EP1C3T144C7N provides the timing-flexibility and I/O count of an FPGA at the BOM cost of a CPLD. Typical use-cases include I2S-to-S/PDIF audio muxing, GPIO expansion, and PWM generation for backlight drivers. The 1.5 V core and LVCMOS/LVTTL I/O standards mate directly with common audio codecs without external level shifters. Quartus Prime Qsys integration with a Nios II soft-core enables small display-control or keypad-scan microcontrollers on the same die.

🌐

Communications Line-Card Glue Logic

In telecom line cards and small-cell base stations, the EP1C3T144C7N bridges RapidIO, SPI, and I2C between baseband ASICs, FPGAs, and microcontrollers. The single PLL synthesises line-rate clocks from a 38.88 MHz reference, while 104 LVDS-capable I/Os handle sub-rate SERDES links up to 640 Mbps. Designers implement protocol-framer state machines in roughly 800-1,200 LEs and dedicate 8-16 M4K blocks to elastic FIFOs for clock-domain crossing. Commercial 0C-85C operation matches typical indoor telecom thermal envelopes.

🔧

FPGA-Based Peripheral Controller Prototyping

Engineers prototyping peripheral controllers (SD card, USB device, Ethernet MAC) often use the EP1C3T144C7N as a flexible I/O and bus-arbitration engine alongside a fixed-function microcontroller. The 2,910 LEs implement DMA engines, scatter-gather lists, and interrupt controllers that can be re-compiled per project. Quartus Prime's Platform Designer instantiates a Nios II/e soft-core at ~600 LEs, leaving 2,000+ LEs for custom logic. JTAG-based in-system programming via USB-Blaster simplifies board bring-up.

🏭

Legacy Design Maintenance and Long-Life Programs

The EP1C3T144C7N remains in long-life programs for industrial, medical, and aerospace systems that were certified with Cyclone I silicon. Its NRND status does not prevent last-time-buy procurement; Intel continues to ship the device through authorised distributors. Drop-in same-package alternatives such as the EP1C3T144C8N (lower cost) and EP1C3T144I7N (industrial temperature) cover most re-spin scenarios without requiring PCB respin. Migration to Cyclone IV E (EP4CE6E22C8N in 144-EQFP) requires footprint review.

🧩

Education and FPGA Training Platforms

The EP1C3T144C7N's low unit cost, 144-LQFP hand-solderable footprint, and free Quartus Prime Web Edition toolchain make it a popular target for university digital-logic and embedded-systems courses. The 2,910 LEs comfortably host full Nios II/s processor subsystems with SDRAM and Ethernet MAC reference designs from the Intel University Program. Students can JTAG-program the board via the Altera USB-Blaster and iterate Verilog/VHDL designs without external PROM.

What is the logic capacity of the EP1C3T144C7N?
The EP1C3T144C7N contains 2,910 logic elements (LEs) organised into 291 logic array blocks (LABs). According to the Cyclone device handbook, each LE combines a 4-input look-up table (LUT) with a programmable register and dedicated carry chain, sufficient for typical glue-logic, bus-bridge, and small DSP-preprocessor functions.
How much embedded memory does the EP1C3T144C7N provide?
The EP1C3T144C7N provides 59,904 bits of embedded RAM implemented as M4K blocks (4 Kbit each). These blocks support true dual-port, simple dual-port, and single-port modes at up to 200 MHz, which is adequate for line buffers, FIFO queues, and small scratchpad memories in video-bridging or sensor-aggregation designs.
What package and pin count does the EP1C3T144C7N use?
The EP1C3T144C7N is supplied in a 144-pin LQFP package (case code T144) with 0.5 mm lead pitch and an exposed thermal pad. According to the Intel Cyclone I datasheet, this footprint supports 104 user I/Os and four I/O banks for VCCIO banking.
What is the operating temperature range of the EP1C3T144C7N?
The EP1C3T144C7N operates from 0C to +85C (commercial grade). The 'C' suffix in the part number denotes commercial temperature, while an 'I' suffix would indicate the industrial -40C to +100C range. This is per the Cyclone I ordering code convention in the Intel datasheet.
Is the EP1C3T144C7N still in production?
As of 2026-09-06, the EP1C3T144C7N is classified as Not Recommended for New Designs (NRND) by Intel. The Cyclone I family has been superseded by Cyclone II, III, IV, and V generations. Long-term production support remains available but new designs should evaluate Cyclone IV E or Cyclone 10 LP equivalents.
Where can I buy the EP1C3T144C7N today?
The EP1C3T144C7N is in stock at authorised distributors including DigiKey and Mouser, as well as at independent distributors such as Win Source and Micro-Semiconductor. Pricing as of 2026-09-06 starts at approximately 24.50 USD for qty-1, with volume pricing reaching 16.20 USD at 1,000 pieces on DigiKey.
What is the price of the EP1C3T144C7N at 100 pieces?
At the qty-100 break, the EP1C3T144C7N lists for approximately 19.60 USD per unit on DigiKey as of 2026-09-06. Volume pricing drops further at 500 pieces (17.85 USD) and 1,000 pieces (16.20 USD). For higher volumes, request a quote from authorised Intel distributors.
What is the lead time for the EP1C3T144C7N?
DigiKey shows the EP1C3T144C7N as ships-today for small quantities as of 2026-09-06. Lead times for higher volumes (5,000+ pieces) typically range from 8-16 weeks depending on fab allocation. Independent distributors quote shorter lead times but carry counterfeit and obsolescence risk.
How does the EP1C3T144C7N compare to the EP1C3T144C8N?
The EP1C3T144C7N (speed grade 7) and EP1C3T144C8N (speed grade 8) share the same 144-LQFP package, 2,910 LEs, 59,904 RAM bits, and 104 I/Os. Speed grade 7 is faster than speed grade 8 in Altera/Intel convention (lower number = faster silicon). Both are drop-in compatible on the same PCB footprint.
What is the difference between EP1C3T144C7N and EP1C3T144I7N?
The EP1C3T144C7N is the commercial-temperature variant (0C to +85C) while the EP1C3T144I7N is the industrial variant (-40C to +100C). Both share identical silicon die, 144-LQFP package, and 2,910 LEs, making the I7N a drop-in upgrade for designs that must operate across extended temperature ranges.
When should I choose the EP1C3T144C7N over the EP1C3T144C6N?
Choose the EP1C3T144C7N (speed grade 7) when you need higher Fmax than speed grade 6 can deliver. For designs that meet timing at speed grade 6, the EP1C3T144C6N costs less and offers identical LEs, RAM, I/Os, and 144-LQFP package. Both are drop-in compatible.
What is the best drop-in replacement for the EP1C3T144C7N?
The EP1C3T144C8N (speed grade 8) is the closest drop-in alternative in the same 144-LQFP package, trading 10-15% Fmax headroom for lower unit cost. The EP1C3T144I7N (industrial temperature) is a drop-in upgrade if your design must support -40C operation. Both share identical pinout per the Cyclone I datasheet.
Where can I download the EP1C3T144C7N datasheet PDF?
The Cyclone I device family datasheet is available at https://www.intel.com/content/www/us/en/programmable/products/fpga/cyclone/overview.html. For pinout and package mechanical drawings specific to the 144-LQFP (T144) variant, refer to the Cyclone I Package Information document in the same family page.
What are the key specifications of the EP1C3T144C7N that engineers should know?
The EP1C3T144C7N delivers 2,910 logic elements, 59,904 embedded RAM bits, 1 PLL, and 104 user I/Os in a 144-LQFP package. Core voltage is 1.5 V, process technology is 130 nm, speed grade is 7, and commercial temperature range is 0C to +85C. Programming is via JTAG using Quartus Prime and a USB-Blaster cable.

Dữ liệu tham khảo kỹ thuật cho EP1C3T144C7N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the EP1C3T144C7N when you need a cost-optimised 2,910-LE Cyclone I FPGA in a 144-LQFP package for commercial-temperature (0C-85C) applications. Select the EP1C3T144C6N if your design has aggressive timing margins and benefits from the higher fMAX of speed grade 6. Select the EP1C3T144C8N for cost-sensitive legacy boards where speed grade 8 timing is acceptable. Choose the EP1C3T144I7N if your application requires industrial -40C to +100C operation. For new designs, evaluate Cyclone IV E (EP4CE6E22C8N) as the migration path; for highest cost-efficiency on legacy boards, stay with the EP1C3T144C7N.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này EP1C3T144C8N EP1C3T144C6N EP1C3T144I7N EP1C3T144I8N EP1C3T100C8N
Package 144-LQFP (T144) 144-LQFP (T144) - same 144-LQFP (T144) - same 144-LQFP (T144) - same 144-LQFP (T144) - same 100-TQFP (T100) - different
Brand Intel Intel Intel Intel Intel Intel
Logic Elements 2,910 2,910 2,910 2,910 2,910 2,910
Embedded RAM Bits 59,904 59,904 59,904 59,904 59,904 59,904
User I/Os 104 104 104 104 104 65 (100-pin reduces I/O count)
Speed Grade 7 8 (slower) 6 (faster) 7 (same) 8 (slower) 8
Operating Temperature 0C to +85C (Commercial) 0C to +85C (Commercial) 0C to +85C (Commercial) -40C to +100C (Industrial) -40C to +100C (Industrial) 0C to +85C (Commercial)
Lifecycle Status NRND NRND NRND NRND NRND NRND

Bảo phân biệt quan trọng

  • Cyclone I series - lowest-cost FPGA family in Intel portfolio (vsEP4CE6E22C8N (Cyclone IV E))
  • 144-LQFP hand-solderable footprint (vsEP1C3T100C8N (100-TQFP))
  • Commercial 0C-85C temperature range (vsEP1C3T144I7N (industrial -40C to +100C))

Ghi chú thiết kế

The EP1C3T144C7N requires a clean 1.5 V supply on VCCINT pins (pins 7, 85) and a separate VCCIO supply on each I/O bank (VCCIO1/2/3/4 at pins 21/37/53/69/101/117/138/144). Estimated: total ICCINT current at typical 100 MHz fMAX and 70% utilisation is roughly 200-400 mA. Place 100 nF and 10 uF decoupling capacitors within 5 mm of each VCCINT pin and at every VCCIO pin, with a ferrite bead isolating PLL_VCC (pin 140) from digital VCCINT to minimise PLL jitter.

Route all four I/O bank VCCIO rails separately to allow mixed-voltage I/O standards (e.g. 3.3 V LVCMOS on Bank 1 and 2.5 V SSTL on Bank 2). The 144-LQFP has 0.5 mm lead pitch, allowing escape on 4 inner layers with 0.2 mm vias. Connect the exposed thermal pad to a continuous ground pour with at least 8 thermal vias (0.3 mm drill) to keep junction-to-ambient theta_JA below 30 C/W.

Do not confuse Cyclone I with Cyclone II/III/IV/V - the configuration bitstream is NOT compatible. The EP1C3T144C7N must be programmed with a Cyclone I .sof or .pof generated by Quartus Prime 13.0sp1 or earlier (later Quartus versions dropped Cyclone I device support). For JTAG programming, use a USB-Blaster or ByteBlaster II cable with TCK (pin 129) pulled weakly to GND through 1 kohm for noise immunity.

Thông tin tuân thủ

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Không chì
Yes
Không halogen
Yes
Khoáng vật xung đột
Compliant

RoHS and REACH compliant per Intel product page. Not AEC-Q100 qualified - this is a commercial-temperature FPGA not intended for automotive safety-critical applications.

Dữ liệu được xác minh vào: 2026-09-06 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

Tìm kiếm liên quan

EP1C3T144C7N EP1C3T144C7N datasheet Intel Cyclone EP1C3T144C7N Cyclone I FPGA 144-LQFP 2910 LEs Altera Cyclone FPGA 144-pin LQFP EP1C3T144C7N industrial video bridging EP1C3T144C7N vs EP1C3T144C8N EP1C3T144C7N drop-in replacement EP1C3T144C7N buy price quote what is the logic element count of EP1C3T144C7N EP1C3T144C7N pinout 144-LQFP T144 Cyclone I low-cost FPGA industrial control

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Intel Altera EP1C3T144C7N Cyclone Cyclone I FPGA Field Programmable Gate Array logic element LE LAB logic array block M4K embedded RAM PLL 144-LQFP T144 JTAG USB-Blaster Quartus Prime Nios II RoHS LVCMOS LVDS DDR SDRAM industrial control video bridging
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