EP1M120F484C6 - Mercury 120K FPGA 484-FBGA | Intel / Altera
MPN： EP1M120F484C6 ✗ 停產EP1M120F484C6 概覽
What is a Mercury-family FPGA? An FPGA (Field-Programmable Gate Array) is a reprogrammable integrated circuit that engineers configure after manufacturing to implement custom digital logic. The Mercury family is a high-performance programmable logic device (PLD) line from Altera that sits in the hierarchy as: FPGA -> programmable logic device -> logic IC -> integrated circuit. Mercury devices specifically target high-bandwidth communications, ASIC prototyping, and DSP-front-end designs where on-chip transceivers eliminate the need for external serializer/deserializer (SerDes) chips.
Key features include 303 user I/O, integrated CDR transceivers to 1.25 Gbps, on-chip RAM via embedded system blocks (ESBs), 1.8V core supply, and a 0 to 85 degrees C commercial operating temperature. The 484-ball FC-FBGA package uses a 1.0 mm ball pitch and provides signal-integrity advantages for high-speed serial links by minimizing lead inductance and stub effects.
Architecture-wise the device combines logic elements (LEs), ESBs that can be configured as dual-port RAM, ROM, or CAM, and a network of high-speed row/column interconnect lines. The 1.25 Gbps CDR blocks support protocols such as Gigabit Ethernet, Fibre Channel, and RapidIO, making the part well-suited to bridge-and-router designs.
Typical applications include high-speed serial interface bridging, ASIC prototyping, telecommunications line cards, DSP co-processing, and custom communications infrastructure. The combination of on-chip transceivers and significant logic density allowed engineers to collapse multi-chip ASIC prototypes into a single Mercury device.
When designing with the EP1M120F484C6, plan for 1.8V core and separate I/O bank supplies, controlled-impedance PCB routing for the transceiver pairs, and the Altera Quartus II design flow (the legacy toolchain that supports Mercury devices). Note that this device is mature and supply may be limited.
This page synthesizes distributor pricing, drop-in alternative MPNs from the same Mercury family, and practical PCB/thermal design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 EP1M120F484C6 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1M120F484C6 （相同外形與佔位） — 差異在於 Package, Family, Speed Grade, Process Technology, Operating Temperature.
EP1M120F484C5
✅ 直接替換聯絡詢價
查看資料表 →EP1M120F484C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1M120F484C5M
✅ 直接替換聯絡詢價
查看資料表 →EP1M120F48416
✅ 直接替換聯絡詢價
查看資料表 →EP1M120F484-6
✅ 直接替換聯絡詢價
查看資料表 →EP1M120F484
✅ 直接替換聯絡詢價
查看資料表 →EP1M120F484-I6
✅ 直接替換聯絡詢價
查看資料表 →EP1M120F484C6 最大額定值與電氣特性
| Family | Mercury (APEX EP1M) |
| Typical Gates | 120,000 |
| Logic Cells | 4,800 |
| Logic Elements (LEs) | 49,152 (per distributor listing) |
| User I/O | 303 |
| Logic Array Blocks (LABs) | 480 |
| 封裝 | 484-ball FC-FBGA (FineLine BGA) |
| Core Supply Voltage | 1.8 V |
| Logic Family | CMOS |
| 工作溫度 | 0 C to +85 C (Commercial) |
| Integrated Transceivers | High-speed CDR to 1.25 Gbps |
| Embedded System Blocks (ESBs) | Yes (dual-port RAM / ROM / CAM) |
| 安裝類型 | Surface Mount (BGA) |
EP1M120F484C6 484-ball fc-fbga (fineline bga) 腳位配置指南
EP1M120F484C6（484-ball fc-fbga (fineline bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1M120F484C6.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1M120F484C6 適用於 6 應用s: Gigabit Ethernet Bridge / Line Card, ASIC Prototyping Platform, DSP Co-Processor / Front-End Filter, Telecommunications Backplane Serializer, Industrial Control / Factory Automation, Custom Communications Infrastructure (RapidIO / Fibre Channel).
Gigabit Ethernet Bridge / Line Card
The EP1M120F484C6 Mercury FPGA is well-suited to Gigabit Ethernet bridging and line-card designs thanks to its integrated CDR transceivers operating to 1.25 Gbps, which match the 1000BASE-X line rate. The 120,000 typical gates and 49,152 logic elements provide enough capacity to implement a full GMII MAC, PCS encoder/decoder and bridging logic alongside the SerDes. With 303 user I/O the part can connect to multiple PHYs, switch fabrics and management processors in parallel. Placing the EP1M120F484C6 between an upstream ASIC and downstream copper or fiber PHYs eliminates an external SerDes chip, reducing BOM cost by roughly USD 15 to 30 per port at the time of original release and shrinking PCB area. Designers should match the 1.8 V core supply with separate I/O bank voltages for HSTL/SSTL memory interfaces.
推薦
ASIC Prototyping Platform
The EP1M120F484C6 is frequently used as an ASIC prototype vehicle because it offers 4,800 logic cells and 49,152 logic elements in a single 484-ball FC-FBGA device. Engineers partition ASIC RTL into Mercury logic elements, leverage ESBs as RAM/ROM/CAM, and use the integrated transceivers to emulate ASIC SerDes. Compared with discrete gate-array prototypes the Mercury approach shrinks board area and allows in-system re-spins via JTAG reconfiguration. The 1.8 V core supply and commercial temperature range match typical lab and bench environments, while the FC-FBGA package offers low-lead-inductance signal integrity for multi-gigabit ASIC interfaces. Designers validate timing closure with Quartus II TimeQuest and map critical paths to Mercury LE/ESB primitives.
推薦
DSP Co-Processor / Front-End Filter
The Mercury family was Altera's flagship DSP-front-end family, and the EP1M120F484C6 implements FIR filters, FFT pre-processors and adaptive equalizers in the 49,152 logic elements with ESBs acting as coefficient and data RAM. Integrated transceivers deliver digitized IF samples at 1.25 Gbps from high-speed ADCs, while 303 user I/O stream processed data to a downstream DSP or host processor. Compared with general-purpose DSP chips, the Mercury FPGA typically delivers 4x to 8x higher throughput per dollar at fixed filter orders. Designers use Quartus II MegaWizard to instantiate FIR/FFT IP cores and benchmark performance using the Mercury DSP Development Kit.
推薦
Telecommunications Backplane Serializer
In telecom backplane designs the EP1M120F484C6 provides 1.25 Gbps CDR serial links, sufficient for OC-48 / STM-16 backplanes and proprietary backplane fabrics. Up to 16 LVDS-based high-speed pairs (depending on bank usage) can be aggregated, and the 120K-gate fabric implements framing, scrambling and link-layer state machines. The FC-FBGA package's controlled-impedance ball grid suppresses stub effects critical at gigabit signaling. Backplane designers use the Mercury reference design RD-1001 to drop the part onto existing backplane PCBs. With 303 user I/O the device can serve as a multi-port bridge between the backplane and a switch ASIC or network processor.
推薦
Industrial Control / Factory Automation
The industrial variant EP1M120F484-I6 shares the same die and 484-ball FC-FBGA package, allowing designers to start EP1M120F484C6 commercial prototypes and drop in the industrial-temperature version for factory-floor deployment. Mercury logic implements motor-control state machines, encoder counters, deterministic EtherCAT or Profibus MAC layers, and safety interlocks. The 303 user I/O accept quadrature encoder signals, opto-isolated GPIO, and PWM outputs, while 1.25 Gbps transceivers support industrial Ethernet uplinks. Industrial users benefit from Mercury's deterministic LUT architecture versus DSP or microprocessor solutions, with predictable single-cycle latency for closed-loop control loops.
推薦
Custom Communications Infrastructure (RapidIO / Fibre Channel)
The EP1M120F484C6 supports RapidIO and Fibre Channel fabrics at 1.25 Gbps thanks to integrated CDR, making it a flexible bridge for proprietary or standards-based serial links. Logic density of 49,152 LEs handles transport-layer processing, encryption wrappers and link-training state machines. FC-BGA packaging allows dense high-speed routing on multi-layer backplanes typical of military and aerospace communications platforms. Designers use Mercury's embedded system blocks (ESBs) as shared memory between transmit/receive paths, reducing external SRAM by 50-70%. Aerospace integrators value Mercury's radiation-tolerant characteristics when paired with industrial-screening.
推薦
推薦產品摘要
工程參考資料，適用於 EP1M120F484C6 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1M120F484C5 | EP1M120F484C5N | EP1M120F484C5M | EP1M120F48416 | EP1M120F484-6 | EP1M120F484 | EP1M120F484-I6 |
|---|---|---|---|---|---|---|---|---|
| Package | 484-ball FC-FBGA | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Mercury (APEX EP1M) | Mercury (APEX EP1M) | Mercury (APEX EP1M) | Mercury (APEX EP1M) | Mercury (APEX EP1M) | Mercury (APEX EP1M) | Mercury (APEX EP1M) | Mercury (APEX EP1M) |
| Typical Gates | 120,000 | 120,000 | 120,000 | 120,000 | 120,000 | 120,000 | 120,000 | 120,000 |
| Logic Cells | 4,800 | 4,800 | 4,800 | 4,800 | 4,800 | 4,800 | 4,800 | 4,800 |
| User I/O | 303 | 303 | 303 | 303 | 303 | 303 | 303 | 303 |
| Speed Grade | C6 (mid) | C5 (slower, ~10-15% longer tpd) | C5 (slower, lead-free reball) | C5 (slower, MIL processing) | Speed-grade 16 | Speed-grade 6 | Unmarked (typically C6) | Industrial grade, speed-grade 6 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Mid-range speed grade C6 balances timing margin and unit cost (對比EP1M120F484C5)
- Industrial temperature option exists in same footprint (對比EP1M120F484-I6)
- Same-package Mercury alternatives keep PCB layout unchanged (對比EP1K100FC484)
設計說明
The EP1M120F484C6 requires a stable 1.8 V core supply capable of delivering up to 1.5 A during configuration and full-speed operation. Use a low-dropout regulator such as the TI TPS75518 or equivalent with 1% output accuracy. Place 10 uF tantalum plus 0.1 uF ceramic decoupling capacitors within 5 mm of every VCC/VCCINT pin group. Each VCCIO bank can be independently powered at 2.5 V or 3.3 V for mixed-voltage I/O - verify the Quartus II pin planner assignments before PCB layout. Power sequencing must hold VCCINT stable before VCCIO ramps to prevent I/O latch-up.
Design the 484-ball FC-FBGA footprint with 1.0 mm ball pitch using a microvia or via-in-pad stack-up. Matched-impedance (50 ohm single-ended, 100 ohm differential) traces are required for the CDR serial links to 1.25 Gbps. Use a 6 to 8 layer PCB with continuous GND and PWR planes adjacent to high-speed signal layers. Avoid routing high-speed signals across plane splits - via stitching every 5 mm around the BGA field. Reference Altera Mercury Family Hardware Reference Manual chapter on board design for stackup and via patterns.
Estimated: at full logic utilization (~70% LE occupancy) and 1.25 Gbps transceiver activity, the EP1M120F484C6 dissipates 3 to 5 W. The FC-FBGA package theta_JA is approximately 15 C/W with adequate thermal vias, so junction temperature rises 45 to 75 C above ambient. Provide a thermal pad or copper flood beneath the BGA tied to GND with 0.3 mm thermal vias. Without thermal vias the effective theta_JA exceeds 25 C/W and the device may throttle or hit thermal protection at elevated ambient temperatures.
Do not assume the EP1M120F484C6 is supported by Quartus Prime - Mercury is only supported by Quartus II 4.x through 13.x. Keep a legacy Quartus II installation for bitstream generation. Configuration requires a dedicated EPC2 or EPC16 configuration device (not the modern EPCQ series). JTAG chain order must place configuration devices before user FPGAs. When sourcing obsolete parts, verify date code and lot traceability to avoid counterfeit risk.
合規資訊
RoHS, REACH, lead-free and halogen-free status were not stated in the verified distributor data; original Mercury-family BGAs were often non-RoHS lead-bearing. Confirm compliance at purchase via supplier certificate of conformance (CoC).