EP1S20F780C7 - Stratix FPGA 18460 Cells 420MHz FBGA-780 | Intel
MPN： EP1S20F780C7 ✗ 停產EP1S20F780C7 概覽
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that combines programmable logic fabric, block RAM, DSP slices, and high-speed I/O on a single die. Within the broader integrated circuit taxonomy, FPGAs sit alongside microcontrollers, ASICs, and CPLDs as members of the programmable logic family. The Stratix family, introduced by Altera in 2002, was the first to embed dedicated DSP blocks and high-speed transceivers, bridging the gap between traditional FPGAs and ASIC-class compute density.
Key features of the EP1S20F780C7 include 18460 logic elements, 1.5 V core supply, embedded DSP blocks for high-throughput arithmetic, multiple PLLs for clock management, and high-speed LVDS-compatible I/O. The 780-ball FC-FBGA (29 x 29 mm, 1 mm pitch) package provides generous routing channels for memory interfaces such as DDR SDRAM and QDR SRAM, plus parallel LVDS links.
From an architectural standpoint, the Stratix device family employs a multi-level routing hierarchy with embedded array blocks (EABs), logic array blocks (LABs), and dedicated multiplier/adder DSP blocks. This allows designers to implement FIR filters, FFT engines, and complex state machines without sacrificing logic capacity. Configuration is via SRAM, enabling in-system reprogrammability through JTAG or passive/active serial schemes.
Typical applications include digital video broadcasting, software-defined radio baseband, medical imaging preprocessing, and high-speed serial protocol bridging. The wide I/O count also makes the device attractive for legacy ASIC prototyping and custom compute accelerators in industrial control.
When designing with this part, pay attention to power-rail sequencing (VCCINT before VCCIO), decoupling capacitor selection, and JTAG chain integrity. Thermal management is essential in enclosed chassis, where the 780-ball BGA benefits from a 4-layer or higher PCB with solid ground and power planes.
This page consolidates distributor pricing, drop-in same-package alternatives, and application guidance beyond what the manufacturer datasheet alone provides.
直接替換替代品，適用於 EP1S20F780C7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1S20F780C7 （相同外形與佔位） — 差異在於 Operating Temperature, Process Technology, Package, Speed Grade, DSP Blocks.
EP1S20F780C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1S20F780C6
✅ 直接替換聯絡詢價
查看資料表 →EP1S20F780C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1S20F780C5
✅ 直接替換聯絡詢價
查看資料表 →EP1S10F780C7
✅ 直接替換聯絡詢價
查看資料表 →EP1S20F780C7 最大額定值與電氣特性
| Family | Stratix |
| Logic Elements | 18460 |
| Maximum Operating Frequency | 420.17 MHz |
| Process Technology | 130 nm CMOS |
| Supply Voltage (Core) | 1.5 V |
| Logic Family | CMOS |
| Package Type | FC-FBGA-780 |
| Package Dimensions | 29 x 29 mm |
| Ball Pitch | 1.0 mm |
| 腳位數 | 780 |
| 工作溫度 | 0 °C to +85 °C |
| Temperature Grade | Commercial (C7 speed grade) |
| Configuration Method | SRAM-based (volatile) |
| Configuration Interface | JTAG / Passive Serial / Active Serial |
| DSP Blocks | Yes (dedicated multiplier/adder blocks) |
| 記憶體類型 | TriMatrix embedded memory |
| 安裝類型 | Surface Mount (BGA) |
EP1S20F780C7 29 x 29 mm 腳位配置指南
EP1S20F780C7（29 x 29 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1S20F780C7.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1S20F780C7 適用於 6 應用s: Digital Video Broadcasting Infrastructure, Software-Defined Radio Baseband, Medical Imaging Preprocessing, ASIC Prototyping and Emulation, Industrial Control and Motion Control, Legacy Telecom Protocol Bridging.
Digital Video Broadcasting Infrastructure
The EP1S20F780C7 fits DVB baseband processing where its 18,460 logic elements and dedicated DSP blocks handle MPEG-2/H.264 channel decoding at line-rate speeds. The 780-ball FC-FBGA exposes enough I/O banks to interface to ASI/SDI receive chains plus DDR SDRAM frame buffers. Embedded multiplier-accumulator blocks accelerate the FFT and Viterbi kernels typical of ATSC and DVB-T demodulators, while 420 MHz internal operation provides headroom for multi-channel implementations in head-end encoders.
推薦
Software-Defined Radio Baseband
In SDR baseband cards, the EP1S20F780C7 implements digital down-conversion, channelization, and protocol framing. Its TriMatrix memory blocks hold time-domain sample buffers, while the DSP blocks execute polyphase filter banks at the ADC sample rate. The wide I/O count accommodates LVDS interfaces to multi-bit ADCs and high-speed serial links to backplane fabric. 1.5 V core operation and LVDS I/O make it straightforward to mate with companion DACs and ADCs at industrial power budgets.
推薦
Medical Imaging Preprocessing
Ultrasound beamforming and CT image reconstruction pipelines run on the EP1S20F780C7's parallel DSP fabric. The FPGA processes multiple channels of digitized RF simultaneously, supporting real-time FIR filtering and envelope detection before data is forwarded to host CPUs. With 18,460 LEs, it can host an entire 32-channel beamformer in a single device. The commercial temperature range suits controlled clinical environments, and the BGA package enables compact daughtercards inside cart-based ultrasound units.
推薦
ASIC Prototyping and Emulation
Design teams use the EP1S20F780C7 as a single-FPGA prototype vehicle for ASIC RTL of moderate size (gate-equivalent up to about 250K ASIC gates). Its 18,460 LEs can absorb typical control-plane plus simple data-plane blocks, while the 780-ball BGA provides enough user I/O to emulate common SoC peripherals. Configuration via JTAG speeds bring-up cycles, and the same BGA pinout across speed grades lets engineers swap bins to debug timing without reworking the board.
推薦
Industrial Control and Motion Control
High-end motion controllers leverage the EP1S20F780C7 to close multi-axis servo loops at sub-microsecond update rates. Its DSP blocks accelerate PID and state-space control algorithms, while abundant I/O drives parallel encoder interfaces, GPIO, and high-speed SPI links to motor drivers. The commercial temperature grade suits factory-floor enclosures with climate control. JTAG-based configuration supports field firmware updates through the factory's existing test infrastructure.
推薦
Legacy Telecom Protocol Bridging
The EP1S20F780C7 commonly bridges between legacy telecom interfaces (T1/E1, HDB3, RS-449) and modern packet backbones in carrier equipment that has not yet been refreshed. Its dedicated serializer/deserializer resources plus abundant LVDS I/O handle multi-channel TDM streams in parallel, with embedded memory blocks providing elastic buffering for rate adaptation. Pin-compatible speed-grade variants let designers scale timing margin based on deployment region without PCB changes.
推薦
推薦產品摘要
工程參考資料，適用於 EP1S20F780C7 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1S20F780C6N | EP1S20F780C6 | EP1S20F780C5N | EP1S20F780C5 | EP1S10F780C7 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FC-FBGA-780 (29 x 29 mm) | FC-FBGA-780 - same | FC-FBGA-780 - same | FC-FBGA-780 - same | FC-FBGA-780 - same | FC-FBGA-780 - same |
| Logic Elements | 18460 | 18460 (same die) | 18460 (same die) | 18460 (same die) | 18460 (same die) | 10570 (-43%) |
| Speed Grade | C7 (slower) | C6 (faster) | C6 (faster) | C5 (fastest) | C5 (fastest) | C7 (slower) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Fastest path to closure when timing is not met at C7 (對比EP1S20F780C7N (lead-free C7))
- Best logic-density match in the same BGA footprint (對比EP1S10F780C7 (smaller 10570-LE FPGA))
- Multi-channel DSP capacity (對比EP1M120F484C7 (Mercury family, smaller BGA))
設計說明
The EP1S20F780C7 requires strict power-rail sequencing: VCCINT (1.5 V core) must rise before or simultaneously with VCCIO banks, with monotonic ramp and stable 5-100 ms rise time. Designers should use a dedicated sequencer IC (e.g., LTC2923 or equivalent) or a microcontroller-managed FET network. Decoupling: place 0.1 µF X7R ceramics at every VCCINT pin pair, plus 10 µF bulk tantalum or polymer capacitors near the device's power islands.
Although the EP1S20F780C7 is specified commercial 0-85 °C, the 780-ball FC-FBGA can dissipate significant heat under high-utilization workloads. Estimated: at full toggle rate (~80% LEs active at 100 MHz internal clock), expect roughly 4-6 W internal dissipation. Use at least a 4-layer PCB with continuous ground plane beneath the BGA, and verify junction temperature via the Stratix internal diode (via JTAG) during bring-up. No external heatsink is required for typical commercial applications, but forced airflow is recommended in enclosed chassis.
The 29 x 29 mm FC-FBGA with 1.0 mm ball pitch demands PCB manufacturing with 0.4-0.5 mm pad diameter and laser-drilled microvias for breakout. Use an HDI stack-up (1-2-1 or higher) to route differential pairs and DDR signals out of the BGA. Matched-length impedance routing (50 Ω SE, 100 Ω diff) is required for LVDS/PCI-compatible I/O banks. Place configuration flash (e.g., EPCS64) within 50 mm of the FPGA's serial configuration pins to avoid signal integrity issues.
Three frequent pitfalls when bringing up the EP1S20F780C7: (1) leaving JTAG chain integrity unverified - always test TAP states before configuration; (2) ignoring the nCONFIG and nSTATUS handshake polarity during passive-serial boot - some clones of EPCS flash require a different hold-time; (3) forgetting that I/O banks must be powered even if unused - an unpowered bank can draw leakage current and trip internal monitors. Reference the Stratix device handbook chapter on configuration and pin connection guidelines before first power-up.
合規資訊
Detailed RoHS/REACH status was not available in the verified web data; consult the manufacturer datasheet or Intel product compliance team directly. The 'N' suffix variants (e.g., EP1S20F780C7N) indicate lead-free finishes per Intel ordering scheme.
