Intel

EP1S10F780C7 - Stratix FPGA 10,570 LEs 780-FBGA | Intel / Altera

Name: EP1S10F780C7 - Stratix FPGA 10,570 LEs 780-FBGA | Intel / Altera
Brand: Intel
SKU: EP1S10F780C7

MPN： EP1S10F780C7 ✗ 停產

1.5 V Vdss LVTTL, LVCMOS, LVDS, SSTL, HSTL (per bank) Rds(on) 780-ball FC-FBGA (29 × 29 mm, 1.0 mm pitch) Package C7 Speed

索取報價

MOQ： 1 |

查看資料表 (PDF) 查看替代品

數量

EP1S10F780C7 概覽

The Intel / Altera EP1S10F780C7 is a member of the original Stratix FPGA family built on a 130 nm CMOS process, integrating 10,570 logic elements, 920,448 bits of embedded RAM, and 426 user I/O pins in a 780-ball Fine-Pitch Ball Grid Array (FC-FBGA) measuring 29 mm × 29 mm with a 1.0 mm ball pitch. According to the Stratix device family data sheet, the device operates from a 1.5 V core supply, supports up to 420.17 MHz internal operation, and is offered in the commercial 0 °C to 85 °C temperature grade as denoted by the 'C7' speed-grade suffix.

An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit that lets engineers implement arbitrary digital logic, memory, and high-speed transceiver functions after PCB fabrication, instead of committing to a fixed ASIC design. The Stratix family sits in the broader taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs are commonly deployed for DSP pipelines, custom protocol bridging, ASIC prototyping, and high-throughput parallel processing where fixed-function processors are too slow or inflexible.

Key features of the EP1S10F780C7 include 10570 logic elements, 426 maximum user I/O, and 920448 RAM bits distributed across TriMatrix memory blocks. The device also embeds DSP blocks for high-throughput arithmetic, supports LVDS I/O signalling, and offers a dedicated configuration interface (Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, and JTAG). It is implemented on a 1.5 V core supply with separate VCCIO banks for mixed-voltage I/O.

Architecturally, Stratix devices combine a fine-grained logic element fabric, embedded SRAM, dedicated DSP blocks, and high-speed I/O elements with on-die termination. The 'S' in the prefix marks the device as the Stratix series (rather than Stratix GX / Stratix II). This architecture suits applications that demand deterministic latency, parallel datapath processing, and flexible I/O standard assignment across multiple banks.

Typical applications for the EP1S10F780C7 include high-performance DSP acceleration, ASIC prototyping, telecom baseband processing, industrial control and motor control, and test-and-measurement instrumentation. The large pin count and RAM density make it well suited to multi-channel data acquisition systems, video processing engines, and high-speed serial protocol bridging.

When designing with this FPGA, engineers must supply the configuration device or JTAG chain, define I/O bank voltages for each bank, and ensure the PCB land pattern matches the 780-ball FC-FBGA 29 × 29 mm 1.0 mm-pitch layout. Thermal management should be considered because the large BGA can dissipate several watts in sustained logic-switching workloads.

This page synthesizes Stratix family specifications, current distributor pricing, drop-in same-package alternatives from the Site MPN list, and practical design notes that are not collated in any single manufacturer document.

直接替換替代品，適用於 EP1S10F780C7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號： EP1S10F780C7 （相同外形與佔位） — 差異在於 Package, Operating Temperature, Process Technology, Speed Grade, DSP Blocks.

EP1S10F780C5

Intel

Package: 780-ball FineLine BGA (FC-FBGA)

Process Technology: 0.13 micrometer, all-layer copper CMOS, SRAM

Speed Grade: C5

比較對象 EP1S10F780C7 →

EP1S10F780C5N

Intel

Package: 780-ball FBGA (29 x 29 mm, 1 mm pitch)

Operating Temperature: 0C to +85C (Commercial)

Speed Grade: C5

比較對象 EP1S10F780C7 →

EP1S10F780C6

Altera

Operating Temperature: 0C to +85C (commercial 'C')

Speed Grade: C6

比較對象 EP1S10F780C7 →

EP1S10F780C6N

Intel

Package: FBGA-780 (29 x 29 mm, 1.0 mm pitch)

Operating Temperature: 0 C to +85 C (Commercial)

比較對象 EP1S10F780C7 →

EP1S10F780C7N

Intel

Package: FBGA-780 (29 × 29 mm, 1.0 mm pitch)

Operating Temperature: 0°C to 85°C (Commercial)

Process Technology: 0.13 μm CMOS, 1.5 V core

比較對象 EP1S10F780C7 →

EP1S10F780I6

Altera

Package: 780-ball FineLine BGA (FBGA-780), 29 x 29 mm, 1.0 mm pitch

Process Technology: CMOS

Speed Grade: 6

比較對象 EP1S10F780C7 →

EP1S20F780C5

Altera

Package: 780-BBGA, FCBGA (FineLine BGA)

Process Technology: 0.13 µm CMOS

Speed Grade: -5

比較對象 EP1S10F780C7 →

EP1S20F780C7

Intel

Operating Temperature: 0 °C to +85 °C

DSP Blocks: Yes (dedicated multiplier/adder blocks)

比較對象 EP1S10F780C7 →

EP1S10F780C6

✅ 直接替換

Altera

📦 780-ball FC-FBGA

Stratix (EP1S) · Stratix I · 10,570 · 1,057 · 920,448 · 426 · 780-BBGA (FC-FBGA, 29x29 mm, 1.0 mm pitch) · 1.5 V

聯絡詢價

查看資料表 →

EP1S10F780C5

✅ 直接替換

Intel

📦 780-ball FC-FBGA

Stratix · 10,570 · 920,448 · Up to 28 · Up to 224 (9-bit x 9-bit) · 426 · 0.13 micrometer, all-layer copper CMOS, SRAM · 1.5 V

聯絡詢價

查看資料表 →

EP1S10F780C6N

✅ 直接替換

Intel

📦 780-ball FC-FBGA

Stratix · 10,570 · 1,200 · 920 Kbit (TriMatrix) · 130 nm CMOS · 1.5 V · Multi-voltage (3.3 V / 2.5 V / 1.8 V LVTTL/LVCMOS, LVDS) · 450.05 MHz

聯絡詢價

查看資料表 →

EP1S10F780C5N

✅ 直接替換

Intel

📦 780-ball FC-FBGA

Stratix · 10570 · 920448 · 426 · 1.5 V · 0C to +85C (Commercial) · 780-ball FBGA (29 x 29 mm, 1 mm pitch) · 130 nm CMOS

聯絡詢價

查看資料表 →

ℹ️ 1 跨封裝零件已隱藏 — 不同封裝需重新加工 PCB，並非真正的直接替換品。聯絡我們如果您需要跨封裝建議。

EP1S10F780C7 最大額定值與電氣特性

Family	Stratix
Logic Elements	10,570
Total RAM Bits	920,448
User I/O Count	426
Core Voltage	1.5 V
Process Technology	130 nm CMOS
封裝	780-ball FC-FBGA (29 × 29 mm, 1.0 mm pitch)
安裝類型	Surface Mount (BGA)
工作溫度	0 °C to 85 °C (Commercial)
Speed Grade	C7
Maximum Internal Frequency	420.17 MHz
Configuration Modes	Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, JTAG
DSP Blocks	Yes (embedded)
I/O Standards Supported	LVTTL, LVCMOS, LVDS, SSTL, HSTL (per bank)
RoHS 狀態	Non-compliant (per third-party distributor listing)
Logic Family	CMOS

EP1S10F780C7 780-ball fc-fbga (29 × 29 mm, 1.0 mm pitch) 腳位配置指南

EP1S10F780C7（780-ball fc-fbga (29 × 29 mm, 1.0 mm pitch) 封裝）的腳位配置。此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。

EP1S10F780C7 的 780-ball fc-fbga (29 × 29 mm, 1.0 mm pitch) 封裝腳位圖

無詳細腳位定義資料： EP1S10F780C7.

請參閱資料表以查看完整腳位配置。

典型應用

EP1S10F780C7 適用於 7 應用s: ASIC Prototyping and Emulation, High-Performance DSP Acceleration, Telecom Baseband and Protocol Bridging, Industrial Motor Control and Drive, Test and Measurement Instrumentation, Video Processing and Image Pipeline, Aerospace Avionics Databus (Legacy / Up-cycle).

🔧

ASIC Prototyping and Emulation

The EP1S10F780C7 is well suited to ASIC prototyping because its 10,570 logic elements and 920,448 bits of embedded RAM provide enough capacity to map large RTL blocks onto a single device. With 426 user I/O the part exposes wide bus interfaces to bring out an emulated ASIC's external pins, while the 1.5 V Stratix core and dedicated TriMatrix memory support high-fidelity behavioural validation at speeds up to 420.17 MHz. Quartus design flows and JTAG configuration allow rapid iteration during bring-up.

推薦

EPCQ128SI16N (Active-mode serial configuration device for Stratix FPGA) EPCS64SI16N (Legacy configuration memory for Stratix-class FPGAs)

🎧

High-Performance DSP Acceleration

With on-die DSP blocks and 920,448 RAM bits, the EP1S10F780C7 can implement multi-channel FIR, FFT, and correlator engines in parallel datapath topologies. The 426 I/O and banked LVDS support high-rate ADC and DAC interfaces, while 130 nm CMOS silicon at 1.5 V keeps deterministic latency under sustained compute load. Designers typically pin out LVDS pairs to A/D and D/A converters and use the RAM as coefficient and sample buffers.

推薦

ADS62P49 (Dual-channel 14-bit 250 MSPS ADC pairing with FPGA LVDS) DAC5682Z (16-bit 1 GSPS DAC for FPGA-driven transmit chains)

🌐

Telecom Baseband and Protocol Bridging

The EP1S10F780C7's mix of logic, RAM, and 426 I/O makes it a practical choice for telecom baseband and custom protocol bridge designs. Stratix DSP blocks handle channelisation and FEC, while user I/O banks expose LVDS, LVTTL, and SSTL interfaces to backplane transceivers and optical modules. The 130 nm process gives predictable timing closure for multi-channel TDM and packet processing pipelines.

推薦

TLK2711 (1.6 Gbps transceiver interfacing to FPGA LVDS I/O) DS90CR286A (28-bit LVDS serializer for FPGA-to-display or backplane links)

🏭

Industrial Motor Control and Drive

Industrial drive applications leverage the EP1S10F780C7's parallel PWM generation, encoder feedback counting, and deterministic I/O response. The 426 I/O pins carry multi-axis PWM, Hall/encoder feedback, and fieldbus interfaces (PROFIBUS, EtherCAT, CAN). With 10,570 logic elements, the design can host a soft CPU core plus the control loops in a single device, simplifying BOM and certification.

推薦

SN65HVD251 (Industrial CAN transceiver connected to FPGA I/O bank) DRV8313 (Three-phase motor driver accepting FPGA-generated PWM)

📺

Test and Measurement Instrumentation

Test instruments require deep logic, large RAM for sample buffering, and many LVDS pairs to ADC front ends - exactly the EP1S10F780C7's strengths. The device can implement protocol-aware pattern generators, logic analyser capture, and digitiser signal-processing firmware in one device. The 780-ball FC-FBGA supports dense PCB routing for multi-GSPS data converters and timing-critical trigger logic.

推薦

ADS5400 (12-bit 1 GSPS ADC requiring FPGA LVDS capture) TLK1501 (High-speed serialiser for FPGA-to-host data upload)

🎥

Video Processing and Image Pipeline

Video pipelines benefit from the EP1S10F780C7's wide RAM, parallel datapath, and many LVDS pairs for camera and display interfaces. Designers commonly instantiate SDR/DDR controllers, colour-space converters, scaling engines, and overlay compositors in fabric while using TriMatrix blocks as line and frame buffers. 426 user I/O provide enough bandwidth to drive parallel RGB, BT.1120, or LVDS display links directly.

推薦

MT48LC16M16A2 (External SDRAM for FPGA frame buffer expansion) DS90C385A (LVDS serializer for FPGA-to-flat-panel display link)

✈️

Aerospace Avionics Databus (Legacy / Up-cycle)

Long-lifecycle aerospace platforms still maintain inventory of the EP1S10F780C7 for MIL-STD-1553, ARINC 429, and discrete avionic interface aggregation. Although the part is obsolete for new designs, existing LRUs continue to require drop-in replacements with the same FC-FBGA footprint. The 130 nm silicon's mature reliability database remains an asset in DO-254 verification flows.

推薦

BU-61580 (MIL-STD-1553 transceiver pair to FPGA I/O) HI-8588 (ARINC 429 line receiver for FPGA avionic buses)

推薦產品摘要

EPCQ128SI16N Active-mode serial configuration device for Stratix FPGA 用於： ASIC Prototyping and Emulation EPCS64SI16N Legacy configuration memory for Stratix-class FPGAs 用於： ASIC Prototyping and Emulation ADS62P49 Dual-channel 14-bit 250 MSPS ADC pairing with FPGA LVDS 用於： High-Performance DSP Acceleration DAC5682Z 16-bit 1 GSPS DAC for FPGA-driven transmit chains 用於： High-Performance DSP Acceleration TLK2711 1.6 Gbps transceiver interfacing to FPGA LVDS I/O 用於： Telecom Baseband and Protocol Bridging DS90CR286A 28-bit LVDS serializer for FPGA-to-display or backplane links 用於： Telecom Baseband and Protocol Bridging SN65HVD251 Industrial CAN transceiver connected to FPGA I/O bank 用於： Industrial Motor Control and Drive DRV8313 Three-phase motor driver accepting FPGA-generated PWM 用於： Industrial Motor Control and Drive ADS5400 12-bit 1 GSPS ADC requiring FPGA LVDS capture 用於： Test and Measurement Instrumentation TLK1501 High-speed serialiser for FPGA-to-host data upload 用於： Test and Measurement Instrumentation MT48LC16M16A2 External SDRAM for FPGA frame buffer expansion 用於： Video Processing and Image Pipeline DS90C385A LVDS serializer for FPGA-to-flat-panel display link 用於： Video Processing and Image Pipeline BU-61580 MIL-STD-1553 transceiver pair to FPGA I/O 用於： Aerospace Avionics Databus (Legacy / Up-cycle) HI-8588 ARINC 429 line receiver for FPGA avionic buses 用於： Aerospace Avionics Databus (Legacy / Up-cycle)

What is the EP1S10F780C7?

The EP1S10F780C7 is an Intel / Altera Stratix family Field Programmable Gate Array (FPGA) with 10,570 logic elements, 920,448 bits of embedded RAM, and 426 user I/O pins. It is housed in a 780-ball FC-FBGA package and operates from a 1.5 V core supply. According to the Stratix family data sheet, the device is built on a 130 nm CMOS process and is graded for commercial 0 °C to 85 °C operation.

How much embedded memory does the EP1S10F780C7 have?

The EP1S10F780C7 integrates 920,448 bits of on-die SRAM organised into TriMatrix memory blocks for distributed, small, and large memory functions. This RAM density is consumed by user logic, FIFOs, lookup tables, and embedded DSP data buffers without consuming external board space.

Is the EP1S10F780C7 still in production?

No. The EP1S10F780C7 is marked obsolete on Intel / Altera's product lifecycle pages; the original Stratix family was superseded by Stratix II, III, IV, V, and 10 series devices. Stock today comes from authorised distributors and the secondary market, not from active wafer production. Lead times from secondary suppliers typically run 8 to 16 weeks.

Where can I buy the EP1S10F780C7?

Current authorised and independent distributors offering the EP1S10F780C7 include DigiKey, Octopart-listed vendors, Arrow, Heisener, Jotrin Electronics, and several Asia-Pacific brokers listed on Octopart. Stock and price should be re-confirmed at quote time because this is an obsolete Stratix-family part.

What is the price of the EP1S10F780C7?

As of 2026-09-07, the EP1S10F780C7 is quoted at approximately USD 204.34 per piece at qty 1, dropping to roughly USD 128.40 per piece at qty 1000, based on Heisener and Octopart listings. Prices fluctuate daily on the secondary market; request formal quotes for production planning.

What is the lead time for the EP1S10F780C7?

Lead times for the EP1S10F780C7 typically run 2 to 6 weeks when stock is available at distributors such as DigiKey or Arrow, and 8 to 16 weeks when sourcing through independent brokers or the secondary market. Because the device is obsolete, booking orders early and qualifying an alternate FPGA family is strongly recommended.

Is the EP1S10F780C7 in stock today?

Stock of the EP1S10F780C7 is listed by multiple distributors; for example Heisener reports 4,784 pieces available as of 2026-09-07. However, because the part is obsolete, quantities and lead times can change rapidly. Treat any stock snapshot as a single point-in-time quote and re-verify before purchase order release.

What is the difference between EP1S10F780C7 and EP1S10F780C6?

The EP1S10F780C7 and EP1S10F780C6 are both Stratix-family FPGAs in the same 780-ball FC-FBGA package, but differ in speed grade: C7 is the faster timing bin, C6 is slower. Both share identical pinout, RAM, and logic-element counts, so they are drop-in compatible on the PCB. Choose C6 if C7 is out of stock, but verify timing closure against the Quartus timing model.

EP1S10F780C7 vs EP1S10F780C5 - which should I choose?

Both the EP1S10F780C7 and EP1S10F780C5 are drop-in compatible in the 780-ball FC-FBGA package with identical logic and RAM resources. C7 is the fastest speed grade, C5 is the slowest, and C6 sits in between. Choose C7 for the highest Fmax; fall back to C5 or C6 only when C7 is unavailable. Quartus timing closure is required to confirm the chosen speed grade meets your design.

What package does the EP1S10F780C7 use?

The EP1S10F780C7 uses a 780-ball Fine-Pitch Ball Grid Array (FC-FBGA) measuring 29 mm × 29 mm with a 1.0 mm ball pitch. The FC prefix indicates a flip-chip BGA. Designers must follow Altera's land pattern and reflow profile guidelines; the 1.0 mm pitch demands precise PCB fabrication and assembly.

Where can I download the EP1S10F780C7 datasheet PDF?

The Stratix family data sheet is available as part of the Stratix Device Handbook from Altera / Intel at https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/hb/stx/stratix_handbook.pdf. Third-party mirrors such as FindIC and GlobalSpec also host extracted PDF copies of the EP1S10F780C7 datasheet.

What is the best drop-in replacement for the EP1S10F780C7?

The best drop-in replacement for the EP1S10F780C7 is the EP1S10F780C6 (same 780-ball FC-FBGA, same 10,570 LE and 920 Kbit RAM, slower speed grade) or the EP1S10F780C5 if even slower speed is acceptable. All three share the identical FC-FBGA 780-ball pinout, so they solder onto the same PCB land pattern without rework.

Can the EP1S10F780C7 be replaced by a Cyclone or Stratix II device?

Cyclone and Stratix II devices share no pin-compatible package with the EP1S10F780C7. Any migration to Cyclone IV, Stratix II, Stratix III, or Stratix IV requires a new PCB footprint plus a Quartus recompile and re-validation. Treat those moves as redesigns, not drop-ins, and plan for full timing closure and bank-voltage reassignment.

Is the EP1S10F780C7 RoHS compliant?

The EP1S10F780C7 is listed as RoHS non-compliant on multiple third-party distributor pages, because the original Stratix family pre-dates the RoHS lead-free transition. If a RoHS-compliant alternative is required, consider migrating the design to a Stratix II, III, or newer Cyclone family device rather than seeking a legacy drop-in.

工程參考資料，適用於 EP1S10F780C7 — 比較、設計指引及合規資訊。

選型指南

Choose the EP1S10F780C7 when your design targets the highest Stratix speed grade and you have existing PCB layout, configuration memory, and Quartus timing closure already validated against this part. Choose EP1S10F780C6 if C7 stock is short and you can re-run timing analysis against the slower speed grade - it is fully drop-in. Choose EP1S10F780C5 only when both C7 and C6 are unavailable and your design tolerates the slowest grade. For RoHS-mandated assemblies, prefer the 'N' suffix parts (C6N, C5N) which carry a lead-free finish on the same package. Avoid migrating to Cyclone, Stratix II, or later families unless you are prepared for a full PCB redesign and Quartus recompile, because no pin-compatible drop-in exists.

與替代品比較

參數	本產品	EP1S10F780C6	EP1S10F780C5	EP1S10F780C6N	EP1S10F780C5N
Brand	Intel	Intel	Intel	Intel	Intel
Package	780-ball FC-FBGA (29 x 29 mm, 1.0 mm pitch)	780-ball FC-FBGA (29 x 29 mm, 1.0 mm pitch) - same	780-ball FC-FBGA (29 x 29 mm, 1.0 mm pitch) - same	780-ball FC-FBGA (29 x 29 mm, 1.0 mm pitch) - same	780-ball FC-FBGA (29 x 29 mm, 1.0 mm pitch) - same
Logic Elements	10,570	10,570	10,570	10,570	10,570
Total RAM Bits	920,448	920,448	920,448	920,448	920,448
User I/O Count	426	426	426	426	426
Speed Grade	C7 (fastest)	C6	C5 (slowest)	C6, lead-free	C5, lead-free
Core Voltage	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
Operating Temperature	0 C to 85 C (Commercial)	0 C to 85 C (Commercial)	0 C to 85 C (Commercial)	0 C to 85 C (Commercial)	0 C to 85 C (Commercial)
RoHS Status	Non-compliant	Non-compliant	Non-compliant	Lead-free finish (per N suffix)	Lead-free finish (per N suffix)

主要差異化特點

Fastest Stratix speed grade in the EP1S10 family (對比EP1S10F780C6)
Maximum speed grade preserved across all drop-in alternatives (對比EP1S10F780C5)
Lead-free surface finish option without changing the silicon (對比EP1S10F780C6N)

設計說明

Estimated: at 1.5 V core and a worst-case Stratix power-per-LE figure of order 5 uW/LE at full toggle, the EP1S10F780C7 can dissipate up to 5-8 W in sustained logic-switching workloads. The 780-ball FC-FBGA package exposes the die through the BGA balls; designers should provide a continuous ground plane, via-array under the package, and thermal vias to inner copper layers to keep junction temperature within the 0-85 C commercial envelope.

The 780-ball FC-FBGA has a 1.0 mm ball pitch on a 29 x 29 mm substrate. PCB fabrication must use laser-drilled microvias or staggered vias, and the land pattern must follow Altera's reference footprint exactly. Solder paste stencil aperture and reflow profile must be qualified for lead-free or SnPb depending on whether the chosen variant has the 'N' (lead-free) suffix or not.

Configuration failures are the most common Stratix bring-up issue. Always include a JTAG header (10-pin or 20-pin Altera-compatible) wired to the dedicated JTAG pins so the design can be programmed and observed even when the configuration device is missing. Double-check MSEL pin strapping to select the correct configuration mode (Passive Serial, FPP, PPA, or JTAG) for your boot source.

Each I/O bank must be powered from a single VCCIO supply; mixing voltages within a bank is not allowed. Decouple each VCCIO pin with a 0.1 uF + 10 uF pair placed as close to the BGA ball as the breakout allows. Keep LVDS pairs length-matched within 150 mil for the chosen data rate and route them over a continuous reference plane to control impedance and crosstalk.

合規資訊

RoHS

Non Compliant

REACH

Unknown

AEC-Q100

Not Applicable

無鉛

無鹵

Unknown

衝突礦產

Unknown

RoHS non-compliant per third-party distributor listing; the original Stratix family pre-dates the RoHS lead-free transition. The 'N' suffix variants (C6N, C5N) carry a lead-free finish on the same silicon. AEC-Q100 is not applicable - this is a commercial-grade FPGA, not an automotive-qualified IC.

資料驗證日期： 2026-09-07 — 資料由 XAIPART 元件工程團隊驗證及整理

來源： Distributor, Octopart, Distributor, Distributor, Manufacturer Datasheet, Distributor