EP20K200FC484-4 - 8320 LE FPGA, 382 I/O, 484-FBGA | Intel (Altera)
MPN： EP20K200FC484-4 ✗ 停產EP20K200FC484-4 概覽
An FPGA (Field Programmable Gate Array) is a type of integrated circuit that can be reconfigured by the designer after manufacturing, combining the programmable logic of a CPLD with the high density of an ASIC. Within the broader taxonomy, an FPGA belongs to the class of programmable logic devices, which are themselves a category of digital semiconductors used to implement custom digital circuits. The APEX-20K family was Intel/Altera's first generation to combine Look-Up Table (LUT)-based logic elements with embedded memory blocks, enabling a single chip to implement both glue logic and embedded system functions.
Key features of the EP20K200FC484-4 include 832 logic array blocks (LABs) and 832 configurable logic blocks (CLBs), 106 Kbits of embedded SRAM, support for multiple I/O standards including LVTTL, LVCMOS, PCI, and GTL+, and an embedded PLL for clock management. The 382 user I/O pins are organized across eight I/O banks to provide flexible voltage-level interfacing. The 484-FBGA package offers a compact footprint with controlled-impedance traces suitable for high-speed parallel interfaces.
The device is fabricated on a 0.18 µm CMOS process and combines LUT-based logic with a MegaLAB structure that groups multiple LABs and embedded system blocks (ESBs) for high-speed local interconnect. This architecture was widely adopted in telecom, networking, and data-acquisition designs in the early 2000s. Because the part is now in obsolescence, designs requiring long-term production should plan a migration path to a Stratix or Cyclone family device.
Typical applications include high-density glue logic in telecom line cards, custom peripheral controllers in industrial automation, DSP co-processing front-ends, and ASIC prototyping. The combination of 526 K system gates and 382 I/O makes it suitable for designs that previously required multiple CPLDs.
When designing with this part, pay particular attention to the 2.5 V core supply and I/O-bank reference voltage requirements; use the Altera MAX+PLUS II or Quartus design toolchain for synthesis, fitting, and timing closure. Because the EP20K200FC484-4 is end-of-life, verify last-time-buy and obsolescence notices with the manufacturer before committing to a new production design.
This page synthesizes distributor pricing, drop-in same-package alternatives (such as the -1, -2, and -3 speed-grade variants), and practical design notes not consolidated in the manufacturer datasheet.
直接替換替代品，適用於 EP20K200FC484-4 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP20K200FC484-4 （相同外形與佔位） — 差異在於 Speed Grade, Operating Temperature, Package, Process Technology, Series.
EP20K200FC484-3
✅ 直接替換聯絡詢價
查看資料表 →EP20K200FC484-3N
✅ 直接替換聯絡詢價
查看資料表 →EP20K200FC484-3AA
✅ 直接替換聯絡詢價
查看資料表 →EP20K200FC484-2X
✅ 直接替換聯絡詢價
查看資料表 →EP20K200FC484-1N
✅ 直接替換聯絡詢價
查看資料表 →EP20K200FC484-1
✅ 直接替換聯絡詢價
查看資料表 →EP20K200FC484-1XV
✅ 直接替換聯絡詢價
查看資料表 →EP20K200FC484-4 最大額定值與電氣特性
| Manufacturer | Intel (formerly Altera) |
| Series | APEX-20K |
| Device Type | Field Programmable Gate Array (FPGA) |
| Number of Logic Elements | 8320 |
| Number of LABs/CLBs | 832 |
| Total RAM Bits | 106496 |
| Number of Gates | 526000 |
| Number of I/O | 382 |
| 供應電壓 | 2.375 V to 2.625 V |
| 安裝類型 | Surface Mount |
| 封裝 / 外殼 | 484-BBGA (Fine-pitch BGA) |
| 工作溫度 | 0°C to 85°C (TJ) |
| Speed Grade | -4 |
| Process Technology | 0.18 µm CMOS |
EP20K200FC484-4 484-bbga (fine-pitch bga) 腳位配置指南
EP20K200FC484-4（484-bbga (fine-pitch bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP20K200FC484-4.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP20K200FC484-4 適用於 6 應用s: Telecom Line-Card Glue Logic, Industrial PLC and Motion Controllers, ASIC Prototyping and Emulation, High-Speed Data-Acquisition Front Ends, Network Routing and Switching Fabrics, Legacy Military and Avionics Interfaces.
Telecom Line-Card Glue Logic
The EP20K200FC484-4's 8,320 logic elements and 382 user I/O pins made it a workhorse for telecom line-card glue-logic designs in the early 2000s. Its 526,000 system gates comfortably accommodated bus-bridging, custom framing, and TDM (time-division multiplexing) functions on a single device. The APEX-20K's MegaLAB structure provides deterministic interconnect between LABs and embedded system blocks, which is critical for the parallel data paths typical of OC-3/OC-12 framer interfaces. Eight independently-powered I/O banks allow direct interface to 3.3 V LVTTL, 2.5 V LVCMOS, and GTL+ backplane signals without external level shifters. Designers should use Quartus II to constrain timing paths across I/O regions and verify setup/hold margins against the chosen speed grade ('-4' in this case).
推薦
Industrial PLC and Motion Controllers
In industrial PLC and motion-control applications, the EP20K200FC484-4 served as the central logic device for custom peripherals such as high-speed encoder counters, PWM generators, and fieldbus interfaces (Profibus, DeviceNet). The 106,496 bits of embedded SRAM enable large FIFO buffers for pulse-train interpolation, while the 382 I/O pins allow direct connection to dozens of opto-isolated digital inputs and outputs. The 0°C to 85°C commercial temperature rating covers most factory-floor environments, though designers targeting outdoor or unconditioned cabinets should evaluate the 'I'-suffix industrial variants in the same family. Engineers should carefully review the APEX-20K datasheet's I/O-bank ESD and surge ratings and add external TVS protection on field-side wiring.
推薦
ASIC Prototyping and Emulation
The EP20K200FC484-4 was frequently used as a single-chip ASIC prototyping vehicle because its 8,320 logic elements, 106 Kb embedded memory, and 526 K system gates approximate a mid-complexity ASIC implementation. Engineers mapped RTL directly to the APEX-20K fabric using Quartus II's synthesis flow, then validated system timing before committing to mask ROM. The 484-FBGA package keeps trace lengths short for high-speed parallel buses used in SoC emulation. For multi-FPGA prototyping of larger ASICs, several EP20K200 devices could be tiled with high-speed LVDS links between them. Because the device is now obsolete, designers building new ASIC prototypes should migrate to Stratix IV/V or Cyclone V with equivalent or greater capacity.
推薦
High-Speed Data-Acquisition Front Ends
The APEX-20K architecture supports high-speed parallel data-acquisition front ends for medical imaging, sonar, and radar digitizer systems. The EP20K200FC484-4's 382 I/O pins accommodate wide parallel ADC buses (16-32 bits at 50-100 MSPS), and its embedded memory blocks act as deep capture buffers between the ADC and downstream DSP. The integrated PLL generates the ADC sample clock with fine frequency control, and the 2.5 V core supply keeps switching noise low for adjacent analog circuitry. Designers should isolate the FPGA's switching ground from the analog ground using a split-plane layout and route ADC data lines with matched-length impedance-controlled traces. Legacy designs of this type are still in service; replacement boards use the same footprint with a -3 or -1 speed grade.
推薦
Network Routing and Switching Fabrics
The EP20K200FC484-4 was used as a control-plane FPGA in early-2000s router and switch line cards, implementing custom header processing, queue management, and fabric-arbiter functions. Its 8,320 logic elements handle lookup-table pipelines and CRC engines, while 106 Kb of embedded memory backs small packet queues and statistics counters. Eight I/O banks allow direct connection to SPI-4.2 / SFI-4 physical-layer devices operating at different voltage levels. The 382 I/O count is sufficient for OC-48 line cards with auxiliary management interfaces. New designs in this space use Stratix or Arria 10 FPGAs with embedded transceivers, but the EP20K200FC484-4 still appears in long-lifecycle telecom and defense programs.
推薦
Legacy Military and Avionics Interfaces
The EP20K200FC484-4 has seen service in military and avionics platforms that require long-life-cycle support and where redesign risk outweighs the benefit of modern silicon. Its 382 I/O pins support MIL-STD-1553, ARINC 429, and discrete avionics interfaces implemented in FPGA fabric. The commercial 0°C to 85°C temperature range is often derated for avionics use; designers typically screen parts or use the 'I'-grade variants. Because the device is obsolete, current defense programs must either qualify a current-generation Cyclone or Stratix with the appropriate DLA drawing, or stockpile remaining EP20K200 inventory through authorized brokers. The 484-FBGA footprint is shared across all APEX-20K FC484 speed-grade variants, simplifying board-level qualification.
推薦
推薦產品摘要
工程參考資料，適用於 EP20K200FC484-4 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP20K200FC484-3 | EP20K200FC484-1N | EP20K200FC484-2X |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 8320 | 8320 | 8320 | 8320 |
| Total RAM Bits | 106496 | 106496 | 106496 | 106496 |
| Number of Gates | 526000 | 526000 | 526000 | 526000 |
| Number of I/O | 382 | 382 | 382 | 382 |
| Supply Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V |
| Operating Temperature | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C |
| Speed Grade | -4 | -3 | -1 | -2 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Highest speed grade in the EP20K200 FC484 package (對比EP20K200FC484-1N)
- Largest logic capacity among FC484-packaged APEX-20K options (對比EP20K100FC324-2X)
- Same generation as EP20K400/600/1000 but with smaller package (對比EP20K1000CF672C7)
設計說明
The EP20K200FC484-4 requires a low-noise 2.5 V core supply and per-bank VCCIO references for the eight I/O banks. Place 100 µF bulk, 10 µF ceramic, and 0.1 µF decoupling capacitors close to each supply pin pair. For multi-bank designs using mixed I/O standards (e.g., 3.3 V LVTTL and 2.5 V LVCMOS), each VCCIO pin must be independently decoupled to prevent switching noise coupling between banks. Use a linear regulator (not a switching converter) for the core rail if downstream analog circuitry is co-located on the same PCB.
Estimated: at maximum toggle activity (assumed ~80% utilization of 8,320 LE at 100 MHz with 50% I/O toggle), core power dissipation is approximately 1.5 to 2 W. The 484-FBGA package dissipates this through its bottom balls and internal thermal vias to inner PCB ground planes; a 4-layer board with stitched thermal vias under the BGA is required. Designers targeting sealed enclosures should measure junction temperature with a thermocouple on a test coupon and de-rate to 70°C ambient to ensure margin against the 85°C commercial limit.
The 484-FBGA uses a 1.0 mm ball pitch and requires high-density interconnect (HDI) PCB fabrication with laser-drilled microvias and staggered via-in-pad. Route differential pairs (LVDS, GTL+) with 100 Ω differential impedance and matched length within 50 mils. Provide at least 6 ground-reference vias around each BGA breakout row to maintain return-path continuity. For unused I/O pins, configure them as inputs with internal pull-ups to prevent floating inputs from drawing excess current.
Do not confuse the EP20K200FC484-4 (APEX-20K family, 0.18 µm process, Quartus II support) with the EP20K200EFC484-2X (commercial speed-grade variant) or the EP20K1000CF672C7 (a much larger APEX-20KE device). When programming, use the Quartus II programmer with the correct device family selection - selecting an APEX-20KE bitstream for an APEX-20K device can damage the configuration logic. Also note that legacy MAX+PLUS II designs must be re-synthesized in Quartus II to use modern simulation and timing analysis tools.
合規資訊
RoHS, REACH, lead-free, and halogen-free status were not present in the verified web data and are marked as 'unknown'. AEC-Q100 is not applicable - this is an FPGA, not an automotive-grade analog/digital IC. For mission-critical designs, request the full material declaration from Intel/Altera or the authorized distributor.
