EP20K300EBC652-2 - APEX-20KE FPGA | Altera | Embedded Systems
MPN： EP20K300EBC652-2 ✗ 停產EP20K300EBC652-2 概覽
An FPGA is a semiconductor integrated circuit whose logic function is defined by configuration rather than fixed mask programming. FPGAs combine programmable lookup-table or macro logic, routing resources, memory, and I/O cells. In the broader electronics hierarchy, this places the device between a programmable logic device and a system-level digital implementation technology. The APEX-20KE family uses a 1.8 V-oriented platform, making the part suitable for designs that require configurable digital blocks without the fixed function constraints of an application-specific integrated circuit.
The principal verified features are 1152 macros, 147456 total RAM bits, 11520 logic cells as reported by the DigiKey Marketplace result, and 408 I/O pins. The 652-BGA package provides a large ball-grid-array interface for high pin-count designs, while the 45 mm by 45 mm package dimensions are important for land-pattern, routing, and thermal planning. The 1.71 V to 1.89 V supply range should be treated as a system-level input requirement, and the exact board power implementation should be validated against the complete manufacturer documentation.
The architecture is associated with configurable logic resources, embedded memory, programmable routing, and programmable I/O. The reported macro count and memory capacity indicate a high-density device intended for designs that would otherwise require several smaller programmable devices or substantial discrete logic. Because the provided search data does not include clock frequency, transceiver count, temperature grade, or configuration interface details, those characteristics are deliberately left for datasheet verification rather than inferred.
Typical applications include industrial automation controllers, communications equipment, test and measurement systems, image or protocol processing, and embedded control platforms. In these systems, the FPGA can implement parallel datapaths, interface adaptation, state machines, and memory-intensive digital functions. The 408 I/O count is especially relevant where many external buses, sensors, converters, or control signals must be connected.
Designers should confirm the configuration method, I/O banking, supported I/O standards, timing constraints, power sequencing, and operating temperature in the manufacturer datasheet before schematic release. A 652-ball BGA requires controlled-impedance routing, a suitable multilayer PCB, escape routing, and assembly capability. Pin-to-pin substitution should be limited to devices with verified package, ball map, speed, voltage, and configuration compatibility.
This page combines verified distributor specifications, package information, cross-reference evidence, and application-oriented design guidance. It does not invent unsupported timing, temperature, or electrical values; unavailable engineering details are identified in the specification list for follow-up verification.
直接替換替代品，適用於 EP20K300EBC652-2 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP20K300EBC652-2 （相同外形與佔位） — 差異在於 Total RAM Bits, Process Technology, Operating Temperature, Series, Family.
EP20K300EBC652-1
✅ 直接替換聯絡詢價
查看資料表 →EP20K300EBC652-1X
✅ 直接替換聯絡詢價
查看資料表 →EP20K300EBC652-2X
✅ 直接替換聯絡詢價
查看資料表 →EP20K200EBC652-2X
✅ 直接替換聯絡詢價
查看資料表 →EP20K100EBC652-2X
✅ 直接替換聯絡詢價
查看資料表 →EP20K300EBC652-2 最大額定值與電氣特性
| Product Type | Field Programmable Gate Array (FPGA) |
| Device Family | APEX-20KE |
| Logic Cells | 11520 |
| Macros | 1152 |
| Total RAM Bits | 147456 bits |
| I/O Count | 408 |
| 供應電壓 | 1.71 V to 1.89 V |
| 封裝 | 652-BGA |
| Package Dimensions | 45 mm x 45 mm |
| Technology | 0.22 um (reported for family variant) |
| 最大時脈頻率 | 350 MHz (reported for family variant) |
| Configuration Technology | SRAM-based programmable logic (family description) |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
EP20K300EBC652-2 45 mm x 45 mm 腳位配置指南
EP20K300EBC652-2（45 mm x 45 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP20K300EBC652-2.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP20K300EBC652-2 適用於 6 應用s: Industrial Automation Controller, Communications Interface Aggregation, Test and Measurement Instrument, Embedded Vision and Image Processing, Medical Diagnostic Equipment, Legacy Embedded Platform and Interface Bridge.
Industrial Automation Controller
EP20K300EBC652-2 fits industrial automation controllers that require a high-density programmable logic device with 408 I/O. The reported 1152 macros and 147456 RAM bits can support machine-state control, parallel sensor aggregation, timing functions, and communication-interface adaptation. The 1.71 V to 1.89 V supply range must be implemented with controlled decoupling and verified sequencing. Because industrial temperature and qualification data are not supplied, the exact operating environment must be confirmed before field deployment.
推薦
Communications Interface Aggregation
EP20K300EBC652-2 is suitable for communications equipment that must combine multiple data sources, implement protocol conversion, or provide flexible timing and buffering. Its 408 I/O can connect several external interfaces, while 147456 total RAM bits provide storage for packets, lookup tables, and intermediate data. The 652-BGA package supports a large pin-count implementation but requires a multilayer PCB and controlled routing. The supplied data does not state transceiver or maximum-clock specifications, so interface rates require datasheet validation.
推薦
Test and Measurement Instrument
EP20K300EBC652-2 can serve as the programmable digital core of a test and measurement instrument. The FPGA can implement parallel acquisition control, waveform sequencing, data formatting, trigger logic, and interface bridging. The reported 1152 macros and 11520 logic cells support substantial custom logic, while 408 I/O provide connectivity to converters, front ends, clocks, and host systems. The 652-BGA 45 mm by 45 mm package creates demanding routing and thermal requirements, and signal-integrity limits must be verified from the official datasheet.
推薦
Embedded Vision and Image Processing
EP20K300EBC652-2 fits embedded image-processing systems requiring configurable pixel pipelines, frame buffering, and parallel arithmetic. Its 147456 RAM bits can support selected line buffers, lookup tables, or intermediate storage, and the 1152 macros can implement filtering, control, and interface functions. The 408 I/O count helps connect image sensors, memories, converters, and host processors. The provided data does not specify supported memory interfaces or clock limits, so the actual sensor and memory bandwidth must be validated before architecture selection.
推薦
Medical Diagnostic Equipment
EP20K300EBC652-2 can be evaluated for medical diagnostic equipment where configurable digital processing, data capture, and multiple interfaces are needed. The 408 I/O may connect sensors, analog-to-digital converters, displays, communication controllers, and safety-related control logic. Embedded memory of 147456 bits supports selected buffering and control functions, but a medical design must verify reliability, temperature, lifecycle, and regulatory requirements from authoritative documentation. The supplied data does not establish medical qualification, so compliance must not be inferred.
推薦
Legacy Embedded Platform and Interface Bridge
EP20K300EBC652-2 is appropriate for maintaining or extending legacy embedded platforms that already depend on the APEX-20KE architecture. The device can implement interface bridges, glue-logic replacement, protocol adaptation, and custom control functions while retaining a 652-BGA land pattern when an existing board is designed for this family. Its 408 I/O and 147456 RAM bits provide substantial integration capability. Before substituting a suffix variant, verify the exact speed grade, ordering code, configuration method, and environmental requirements.
推薦
推薦產品摘要
工程參考資料，適用於 EP20K300EBC652-2 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP20K300EBC652-1 | EP20K300EBC652-1X | EP20K300EBC652-2X | EP20K200EBC652-2X | EP20K100EBC652-2X |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 652-BGA, 45 mm x 45 mm | 652-BGA | 652-BGA | 652-BGA | 652-BGA | 652-BGA |
| Product Type | APEX-20KE FPGA | APEX family FPGA | APEX family FPGA | APEX family FPGA | APEX family FPGA | APEX family FPGA |
主要差異化特點
- Higher target family capacity positioning (對比EP20K200EBC652-2X)
- Large BGA interface (對比EP20K200EBC652-2X)
- Resource and memory integration (對比EP20K100EBC652-2X)
設計說明
Implement the reported 1.71 V to 1.89 V core supply with the voltage tolerance, sequencing, and decoupling values specified by the complete manufacturer datasheet. The supplied data does not provide separate I/O or auxiliary rail requirements, so do not assume that the reported range covers every power input. Use a low-impedance power distribution network, place local decoupling near the relevant supply balls, and verify startup behavior, brownout limits, and simultaneous-switching noise on the assembled board.
The 652-BGA, 45 mm by 45 mm package requires early PCB planning for escape routing, layer stack-up, via-in-pad or dog-bone fanout, controlled-impedance traces, and thermal vias. Confirm the official ball map before schematic or footprint release because the supplied web snippets do not provide individual ball names. Use the same package geometry and ball numbering convention for any same-package comparison, and validate the land pattern against the manufacturer package drawing rather than relying on a generic BGA footprint.
Use controlled-impedance routing and maintain return-path continuity for high-speed clocks, memory interfaces, and fast user I/O. The verified data identifies 408 I/O but does not specify supported I/O standards, maximum toggle rates, output drive settings, input thresholds, or jitter limits. Obtain those values from the manufacturer documentation, apply appropriate source termination where required, and reserve test points for probing clocks, configuration signals, and representative high-speed lanes during bring-up.
Do not treat a suffix change such as -1, -1X, or -2X as proof of electrical interchangeability. Although the alternatives in this record share the reported 652-BGA package, the supplied cross-reference evidence does not provide a complete speed, temperature, configuration, or ball-map comparison. Before substituting any device, compare ordering code, package marking, voltage, timing grade, I/O capability, configuration interface, firmware compatibility, and operating temperature. A board redesign or requalification may be necessary if a candidate lacks any of the target part's requirements.
合規資訊
Compliance fields are unknown because the supplied Verified Web Data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status.