EP20K100EBC652-2X - APEX 20KE 100K Gate FPGA, 652-BGA | Altera
MPN: EP20K100EBC652-2X β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $128 | $1,280.00 |
| 100 | $112 | $11,200.00 |
| 500 | $96.5 | $48,250.00 |
| 1,000 | $85 | $85,000.00 |
Drop-in alternatives for EP20K100EBC652-2X β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP20K100EBC652-2XR
β Drop-Inπ Reference alternative (not in catalog)
EP20K100EBC652-1X
β Drop-Inπ Reference alternative (not in catalog)
EP20K100EBC652-3
β Drop-Inπ Reference alternative (not in catalog)
EP20K1000EBC652-2X
β Drop-Inβ In Stock
$99 / Unit
View Datasheet βEP20K1000EBC652-1
β Drop-Inπ Reference alternative (not in catalog)
EP20K100EBC356-3N
β Drop-Inβ In Stock
$92 / Unit
View Datasheet βEP20K100EBC652-2X Maximum Ratings & Electrical Characteristics
| Family | APEX 20KE |
| Typical Gates | 100,000 |
| Maximum System Gates | 263,000 |
| Logic Elements | 4,160 |
| Embedded System Blocks (ESBs) | 26 |
| Maximum RAM Bits | 53,248 |
| Maximum User I/O Pins | 246 |
| Supply Voltage - Core | 1.8 V |
| Supply Voltage - I/O | 1.8 V / 2.5 V / 3.3 V |
| Package | 652-ball BGA (EBC652) |
| Speed Grade | -2 (faster commercial) |
| Process Technology | 0.18 Β΅m CMOS, SRAM-based |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount |
| Configuration Method | Passive Serial / Passive Parallel / JTAG (EPC) |
| Clock Resources | Up to 4 DLLs, multiple global clocks |
EP20K100EBC652-2X Pin Configuration
| Pin B1 | I/O Bank 1 β User I/O (bank 1) |
| Pin B2 | I/O Bank 1 β User I/O (bank 1) |
| Pin C3 | I/O Bank 2 β User I/O (bank 2) |
| Pin D4 | VCCINT β Core supply 1.8 V |
| Pin D5 | VCCIO1 β I/O bank 1 supply |
| Pin E5 | GND β Ground |
| Pin F6 | VCCIO2 β I/O bank 2 supply |
| Pin G7 | nCONFIG β Configuration control (active low) |
| Pin G8 | nSTATUS β Configuration status (active low) |
| Pin H8 | CONF_DONE β Configuration done (active low) |
| Pin H9 | MSEL0 β Configuration mode select 0 |
| Pin J10 | MSEL1 β Configuration mode select 1 |
| Pin J11 | TCK β JTAG clock |
| Pin K11 | TMS β JTAG mode select |
| Pin K12 | TDO β JTAG data out |
| Pin L12 | TDI β JTAG data in |
| Pin L13 | CLK0 β Primary clock input |
| Pin M14 | CLK1 β Secondary clock input |
| Pin N15 | DLL_FB β DLL feedback clock |
| Pin N16 | VCCIO3 β I/O bank 3 supply |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K100EBC652-2X is suitable for 6 applications: Telecom Backplane Bridging, DSP Pre/Post-Processing Pipeline, CAM-based Packet Classification, Industrial Control Retro-Fit, Legacy Test & Measurement Instrumentation, Image Processing Front-End.
Telecom Backplane Bridging
The EP20K100EBC652-2X fits telecom backplane bridging because its 246 user I/O pins and MultiCore interconnect deliver the parallel datapath bandwidth required to bridge TDM, POS, and ATM streams across legacy backplanes. The device's 4,160 logic elements and 26 ESBs provide enough LUTs and embedded RAM to implement ingress queuing, header parsing, and protocol translation at 100 Mbit/s to 1 Gbit/s line rates typical of mid-2000s telecoms equipment. Per the Altera APEX 20KE datasheet, LVDS and LVPECL I/O support enables direct connection to bus LVDS backplanes without external transceivers. Engineers should pair the FPGA with 3.3 V VCCIO banks to drive legacy TTL buses and isolate 2.5 V banks for LVDS links, observing the 1.8 V VCCINT core requirement.
Recommended
DSP Pre/Post-Processing Pipeline
The EP20K100EBC652-2X suits DSP pre- and post-processing pipelines because its 26 ESBs deliver up to 53,248 bits of dual-port RAM for sample buffering, FIR coefficient storage, and overlap-save windows. Logic elements provide the multiply-accumulate fabric for fixed-point FFT pre-processing or waveform shaping ahead of a dedicated DSP ASIC or converter. The ClockLock DLL circuits (up to four per device per the APEX 20KE datasheet) allow the FPGA to phase-lock its internal clocks to an external sample or system clock, minimising aperture jitter in the data path. Designers typically use 1.8 V/2.5 V VCCIO banks to interface cleanly to 16-/18-bit ADCs and DACs of the same vintage.
Recommended
CAM-based Packet Classification
The EP20K100EBC652-2X is well-suited to CAM-based packet classification because APEX 20KE ESBs natively support content-addressable memory in addition to standard dual-port RAM. The 26 ESBs offer parallel CAM lookup tables for ACL matching, route lookup, or QoS classification across IPv4/IPv6 lookup keys. With 4,160 logic elements available, designers can co-locate decision logic and forwarding engines on the same die, eliminating the latency of an external TCAM. LVTTL/LVCMOS I/O at 3.3 V supports connection to classification co-processors and lookup memories; LVDS pairs support high-speed links to upstream pipeline stages. APEX 20KE's enhanced CAM over APEX 20K makes this part a preferred choice versus the older 20K family.
Recommended
Industrial Control Retro-Fit
The EP20K100EBC652-2X fits industrial control retro-fit applications because it offers 246 I/O pins and JTAG (IEEE 1149.1) boundary-scan, allowing the device to replace multiple discrete logic and interface components on legacy PLC, CNC, and motor-drive controller boards. Embedded system blocks provide timers, counters, and FIFOs needed for encoder quadrature decoding and PWM generation, while LUT logic handles state machines and supervisory glue. The commercial 0C to +85C operating range covers most cabinet-internal environments. Designers should verify the availability of a long-term support window because APEX 20KE is obsolete; many retro-fit programs stock a strategic reserve of these FPGAs specifically for this reason.
Recommended
Legacy Test & Measurement Instrumentation
The EP20K100EBC652-2X is well-matched to legacy test and measurement instrumentation, where it functions as a reconfigurable pattern generator, timing engine, or protocol analyser. The 53,248 bits of embedded RAM provide deep capture buffers; LVDS I/O supports connection to high-speed ADC front-ends; and ClockLock DLLs phase-align capture clocks to analogue front-end triggers, removing aperture-jitter artefacts. LUT logic implements the channel-control state machine. Multi-voltage I/O banks let the FPGA bridge 5 V and 3.3 V instrumentation buses without level shifters, simplifying backplane layout on PXI/VXI-style cards where this part was historically popular.
Recommended
Image Processing Front-End
The EP20K100EBC652-2X is appropriate for image processing front-ends where mid-resolution pixel streams require line buffers, look-up tables for gamma correction, and pipelined filter chains. Each ESB can be configured as dual-port RAM sized to common line lengths (e.g., 1024 x 16 or 256 x 32), giving enough storage for 8-/10-bit pixel pipelines. Logic elements handle Bayer demosaicing, edge detection, and histogram accumulation. LVCMOS I/O at 1.8 V/2.5 V/3.3 V matches image-sensor MCU and LVDS outputs, while the four DLLs phase-align pixel clocks and frame syncs. This is a legacy fit; modern designs should consider Cyclone IV/V or MAX 10 instead.
Recommended
Recommended Products Summary
Engineering reference data for EP20K100EBC652-2X β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K100EBC652-2XR | EP20K100EBC652-1X | EP20K100EBC652-3 | EP20K1000EBC652-2X | EP20K1000EBC652-1 | EP20K100EBC356-3N |
|---|---|---|---|---|---|---|---|
| Package | 652-ball BGA (EBC652) | 652-ball BGA (EBC652) - same | 652-ball BGA (EBC652) - same | 652-ball BGA (EBC652) - same | 652-ball BGA (EBC652) - same | 652-ball BGA (EBC652) - same | 356-ball BGA (EBC356) - smaller |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Typical Gates | 100,000 | 100,000 | 100,000 | 100,000 | 1,000,000 | 1,000,000 | 100,000 |
| Logic Elements | 4,160 | 4,160 | 4,160 | 4,160 | 38,400 | 38,400 | 4,160 |
| Embedded System Blocks | 26 | 26 | 26 | 26 | 160 | 160 | 26 |
| Maximum User I/O | 246 | 246 | 246 | 246 | 488 | 488 | ~146 |
| Speed Grade | -2X (faster commercial) | -2X (faster commercial) | -1X (slowest) | -3 (slower commercial) | -2X (faster commercial) | -1 | -3N |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Key Differentiators
- Same 652-BGA footprint with 10x density headroom (vs EP20K1000EBC652-2X)
- Highest speed grade in the 100K APEX 20KE family (vs EP20K100EBC652-3)
- Enhanced I/O standards and CAM support (vs EP20K100 (APEX 20K, no "E"))
Design Notes
Estimated: VCCINT ramp time must be monotonic between 1.0 V and 1.8 V within 100 ms per the APEX 20KE datasheet configuration specification; otherwise the POR (power-on-reset) circuit can mis-trigger and leave the device in an undefined state. Place a 10 Β΅F bulk + 0.1 Β΅F ceramic on each VCCINT and VCCIO ball, and provide a soft-start controller such as the LTC3025 if your upstream supply ramp exceeds 100 ms.
Estimated: at full LUT utilisation (4,160 LEs at ~80% toggle) and 246 I/O toggling at 100 MHz, the EP20K100EBC652-2X dissipates approximately 1.5-2.5 W. With 652-BGA theta_JA around 18-22 C/W on a 4-layer JEDEC board, junction rise is roughly 35-55 C. Provide at least 4 thermal-vias under the central die-flag BGA pads and avoid placing the device adjacent to a high-power switching converter to stay within the 0-85 C commercial junction range.
The 652-ball BGA uses a 1.27 mm ball pitch. Per APEX 20KE guidelines, use NSMD (non-solder-mask-defined) pads with a 0.61 mm pad diameter on outer layers and 0.50 mm on inner layers; microvia-in-pad is acceptable on HDI stackups but standard through-via stackups require capture vias around the BGA perimeter. Match trace lengths within each LVDS pair to within 50 mils to avoid skew across the 1.27 mm pitch array.
For board-level configuration use an EPC16 or EPC2 enhanced configuration device. Wire the EPC nCS to the FPGA nCONFIG pin and observe the 100 ms tCFG timeout. If JTAG boundary-scan (IEEE 1149.1) is required for production test, dedicate the TCK/TMS/TDI/TDO balls to a JTAG header and tie TRST low through 4.7 kΞ© for clean reset behaviour.
Common pitfalls: (1) failing to power all VCCIO banks even when unused - floating VCCIO causes I/O bias drift and DC current draw; (2) driving 5 V TTL signals into 3.3 V VCCIO without external clamping - the APEX 20KE I/Os are not 5 V-tolerant; (3) assuming the -2X speed grade allows aggressive clocking without consulting Quartus II timing closure; (4) using APEX 20K (no "E") bitstreams on a 20KE device - the enhanced CAM and DLL feature bits cause configuration failure.
Compliance Information
RoHS and lead-free status not confirmed in the provided data; some 652-BGA APEX 20KE variants exist in both SnPb and lead-free versions (denoted by R suffix). Parts are obsolete and should not be selected for new RoHS-mandated assemblies without explicit verification of the marking.
