EP20K300EBC652-2 - APEX-20KE FPGA | Altera | Embedded Systems
MPN: EP20K300EBC652-2 ✗ Cuối đờiEP20K300EBC652-2 Tóm tắt
An FPGA is a semiconductor integrated circuit whose logic function is defined by configuration rather than fixed mask programming. FPGAs combine programmable lookup-table or macro logic, routing resources, memory, and I/O cells. In the broader electronics hierarchy, this places the device between a programmable logic device and a system-level digital implementation technology. The APEX-20KE family uses a 1.8 V-oriented platform, making the part suitable for designs that require configurable digital blocks without the fixed function constraints of an application-specific integrated circuit.
The principal verified features are 1152 macros, 147456 total RAM bits, 11520 logic cells as reported by the DigiKey Marketplace result, and 408 I/O pins. The 652-BGA package provides a large ball-grid-array interface for high pin-count designs, while the 45 mm by 45 mm package dimensions are important for land-pattern, routing, and thermal planning. The 1.71 V to 1.89 V supply range should be treated as a system-level input requirement, and the exact board power implementation should be validated against the complete manufacturer documentation.
The architecture is associated with configurable logic resources, embedded memory, programmable routing, and programmable I/O. The reported macro count and memory capacity indicate a high-density device intended for designs that would otherwise require several smaller programmable devices or substantial discrete logic. Because the provided search data does not include clock frequency, transceiver count, temperature grade, or configuration interface details, those characteristics are deliberately left for datasheet verification rather than inferred.
Typical applications include industrial automation controllers, communications equipment, test and measurement systems, image or protocol processing, and embedded control platforms. In these systems, the FPGA can implement parallel datapaths, interface adaptation, state machines, and memory-intensive digital functions. The 408 I/O count is especially relevant where many external buses, sensors, converters, or control signals must be connected.
Designers should confirm the configuration method, I/O banking, supported I/O standards, timing constraints, power sequencing, and operating temperature in the manufacturer datasheet before schematic release. A 652-ball BGA requires controlled-impedance routing, a suitable multilayer PCB, escape routing, and assembly capability. Pin-to-pin substitution should be limited to devices with verified package, ball map, speed, voltage, and configuration compatibility.
This page combines verified distributor specifications, package information, cross-reference evidence, and application-oriented design guidance. It does not invent unsupported timing, temperature, or electrical values; unavailable engineering details are identified in the specification list for follow-up verification.
Bộ thay thế dễ dàng lắp đặt cho EP20K300EBC652-2 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP20K300EBC652-2 (cùng hình factor và footprint) — khác nhau ở Total RAM Bits, Process Technology, Operating Temperature, Series, Family.
EP20K300EBC652-1
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K300EBC652-1X
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K300EBC652-2X
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K200EBC652-2X
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K100EBC652-2X
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K300EBC652-2 Tỷ lệ tối đa & tính chất điện
| Product Type | Field Programmable Gate Array (FPGA) |
| Device Family | APEX-20KE |
| Logic Cells | 11520 |
| Macros | 1152 |
| Total RAM Bits | 147456 bits |
| I/O Count | 408 |
| Điện áp cung cấp | 1.71 V to 1.89 V |
| Hộp | 652-BGA |
| Package Dimensions | 45 mm x 45 mm |
| Technology | 0.22 um (reported for family variant) |
| Tần số xung maksimum | 350 MHz (reported for family variant) |
| Configuration Technology | SRAM-based programmable logic (family description) |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
Hướng dẫn cấu hình chân EP20K300EBC652-2 45 mm x 45 mm
Cấu hình chân cho EP20K300EBC652-2 (45 mm x 45 mm gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP20K300EBC652-2.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP20K300EBC652-2 phù hợp cho 6 Áp dụngs: Industrial Automation Controller, Communications Interface Aggregation, Test and Measurement Instrument, Embedded Vision and Image Processing, Medical Diagnostic Equipment, Legacy Embedded Platform and Interface Bridge.
Industrial Automation Controller
EP20K300EBC652-2 fits industrial automation controllers that require a high-density programmable logic device with 408 I/O. The reported 1152 macros and 147456 RAM bits can support machine-state control, parallel sensor aggregation, timing functions, and communication-interface adaptation. The 1.71 V to 1.89 V supply range must be implemented with controlled decoupling and verified sequencing. Because industrial temperature and qualification data are not supplied, the exact operating environment must be confirmed before field deployment.
Được đề xuất
Communications Interface Aggregation
EP20K300EBC652-2 is suitable for communications equipment that must combine multiple data sources, implement protocol conversion, or provide flexible timing and buffering. Its 408 I/O can connect several external interfaces, while 147456 total RAM bits provide storage for packets, lookup tables, and intermediate data. The 652-BGA package supports a large pin-count implementation but requires a multilayer PCB and controlled routing. The supplied data does not state transceiver or maximum-clock specifications, so interface rates require datasheet validation.
Được đề xuất
Test and Measurement Instrument
EP20K300EBC652-2 can serve as the programmable digital core of a test and measurement instrument. The FPGA can implement parallel acquisition control, waveform sequencing, data formatting, trigger logic, and interface bridging. The reported 1152 macros and 11520 logic cells support substantial custom logic, while 408 I/O provide connectivity to converters, front ends, clocks, and host systems. The 652-BGA 45 mm by 45 mm package creates demanding routing and thermal requirements, and signal-integrity limits must be verified from the official datasheet.
Được đề xuất
Embedded Vision and Image Processing
EP20K300EBC652-2 fits embedded image-processing systems requiring configurable pixel pipelines, frame buffering, and parallel arithmetic. Its 147456 RAM bits can support selected line buffers, lookup tables, or intermediate storage, and the 1152 macros can implement filtering, control, and interface functions. The 408 I/O count helps connect image sensors, memories, converters, and host processors. The provided data does not specify supported memory interfaces or clock limits, so the actual sensor and memory bandwidth must be validated before architecture selection.
Được đề xuất
Medical Diagnostic Equipment
EP20K300EBC652-2 can be evaluated for medical diagnostic equipment where configurable digital processing, data capture, and multiple interfaces are needed. The 408 I/O may connect sensors, analog-to-digital converters, displays, communication controllers, and safety-related control logic. Embedded memory of 147456 bits supports selected buffering and control functions, but a medical design must verify reliability, temperature, lifecycle, and regulatory requirements from authoritative documentation. The supplied data does not establish medical qualification, so compliance must not be inferred.
Được đề xuất
Legacy Embedded Platform and Interface Bridge
EP20K300EBC652-2 is appropriate for maintaining or extending legacy embedded platforms that already depend on the APEX-20KE architecture. The device can implement interface bridges, glue-logic replacement, protocol adaptation, and custom control functions while retaining a 652-BGA land pattern when an existing board is designed for this family. Its 408 I/O and 147456 RAM bits provide substantial integration capability. Before substituting a suffix variant, verify the exact speed grade, ordering code, configuration method, and environmental requirements.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP20K300EBC652-2 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP20K300EBC652-1 | EP20K300EBC652-1X | EP20K300EBC652-2X | EP20K200EBC652-2X | EP20K100EBC652-2X |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 652-BGA, 45 mm x 45 mm | 652-BGA | 652-BGA | 652-BGA | 652-BGA | 652-BGA |
| Product Type | APEX-20KE FPGA | APEX family FPGA | APEX family FPGA | APEX family FPGA | APEX family FPGA | APEX family FPGA |
Bảo phân biệt quan trọng
- Higher target family capacity positioning (vsEP20K200EBC652-2X)
- Large BGA interface (vsEP20K200EBC652-2X)
- Resource and memory integration (vsEP20K100EBC652-2X)
Ghi chú thiết kế
Implement the reported 1.71 V to 1.89 V core supply with the voltage tolerance, sequencing, and decoupling values specified by the complete manufacturer datasheet. The supplied data does not provide separate I/O or auxiliary rail requirements, so do not assume that the reported range covers every power input. Use a low-impedance power distribution network, place local decoupling near the relevant supply balls, and verify startup behavior, brownout limits, and simultaneous-switching noise on the assembled board.
The 652-BGA, 45 mm by 45 mm package requires early PCB planning for escape routing, layer stack-up, via-in-pad or dog-bone fanout, controlled-impedance traces, and thermal vias. Confirm the official ball map before schematic or footprint release because the supplied web snippets do not provide individual ball names. Use the same package geometry and ball numbering convention for any same-package comparison, and validate the land pattern against the manufacturer package drawing rather than relying on a generic BGA footprint.
Use controlled-impedance routing and maintain return-path continuity for high-speed clocks, memory interfaces, and fast user I/O. The verified data identifies 408 I/O but does not specify supported I/O standards, maximum toggle rates, output drive settings, input thresholds, or jitter limits. Obtain those values from the manufacturer documentation, apply appropriate source termination where required, and reserve test points for probing clocks, configuration signals, and representative high-speed lanes during bring-up.
Do not treat a suffix change such as -1, -1X, or -2X as proof of electrical interchangeability. Although the alternatives in this record share the reported 652-BGA package, the supplied cross-reference evidence does not provide a complete speed, temperature, configuration, or ball-map comparison. Before substituting any device, compare ordering code, package marking, voltage, timing grade, I/O capability, configuration interface, firmware compatibility, and operating temperature. A board redesign or requalification may be necessary if a candidate lacks any of the target part's requirements.
Thông tin tuân thủ
Compliance fields are unknown because the supplied Verified Web Data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status.