EP20K400FC784-1 - APEX 20K 400K-Gate FPGA 784-BGA | Altera
MPN： EP20K400FC784-1 ✗ 停產EP20K400FC784-1 概覽
An APEX 20K device is a fine-grained, multi-vendor architecture (MVAA) PLD that combines look-up table (LUT)-based logic, embedded array blocks (EABs) for memory, and a high-bandwidth interconnect. In the broader taxonomy, the APEX 20K is a high-density FPGA positioned between the older FLEX 10K and the later Stratix families, optimized for data-path and DSP-style functions on a single programmable die.
Key features include 212 Kbits of embedded SRAM, four dedicated clock inputs, multiVolt I/O supporting 1.8 V/2.5 V/3.3 V interfaces, JTAG boundary-scan test, and an embedded PLL for clock multiplication and skew management. The device supports in-system configuration via serial or parallel configuration modes using Altera MAX+PLUS II or Quartus design tools.
The APEX 20K architecture combines four-input LUTs grouped into Logic Array Blocks (LABs) with EABs that can implement dual-port RAM, ROM, FIFOs, and multiplier functions. This heterogeneous fabric, the first of its kind in the industry when introduced, allows efficient implementation of both control logic and data-path arithmetic on the same device. Designers can allocate logic and memory density independently to optimize silicon utilization.
Typical applications include telecommunications line-card processing, ASIC prototyping, high-speed data acquisition front-ends, and DSP co-processing. The combination of high logic density, embedded memory, and flexible I/O made the APEX 20K family a popular platform for telecom infrastructure and test equipment in the early 2000s.
When designing with this device, allocate configuration pins carefully: dedicated configuration, JTAG, and clock pins have fixed locations and cannot be repurposed. The 784-ball PBGA package requires a 1.27 mm ball pitch PCB layout with controlled-impedance routing for high-speed I/O. Always consult the APEX 20K datasheet before designing the power decoupling network, as the device has multiple VCC rails (core, I/O banks, PLL).
This page synthesizes Altera APEX 20K family specifications, alternative sourcing options, and PCB layout guidance not found in the original manufacturer datasheet. Engineers seeking an EP20K400FC784-1 replacement should review the alternatives section, which lists same-package APEX 20K variants with identical ball maps.
直接替換替代品，適用於 EP20K400FC784-1 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP20K400FC784-1 （相同外形與佔位） — 差異在於 Process Technology, Speed Grade, Package, Logic Elements, Family.
EP20K400EFC784-1
✅ 直接替換📋 參考替代品（不在目錄中）
EP20K400FC784-2
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP20K400FC784-3
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP20K400FC784-1N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP20K600FC784-1
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP20K400FC784-1 最大額定值與電氣特性
| Family | APEX 20K |
| Logic Elements / Gates | 400,000 gates (typical) |
| Embedded Memory | 212 Kbits |
| Maximum Operating Frequency | 6.1 GHz |
| Nominal Core Supply Voltage | 2.5 V |
| Core Voltage Range | 2.375 V to 2.625 V |
| I/O Voltage Support | 1.8 V / 2.5 V / 3.3 V (multiVolt I/O) |
| Dedicated Clock Inputs | 4 |
| PLL | Embedded |
| Configuration Interface | Serial / Parallel / JTAG |
| 封裝 | 784-ball PBGA (FC784) |
| Package Code | S-PBGA-B784 |
| Terminal Pitch | 1.27 mm |
| 安裝類型 | Surface Mount |
| Operating Temperature Grade | Commercial (per part suffix -1) |
EP20K400FC784-1 s-pbga-b784 腳位配置指南
EP20K400FC784-1（s-pbga-b784 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP20K400FC784-1.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP20K400FC784-1 適用於 6 應用s: Telecommunications Line-Card Processing, ASIC Prototyping and Emulation, High-Speed Data Acquisition Front-End, DSP Co-Processing and Filtering, Test and Measurement Instrumentation, Industrial Control and Automation.
Telecommunications Line-Card Processing
The EP20K400FC784-1 was widely adopted in early-2000s telecom line cards for packet processing, framing, and protocol termination. The 400K-gate logic density plus 212 Kbits of embedded SRAM supports wide data-path functions, while multiVolt I/O at 1.8V/2.5V/3.3V interfaces directly to backplane SerDes and PHY devices. Designers typically instantiate dual-port FIFOs in the EABs to bridge clock domains between line-side and backplane logic, and the embedded PLL synthesizes multiple clock domains from a single board reference. Compared with discrete ASIC prototypes, the APEX 20K reduced time-to-market and allowed in-system JTAG reconfiguration.
推薦
ASIC Prototyping and Emulation
The EP20K400FC784-1 served as a high-density prototyping platform for validating ASIC designs before tape-out. Its 400K gates map many mid-complexity ASICs in a single device, and the LAB + EAB architecture supports both random logic and embedded memory blocks. Engineers use the JTAG interface with MAX+PLUS II or Quartus II to iterate quickly. Pin-compatible 600K-gate variants (EP20K600FC784-1) allow scaling designs within the same FC784 PCB footprint. The 784-ball PBGA with 1.27 mm pitch supports high I/O count for ASIC boundary emulation.
推薦
High-Speed Data Acquisition Front-End
In data-acquisition systems, the EP20K400FC784-1 functions as the FPGA pre-processing stage between analog-to-digital converters and downstream processors. The 212 Kbits of EAB memory implement high-speed sample buffers and digital down-conversion (DDC) chains, while the 400K-gate fabric handles channel synchronization and trigger logic. The maximum 6.1 GHz toggle rate supports parallel processing of multi-channel ADC data. The multiVolt I/O banks allow direct interfacing to LVDS and CMOS ADC outputs at 1.8V or 3.3V without external level translation.
推薦
DSP Co-Processing and Filtering
The EP20K400FC784-1 implements digital signal processing functions including FIR/IIR filters, FFT engines, and modulation/demodulation chains. Its embedded array blocks (EABs) realize high-throughput multipliers and shift-register structures, while the LAB fabric handles control sequencing. With 6.1 GHz maximum toggle rate, multiple parallel filter taps run simultaneously, and the embedded PLL provides the precise clock multiplication required for sample-rate conversion. The 784-ball PBGA provides enough I/O for multi-channel DSP interfaces with external converters.
推薦
Test and Measurement Instrumentation
The EP20K400FC784-1 was used in test equipment to implement arbitrary waveform generators, pattern generators, and protocol analyzers. Its combination of logic density and embedded memory enables integration of stimulus generation, response capture, and trigger sequencing on a single device. The JTAG boundary-scan support simplifies board-level test integration, and the in-system programmability allows field upgrades. The multiVolt I/O interfaces with legacy and modern test buses at 1.8V, 2.5V, or 3.3V levels, avoiding external level shifters.
推薦
Industrial Control and Automation
The EP20K400FC784-1 serves as a programmable logic controller (PLC) co-processor in industrial automation systems, handling real-time I/O, encoder decoding, and motion-control algorithms. Its deterministic logic fabric supports hard real-time response, and the 400K gates integrate entire motion-control loops on one device. The EABs implement position-capture buffers and look-up tables for non-linear control curves, while the LAB fabric runs PID and state machines. Pin-compatible variants including EP20K400EFC784-1 reduce power in thermally constrained enclosures.
推薦
推薦產品摘要
工程參考資料，適用於 EP20K400FC784-1 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP20K400EFC784-1 | EP20K400FC784-2 | EP20K400FC784-3 | EP20K400FC784-1N | EP20K600FC784-1 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 784-ball PBGA (FC784) | 784-ball PBGA (FC784) - same | 784-ball PBGA (FC784) - same | 784-ball PBGA (FC784) - same | 784-ball PBGA (FC784) - same | 784-ball PBGA (FC784) - same |
| Logic Density (gates) | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 | 600,000 |
| Core Voltage | 2.5 V (2.375-2.625 V) | 1.8 V (1.71-1.89 V) | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | -1 (fastest) | -1 | -2 | -3 | -1 | -1 |
| Pin-to-Pin Compatible | Yes | Yes (VCCINT rail change) | Yes | Yes | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Highest speed grade in the 400K-gate FC784 family (對比EP20K400FC784-2)
- Standard 2.5V core supply (對比EP20K400EFC784-1)
- Full 400K gate utilization (對比EP20K600FC784-1)
設計說明
The EP20K400FC784-1 requires separate VCCINT (2.5 V core) and VCCIO (1.8 V/2.5 V/3.3 V I/O bank) rails with bulk decoupling of 100 uF tantalum plus 0.1 uF and 0.01 uF ceramics at each power pin pair. The PLL analog supply (VCC_PLL) must be filtered with a ferrite bead and decoupled with 10 uF + 0.1 uF. Estimated: idle ICC at 400K-gate utilization reaches ~500 mA on VCCINT and rises with toggle rate; full-power designs may exceed 1.5 A on VCCINT.
The 784-ball PBGA uses 1.27 mm ball pitch requiring microvia or via-in-pad PCB technology with 0.6 mm pad diameter. Route signal escapes with dog-bone fanouts or skip-2 trace routing. Maintain 50 ohm controlled impedance for high-speed LVDS pairs. Provide at least 4 inner ground planes with stitched ground vias around the BGA perimeter to control return paths and EMI. Thermal vias under the die attach area are essential - the FC784 dissipates several watts under typical loading.
Do not apply I/O voltage before VCCINT - the APEX 20K datasheet requires VCCINT to reach its operating range first to avoid I/O buffer latch-up. Confirm configuration mode (FPP, PS, AS, JTAG) before PCB layout because MODE and MSEL pins are dedicated balls. All unused I/O pins must be left floating or programmed as outputs driving '0' to minimize power and noise. Confirm the JTAG chain order if multiple Altera devices share TCK/TMS/TDI/TDO.
Estimated: under worst-case toggle activity, the EP20K400FC784-1 may dissipate 3-5 W. The FC784 PBGA requires a thermal pad or copper flood beneath the package connected through thermal vias to inner planes. Without thermal management, junction temperature can exceed 100 C under continuous operation, reducing reliability. Use a low-thermal-resistance PCB stackup and consider a heatsink for high-utilization designs.
合規資訊
RoHS/REACH compliance not stated in available distributor data. EP20K400FC784-1 is obsolete; lead-free variants such as EP20K400FC784-1N exist in the same FC784 ball map. AEC-Q100 not applicable for FPGA.
