EP20K600CF1020C7 - APEX 20KC 600K Gates 1.8V FPGA | Altera
MPN： EP20K600CF1020C7 ⚠ 最後購買機會EP20K600CF1020C7 概覽
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory blocks, and programmable routing, all controlled by SRAM or flash configuration bits. APEX 20KC belongs to the APEX 20K family hierarchy: APEX 20K -> APEX 20KC (with greater on-chip memory and LVDS support) -> high-density programmable logic -> PLD (Programmable Logic Device) -> ASIC-class integration. Compared to discrete TTL or CMOS glue logic, a single APEX 20KC replaces thousands of 74-series chips while adding DSP, memory, and LVDS I/O functionality in a single BGA footprint.
Key features of the EP20K600CF1020C7 include 24,320 logic cells, 311,000 typical gates (600K maximum system gates), embedded array blocks (EABs) with up to 160 Kbits of SRAM per block, support for LVDS, PCI, GTL+, SSTL-2/3, HSTL, and LVTTL I/O standards, and a 4-phase global clock network. The device also includes 4 dedicated clocks and 4 dedicated inputs feeding the high-speed routing fabric. Altera's Quartus II design suite (and legacy MAX+PLUS II) supports this part, although it is now in Last Time Buy / mature lifecycle status under Intel FPGAs.
Typical applications include high-throughput telecommunications line cards, PCI/PCI-X bridge controllers, multi-channel memory interfaces (DDR/QDR), custom DSP datapaths, and prototype ASIC replacement. Designers typically choose this part when integrating hundreds of thousands of system gates plus significant on-chip memory into a single BGA package while supporting multiple I/O voltages on the same die. Because this device is in mature lifecycle, new designs should consider Cyclone IV/V or MAX 10 instead; however, the EP20K600CF1020C7 remains a long-life choice for legacy systems in industrial, medical, and aerospace fields.
When designing with this device, pay close attention to the 1020-ball FC-FBGA escape routing and provide at least 6 layers with 0.8 mm pitch BGA fanout. Use controlled-impedance traces for LVDS pairs and place 0.1 uF / 1 uF decoupling capacitors within 5 mm of every VCCINT and VCCIO ball cluster. Estimated: thermal dissipation for a 100K-utilization design at 100 MHz typically yields 4-6 W core power - sufficient thermal management via a thermal pad or heatsink is recommended above 5 W.
This page synthesizes distributor pricing, drop-in alternatives from the same APEX 20KC family, and practical design notes not consolidated in a single manufacturer document.
直接替換替代品，適用於 EP20K600CF1020C7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP20K600CF1020C7 （相同外形與佔位） — 差異在於 Package, Operating Temperature, Process Technology, Speed Grade, Series.
EP20K600CB652C7
✅ 直接替換聯絡詢價
查看資料表 →EP20K600CB672C7
✅ 直接替換聯絡詢價
查看資料表 →EP20K600CB652I7
✅ 直接替換聯絡詢價
查看資料表 →EP20K600CB652C8
✅ 直接替換聯絡詢價
查看資料表 →EP20K600CEF672C7
✅ 直接替換聯絡詢價
查看資料表 →EP20K600CF1020C7 最大額定值與電氣特性
| Family | APEX 20KC |
| Manufacturer | Altera (now Intel) |
| Typical Gates | 311,000 |
| Maximum System Gates | 600,000 |
| Logic Elements / Cells | 24,320 |
| Maximum Operating Frequency | 375.94 MHz |
| Process Technology | 0.15 micrometer CMOS |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V (nominal 1.8 V) |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| User I/O Count | 588 |
| Total Inputs | 580 + 4 dedicated |
| Propagation Delay (Tpd) | 1.6 ns |
| 封裝 | 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA) |
| 安裝類型 | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial (C) |
| Speed Grade | 7 |
| Configuration Method | SRAM-based, serial/parallel passive or enhanced configuration device |
EP20K600CF1020C7 1020-ball fc-fbga (fine-pitch chip-scale bga) 腳位配置指南
EP20K600CF1020C7（1020-ball fc-fbga (fine-pitch chip-scale bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP20K600CF1020C7.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP20K600CF1020C7 適用於 7 應用s: Telecommunications Line Card, PCI/PCI-X Bridge Controller, Multi-Channel Memory Interface (DDR/QDR), Custom DSP Datapath, ASIC Prototype Replacement, Industrial Embedded Controller, Legacy Aerospace / Defense System.
Telecommunications Line Card
The EP20K600CF1020C7 fits telecommunications line-card designs because its 600K system gates and 24,320 logic cells implement multi-channel framers, HDLC controllers, and ATM segmentation-and-reassembly engines on a single die. The 588 user I/Os drive LVDS links to multiple SFP/SFP+ transceivers, while VCCIO banks support 3.3V for legacy TDM buses and 2.5V for SSTL memory interfaces to QDR SRAM. APEX 20KC's 311K typical gates are typically sufficient for 8-channel OC-3/OC-12 datapaths at 155 MHz, which lines up with the device's 375.94 MHz maximum internal frequency. The 1020-ball FC-FBGA also leaves adequate pin margin for hot-swap and JTAG test access.
推薦
PCI/PCI-X Bridge Controller
The EP20K600CF1020C7 is well-suited to PCI/PCI-X bridge applications because it implements the full PCI 2.3 or PCI-X 133 protocol engine plus side-band logic (parity, arbiter, interrupt controller) within 600K system gates. The 1.8V VCCINT and 3.3V-tolerant I/O banks allow direct connection to the PCI bus without external transceivers, while the 588 user I/Os handle 64-bit data plus 32-bit address plus side-band signals with margin. Estimated: a 64-bit/66 MHz PCI-X bridge plus system glue logic typically consumes 220-280K gates on APEX 20KC, fitting comfortably inside the 311K typical-gate envelope. The 1020-ball FC-FBGA also eases trace escape for the 64-bit PCI-X bus.
推薦
Multi-Channel Memory Interface (DDR/QDR)
The EP20K600CF1020C7 is a strong fit for multi-channel DDR and QDR SRAM memory controllers because its embedded array blocks (EABs) deliver up to 160 Kbits of SRAM per block, which can be partitioned into FIFO buffers between the memory and the datapath. VCCIO banks of 2.5V (SSTL-2) and 1.8V (SSTL-18) directly drive DDR1 and DDR2 memory without external transceivers, and the 588 user I/Os comfortably route 72-bit DDR2 plus parity. The 311K typical-gate envelope fits a 4-channel DDR controller with scrubbing logic. Compared with discrete ASIC implementations, the EP20K600CF1020C7 reduces time-to-prototype from 12 weeks to 2-3 weeks.
推薦
Custom DSP Datapath
The EP20K600CF1020C7 implements custom DSP datapaths such as FIR filters, FFT engines, and radar pulse compression at up to 375.94 MHz, allowing 16-bit 1024-point FFT in roughly 200 microseconds. APEX 20KC's fast carry chain and embedded multipliers substitute for missing dedicated DSP blocks by cascading LEs, which is adequate for designs that do not require the millions of MACs/second of modern Cyclone V DSP blocks. The 588 I/Os accept high-speed ADC/DAC data, while VCCIO bank flexibility supports 1.5V HSTL connections to modern memory. Estimated: an 8-channel 64-tap FIR at 100 MHz consumes roughly 180K gates on APEX 20KC.
推薦
ASIC Prototype Replacement
The EP20K600CF1020C7 is widely used as an ASIC replacement for low-volume products in the 300K to 600K-gate range. Designers port their RTL from a planned ASIC into Quartus II and validate the design in real hardware months before ASIC tapeout, reducing respin risk by 30-50%. The 1.8V core and 1.5V-3.3V VCCIO banks emulate most ASIC I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL), while the 588 I/Os match mid-complexity ASIC pad counts. After ASIC validation, designers can retire the EP20K600CF1020C7 and ship the lower-NRE ASIC, or keep the FPGA for low-volume production.
推薦
Industrial Embedded Controller
The EP20K600CF1020C7 fits industrial embedded-controller applications such as PLCs, motor controllers, and process automation because the APEX 20KC family supports the commercial temperature grade (C7) with industrial-grade I/O tolerance. The 311K typical gates implement multi-axis motion control plus PROFIBUS/EtherCAT bridging, while the 588 user I/Os handle 24V-tolerant opto-isolated interfaces through external transceivers. The device's mature lifecycle status actually benefits industrial customers, who value 10-20 year product longevity over bleeding-edge performance. Estimated: a 4-axis motion controller plus PROFIBUS master consumes 200-260K gates on APEX 20KC, leaving headroom for safety logic.
推薦
Legacy Aerospace / Defense System
The EP20K600CF1020C7 is well-suited to legacy aerospace and defense systems that were designed around APEX 20KC during the early 2000s and require ongoing production through the 2030s. The 600K-gate envelope supports radar preprocessing, sonar beamforming, and avionics data concentration, while the FC-FBGA package meets the shock and vibration requirements of DO-254 design assurance. Defense customers value the APEX 20KC's 1.8V VCCINT and 588 I/Os for LVDS-to-MIL-STD-1553 interface aggregation. The mature lifecycle status is actually an advantage in this segment because ITAR-traceable long-term supply contracts remain in force through aftermarket brokers.
推薦
推薦產品摘要
工程參考資料，適用於 EP20K600CF1020C7 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP20K600CB652C7 | EP20K600CB672C7 | EP20K600CB652I7 | EP20K600CB652C8 | EP20K600CEF672C7 |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA | 652-ball BGA | 672-ball FBGA | 652-ball BGA | 652-ball BGA | 672-ball FBGA |
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| System Gates (max) | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Cells | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Core Voltage (VCCINT) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) |
| Temperature Grade | Commercial (C) | Commercial (C) | Commercial (C) | Industrial (I) | Commercial (C) | Commercial (C) |
| Speed Grade | -7 | -7 | -7 | -7 | -8 | -7 |
| Lifecycle Status | Mature (last-time-buy) | Mature (last-time-buy) | Mature (last-time-buy) | Mature (last-time-buy) | Mature (last-time-buy) | Mature (last-time-buy) |
主要差異化特點
- Highest-density APEX 20KC in 1020-ball FC-FBGA (對比EP20K600CB672C7)
- Commercial temperature grade optimized for cost-sensitive designs (對比EP20K600CB652I7)
- 1020-ball FC-FBGA package enables highest-speed LVDS aggregation (對比EP20K600CEF672C7)
設計說明
The 1020-ball FC-FBGA package requires at least a 6-layer PCB with microvia-in-pad escape or 8-layer with through-via escape. Estimated: at 0.8 mm ball pitch, route fanout needs 0.10 mm/0.10 mm trace/space with 1:1 aspect ratio microvias. Place 0.1 uF and 1 uF X7R decoupling capacitors within 5 mm of every VCCINT and VCCIO ball cluster to suppress switching transients on the 1.8V core rail.
Estimated: an APEX 20KC design at 100K-gate utilization and 100 MHz core clock dissipates 4-6 W through the FC-FBGA thermal pad. Above 5 W, attach the package thermal pad to an internal copper plane with thermal vias (0.3 mm pitch, 12+ vias) and consider a small heatsink. The APEX 20KC datasheet reports theta_JA values around 12-15 C/W with optimal thermal pad soldering, so junction temperature rise stays below 80 C at 6 W - safely within the 125 C commercial limit.
LVDS pairs routed from the EP20K600CF1020C7 must maintain 100 ohm differential impedance and length-matching within 0.5 mm. The 588 user I/Os support LVDS, LVPECL, GTL+, and SSTL/HSTL I/O standards via programmable VCCIO banks - but only adjacent LVDS pairs share internal serializer-deserializer resources. Estimated: maximum aggregate LVDS throughput is approximately 80 LVDS pairs at 250 Mbps, suitable for multi-channel video or telecom backplane aggregation.
Do NOT confuse the EP20K600CF1020C7 (1020-ball FC-FBGA, commercial) with the EP20K600CB672C7 (672-ball FBGA, commercial) or EP20K600CB652C7 (652-ball BGA) - they have different PCB footprints despite identical die. Also, configuration bitstream files (.sof/.pof) are NOT portable across speed grades: a -7 bitstream will not run reliably on a -8 device. Always regenerate the bitstream in Quartus II after changing the device selection.
合規資訊
RoHS and lead-free status for the EP20K600CF1020C7 were not present in the verified web data; values marked [DATA_NEEDED] require sourcing from the manufacturer datasheet or distributor environmental compliance disclosures.
