EP20K400CF672C8 - APEX 20K 400K Gates FPGA 652-BGA | Intel
MPN： EP20K400CF672C8 ✗ 停產EP20K400CF672C8 概覽
What is an FPGA: A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. FPGAs occupy the top of the programmable logic hierarchy, sitting above CPLDs and below custom ASICs, and are widely used for parallel DSP, glue logic, and rapid prototyping in telecom, industrial, and military systems.
Key features: 400K system gates, 16,640 LEs, 212,992 RAM bits, 488 max user I/Os, MultiCore architecture combining look-up table (LUT) logic with embedded array blocks (EABs), 2.5V core supply, in-system programmability via SRAM configuration, and industrial temperature grade (0C to 85C). The 672-ball FineLine BGA exposes a wide I/O count while keeping PCB routing manageable.
Technical depth: The APEX 20KC MultiCore architecture integrates a fine-grained LUT fabric optimized for high-speed combinational and registered logic with coarse-grained EABs that implement RAM, ROM, multipliers, and CAM in densities up to 2,048 bits per block. Distributed embedded array blocks reduce die area versus pure register-based architectures while delivering 2.5ns propagation delay for the targeted speed grade (C8).
Typical applications: high-bandwidth telecommunication line cards, network switches and routers, ASIC prototyping, DSP co-processing, and industrial control systems requiring parallel wide-word arithmetic.
Design consideration: the 652-ball FineLine BGA requires a multi-layer PCB with controlled-impedance routing, microvia stack-ups, and matched-length tracking for LVDS or SSTL interfaces; signal-integrity simulation is recommended for buses above 100 MHz.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone datasheet.
直接替換替代品，適用於 EP20K400CF672C8 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP20K400CF672C8 （相同外形與佔位） — 差異在於 Operating Temperature, Process Technology, Package, Speed Grade, Family.
EP20K400CF672C7
✅ 直接替換聯絡詢價
查看資料表 →EP20K400CF672C-8
✅ 直接替換聯絡詢價
查看資料表 →EP20K400CF672C-7
✅ 直接替換聯絡詢價
查看資料表 →EP20K400CF672C7N
✅ 直接替換聯絡詢價
查看資料表 →EP20K400CF672C7ES
✅ 直接替換聯絡詢價
查看資料表 →EP20K400CF672C7GA
✅ 直接替換聯絡詢價
查看資料表 →EP20K400CF672C8 最大額定值與電氣特性
| Family | APEX 20KC |
| Series | APEX 20K |
| System Gates | 400,000 |
| Logic Elements | 16,640 |
| Max User I/Os | 488 |
| Embedded RAM Bits | 212,992 |
| Macros | 1,664 |
| Core Voltage | 2.5 V |
| Logic Family | CMOS |
| Propagation Delay | 2.5 ns |
| 封裝 | 672-ball FineLine BGA (FC-FBGA) |
| Package Type Code | BGA-652 |
| 工作溫度 | 0C to 85C |
| Speed Grade | C8 |
| 安裝類型 | Surface Mount |
EP20K400CF672C8 bga-652 腳位配置指南
EP20K400CF672C8（bga-652 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP20K400CF672C8.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP20K400CF672C8 適用於 6 應用s: Telecommunication Line Cards, ASIC Prototyping and Emulation, Industrial Control and Automation, DSP Co-Processing, Network Switches and Routers, Military and Aerospace Embedded Systems.
Telecommunication Line Cards
The EP20K400CF672C8 fits telecom line-card designs because its 400,000 system gates and 1,664 embedded array blocks provide the parallel fabric needed for high-speed packet processing, ATM cell assembly, and multi-channel TDM framing. The 488 user I/Os comfortably route 8-bit UTOPIA buses plus multiple E1/T1 framers without external mux logic. Its 2.5ns propagation delay enables glue-logic and framer interfaces at 77 MHz, and the 672-ball BGA exposes enough I/O to support both LVTTL control and LVDS backplane interconnect on the same PCB.
推薦
ASIC Prototyping and Emulation
With 16,640 logic elements, 212,992 RAM bits, and MultiCore LUT+EAB architecture, the EP20K400CF672C8 has long been favored for ASIC prototyping and pre-silicon emulation of mid-complexity ASICs. Engineers map RTL designs into Quartus II and use the EAB blocks to emulate SRAM and FIFO macros, accelerating verification before tape-out. The 672-ball BGA footprint and 488 I/Os allow realistic I/O behavior emulation including LVDS and SSTL signal integrity studies.
推薦
Industrial Control and Automation
The EP20K400CF672C8 is well suited to industrial control platforms requiring parallel I/O handling, deterministic timing, and long-term lifecycle support. Its 488 I/Os can drive dozens of opto-isolated digital inputs, encoder counters, PWM outputs, and RS-485 transceivers simultaneously. The 0C to 85C operating range covers most factory-floor environments, and the embedded array blocks implement motor-control lookup tables and PID compensation tables in distributed RAM rather than external memory, reducing BOM cost.
推薦
DSP Co-Processing
The EP20K400CF672C8's 1,664 embedded array blocks each implement up to 2,048 bits of RAM and can be configured as 8-bit multipliers or adder trees, enabling parallel DSP pipelines for FFT, FIR, and convolution. With 212,992 RAM bits distributed across the die, designers build wide-word shift registers and coefficient tables without starving the LUT fabric. The 368 MHz internal fmax supports 50 MHz+ sample-rate DSP chains for audio, sonar, or vibration analysis.
推薦
Network Switches and Routers
Layer-2 and layer-3 switches in the early 2000s used APEX 20KC devices for packet classification, queue management, and TCAM-style lookup tables. The EP20K400CF672C8's 488 I/Os route 16-bit data buses plus multiple SPI management interfaces to PHYs and switch fabrics, while EABs implement content-addressable memories at line rate. The 652-ball BGA footprint supports fine-grained power islands across I/O banks for mixed 1.8V/2.5V/3.3V signaling standards.
推薦
Military and Aerospace Embedded Systems
The APEX 20KC family was qualified into military and aerospace programs where its in-system programmability, high gate count, and wide I/O support allowed single-chip implementations of mission computers and signal processors. The EP20K400CF672C8 in particular served in radar pre-processors, secure-communication modems, and flight-control test benches. Although the commercial grade is rated 0C to 85C, military screening (-40C to 125C) is available on the EP20K400CB652I-series parts sharing the same logic.
推薦
推薦產品摘要
工程參考資料，適用於 EP20K400CF672C8 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP20K400CF672C7 | EP20K400CF672C-8 | EP20K400CF672C-7 | EP20K400CF672C7N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 672-ball FineLine BGA | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same |
| Family | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC |
| Speed Grade | C8 | C7 (slower) | C8 (match) | C7 (slower) | C7 (slower) |
| System Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Embedded RAM Bits | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 |
| Max User I/Os | 488 | 488 | 488 | 488 | 488 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Higher speed grade C8 versus C7 alternatives (對比EP20K400CF672C7)
- Drop-in compatibility across the APEX 20KC family (對比EP20K200FC484-3)
- Mature legacy design ecosystem with full Quartus II support (對比Cyclone V 5CEFA7)
設計說明
The 672-ball FineLine BGA uses a 1.0mm ball pitch and demands a PCB stack-up with microvia (laser-drilled) vias to fan out signals from inner balls. Use a 6-layer or 8-layer stack-up with dedicated ground and power planes adjacent to the BGA escape layer to control impedance for LVDS (100-ohm differential) and SSTL2 (50-ohm single-ended) interfaces. Decoupling requires 0.1uF X7R ceramics within 5mm of each power ball, plus bulk 22uF tantalums per power island.
Although APEX 20KC devices are CMOS and consume modest power at low toggle rates, a fully-utilized 400K-gate design can dissipate 3W to 5W. Mount the BGA on a PCB with a continuous ground plane directly under the device; for 5W operation, add a copper heat-spreader or attach a small clip-on heatsink to the package lid. The commercial 0C to 85C rating limits junction temperature to 125C with derating; validate worst-case Tj using the device's theta_JA from the datasheet.
Configuration bitstreams for APEX 20KC are SRAM-based and reload on every power-up; design must include a configuration PROM (EPC16, EPC8) or a microcontroller-hosted JTAG fallback. Do NOT leave I/O pins floating during configuration or the device may source contention current into downstream drivers. When migrating an APEX 20K design to APEX 20KE, recompile the Quartus II project for the new core voltage and re-validate timing - the same bitstream will NOT work across families.
Match impedance on LVDS pairs within 0.5mm length tolerance to avoid skew above 100 ps. Place termination resistors within 15mm of the receiver balls. For DDR-style SSTL interfaces, route DQS and CLK in matched-length groups and reference them to the same ground plane segment to suppress simultaneous-switching noise (SSN).
合規資訊
RoHS / REACH status not explicitly stated in the provided web data for this legacy part. APEX 20KC pre-dates strict RoHS enforcement for many variants - verify with broker traceability documentation. AEC-Q100 not applicable since this is a logic/FPGA device rather than an automotive analog IC.