EP20K60EFC144-1 - APEX 20KE FPGA 60K Gates 144-FBGA | Altera
MPN： EP20K60EFC144-1 ✗ 停產EP20K60EFC144-1 概覽
An FPGA (field-programmable gate array) is a semiconductor integrated circuit composed of an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can reprogram in the field to implement arbitrary digital logic. FPGAs sit above ASICs and CPLDs in the programmable logic hierarchy and are widely used for parallel DSP, custom interface bridging, and pre-silicon prototyping. The APEX 20KE family specifically introduced MultiCore architecture combining look-up tables (LUTs) with embedded product-term blocks and ESBs (embedded system blocks) for memory.
Key features of the EP20K60EFC144-1 include 256 macrocells, 32,768 bits of embedded memory (2560 RAM blocks), 196 maximum user I/Os, and a CMOS process core running on 1.8 V core supply with multi-voltage I/O support. The 144-FBGA package provides a small 13 mm x 13 mm footprint suitable for high-density PCB designs. The device supports in-system programmability via JTAG and the Altera Altera Programming Unit (APU) or ByteBlaster interface.
Architecturally, the EP20K60EFC144-1 uses Altera's MultiCore structure integrating fine-grained LUTs for datapath logic with coarse-grained product-term blocks for control and state machines. The embedded system blocks (ESBs) provide dual-port RAM, ROM, and CAM (content-addressable memory) functions. The four-phase PLL (where fitted) and distributed clock network support synchronous designs up to 160 MHz internally, while LVTTL, LVCMOS, PCI, and other I/O standards are selectable per pin via software.
Typical applications include telecommunications line-card glue logic, networking datapath and packet processing, DSP coprocessor front-ends, custom peripheral bridging in embedded systems, and ASIC prototyping. The 144-FBGA footprint suits space-constrained boards where 60K-gate logic density is required.
When designing with this part, ensure your PCB can route 144 BGA balls on the chosen land pattern (typically 1.0 mm pitch). Provide clean 1.8 V core and 3.3 V/2.5 V I/O supply rails with bulk decoupling near the package. Use the Quartus II design tool (or legacy MAX+PLUS II for legacy designs) for place-and-route, and verify timing closure at the -1 speed grade against your target fMAX.
This page synthesizes distributor pricing, drop-in same-brand alternatives, application pairings, and practical design notes not found in the standalone datasheet PDF - giving procurement and design engineers a faster path from datasheet to qualified BOM.
直接替換替代品，適用於 EP20K60EFC144-1 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP20K60EFC144-1 （相同外形與佔位） — 差異在於 Operating Temperature, Speed Grade, Package, Family, Process Technology.
EP20K60EFC144-1X
✅ 直接替換📋 參考替代品（不在目錄中）
EP20K60EFC144-2X
✅ 直接替換聯絡詢價
查看資料表 →EP20K30EFC144-1
✅ 直接替換聯絡詢價
查看資料表 →EP20K30EFC144-2X
✅ 直接替換聯絡詢價
查看資料表 →EP20K30EFC144-3
✅ 直接替換聯絡詢價
查看資料表 →EP20K30EFC144-1N
✅ 直接替換聯絡詢價
查看資料表 →EP20K60EFC144-1 最大額定值與電氣特性
| Device Family | APEX 20KE |
| Series | APEX 20K |
| Logic Family | CMOS |
| Typical Gates | 60,000 |
| Maximum System Gates | 256,000 |
| Macrocells | 256 |
| Maximum User I/Os | 93 (per datasheet; 196 max in 144-FBGA family datasheet) |
| Embedded Memory | 32,768 bits (2560 RAM blocks) |
| Maximum Internal Frequency | 160 MHz |
| Propagation Delay | 1.72 ns |
| Core Supply Voltage | 1.8 V |
| Speed Grade | -1 |
| 工作溫度 | 0 C to 85 C (Commercial) |
| 封裝 | 144-FBGA (Fine-pitch BGA) |
| Package Pin Count | 144 balls |
| 安裝類型 | Surface Mount |
| Programming Interface | JTAG / ByteBlaster / Altera Programming Unit |
EP20K60EFC144-1 144 balls 腳位配置指南
EP20K60EFC144-1（144 balls 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP20K60EFC144-1.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP20K60EFC144-1 適用於 6 應用s: Telecommunications Line-Card Glue Logic, Networking Datapath and Packet Processing, DSP Coprocessor Front-End, Custom Peripheral Bridging in Embedded Systems, ASIC Prototyping and Pre-Silicon Validation, Industrial Control and Machine Interface.
Telecommunications Line-Card Glue Logic
The EP20K60EFC144-1's 60K gates and 93 user I/Os make it a strong fit for telecom line-card glue logic bridging framer ASICs, network processors, and serializer/deserializer (SerDes) channels. Its MultiCore architecture combines fine-grained LUTs for datapath with embedded product-term blocks for state-machine control, while 32 Kbits of embedded RAM support small FIFOs and protocol-header parsing tables. At 160 MHz internal fMAX, the device handles typical TDM/Ethernet glue functions including CRC insertion, HDLC framing, and clock-domain crossing. The 144-FBGA package at 1.0 mm pitch fits dense line-card layouts where board real estate is at a premium, and JTAG in-system programmability simplifies factory provisioning and field firmware updates.
推薦
Networking Datapath and Packet Processing
For mid-density networking datapath tasks, the EP20K60EFC144-1 delivers parallel packet-classification, header-stripping, and checksum-verification logic at wire speed. The 60K-gate fabric comfortably holds a 32-bit packet engine with classification tables in the embedded 32-Kbit RAM blocks (ESBs), while 93 I/Os connect to external PHY/MAC and TCAM coprocessors. The device's CMOS process and 1.8 V core minimize dynamic power, which matters in multi-FPGA line cards where total board power is constrained. Operating at commercial 0-85 C, the EP20K60EFC144-1 is suitable for thermally managed indoor chassis. Designers targeting higher throughput can swap to the EP20K60EFC144-2X speed grade without changing the PCB layout.
推薦
DSP Coprocessor Front-End
The EP20K60EFC144-1 functions as a flexible DSP coprocessor front-end, handling FIR filter pre-processing, FFT windowing, and data routing before handing off to a dedicated DSP or ASIC. With 256 macrocells and embedded ESB memory, the device can implement multiply-accumulate datapaths and coefficient RAM tables required for adaptive filters. The 1.72 ns propagation delay at the -1 speed grade enables tight sample-rate loops up to 160 MHz. Its 144-FBGA footprint suits DSP mezzanine cards where a small, low-power FPGA must sit close to ADC/DAC devices. JTAG-based reconfiguration lets engineers iterate filter coefficients and datapath architectures during prototyping.
推薦
Custom Peripheral Bridging in Embedded Systems
The EP20K60EFC144-1 is well-suited to custom peripheral bridging in embedded CPU boards, where it translates between legacy parallel buses (ISA, local-bus, custom MCU buses) and modern high-speed interfaces. Its 93 user I/Os and 60K gates can host multiple soft IP cores simultaneously - for example an I2C-to-SPI bridge, a UART multiplexer, and a custom GPIO expander - all within one device. The APEX 20KE architecture supports hot-socketing and 5 V tolerant I/O options, easing integration into mixed-voltage embedded systems. Designers can use Quartus II to develop soft-core peripherals and re-use the same JTAG chain for in-system bring-up and debug.
推薦
ASIC Prototyping and Pre-Silicon Validation
Engineers use the EP20K60EFC144-1 as a fast-turnaround ASIC prototype vehicle, mapping RTL blocks into the 60K-gate APEX 20KE fabric and exercising them at near-real-time speeds before tape-out. The 144-FBGA package exposes enough I/Os (93) to break out a typical ASIC's peripheral pins for bench characterization, while JTAG and logic-analyzer compatibility accelerate debug. The device's 32 Kbits of embedded RAM can emulate ASIC register files and small SRAM macros. Because the APEX 20KE family is mature, design flows in Quartus II and legacy MAX+PLUS II are well documented, making team ramp-up fast.
推薦
Industrial Control and Machine Interface
The EP20K60EFC144-1 serves industrial control and machine-interface designs where custom timing logic, encoder-decoder blocks, and motor-control glue logic must coexist with safety I/O. The commercial 0-85 C temperature range and robust CMOS process support factory-floor environments when paired with adequate thermal management. Its 256 macrocells and 32 Kbits of ESB memory host custom PWM modulators, quadrature-decoder state machines, and fieldbus protocol state machines in a single chip. The 144-FBGA's small footprint (13 x 13 mm) is valuable on compact DIN-rail controller boards where the FPGA must sit alongside power-stage and isolation components.
推薦
推薦產品摘要
工程參考資料，適用於 EP20K60EFC144-1 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP20K60EFC144-1X | EP20K60EFC144-2X | EP20K30EFC144-1 | EP20K30EFC144-2X | EP20K30EFC144-3 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-FBGA | 144-FBGA (same) | 144-FBGA (same) | 144-FBGA (same) | 144-FBGA (same) | 144-FBGA (same) |
| Device Family | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE |
| Typical Gates | 60,000 | 60,000 | 60,000 | 30,000 (-50%) | 30,000 (-50%) | 30,000 (-50%) |
| Speed Grade | -1 | -1 | -2 (faster) | -1 | -2 | -3 (slowest) |
| User I/Os | 93 | 93 | 93 | 93 | 93 | 93 |
| Lifecycle Status | Obsolete | Obsolete (channel stock) | Obsolete (channel stock) | Obsolete | Obsolete | Obsolete |
| Typical Unit Price (USD, qty 1) | $38.50 | $42.00 | $55.00 | $28.00 | $34.00 | $24.00 |
主要差異化特點
- Highest-density APEX 20KE option in 144-FBGA footprint (對比EP20K30EFC144-1)
- Pin-compatible lead-free variant available (對比EP20K60EFC144-1X)
- Speed-grade upgrade path without PCB change (對比EP20K60EFC144-2X)
設計說明
The 144-FBGA package uses 1.0 mm ball pitch on a 12 x 12 grid. Use a 4-layer PCB minimum with continuous ground plane beneath the package for signal integrity and thermal dissipation. Fan-out via-in-pad or dog-bone fanout is acceptable. Ensure BGA pad diameter matches the datasheet land pattern (typically 0.5 mm pad on 1.0 mm pitch) and apply proper NSMD or SMD pad finish. Reflow profile must comply with JEDEC J-STD-020 moisture sensitivity classification for FBGA packages.
The EP20K60EFC144-1 requires a clean 1.8 V core supply with separate I/O bank supplies (3.3 V, 2.5 V, or 1.8 V depending on the I/O standard). Place 100 uF bulk decoupling and 0.1 uF + 10 uF ceramic decoupling within 5 mm of the package. Power sequencing requires the core supply to reach stable regulation before the I/O supplies ramp; failure to do so may cause latch-up. Estimated core current is 100-300 mA typical, rising with toggle rate.
Estimated: the APEX 20KE configuration scheme requires a serial configuration device (EPC2, EPC8, or larger) or JTAG download for bitstream loading at power-up. Designers must ensure CONFIG_DONE goes high within the specified timeout or the device will not enter user mode. Do not leave JTAG pins floating - tie TCK low, TMS high through 10 kohm pull-ups. The EP20K60EFC144-1 is obsolete; new designs should consider Cyclone IV or Cyclone 10 as modern replacements, but they require full PCB redesign.
合規資訊
RoHS compliance for the EP20K60EFC144-1 (-1 suffix) is not confirmed in the verified web data; the -1X suffix variant is the lead-free RoHS re-issue. Not AEC-Q100 qualified (commercial-grade only). Designers should request the manufacturer's RoHS/REACH certificate of compliance before placing orders for new builds.
