EP2A40F672I7 - APEX II 1.5M Gates FPGA, 672-pin FC-FBGA | Intel/Altera
MPN： EP2A40F672I7 ✗ 停產EP2A40F672I7 概覽
An FPGA is a reprogrammable semiconductor device whose logic function is defined by a user-supplied configuration bitstream rather than by the silicon vendor. APEX II sits in the FPGA taxonomy between traditional CPLDs (low density, glue logic) and high-end SoC FPGAs (multi-million LE with hardened CPUs). Within the broader programmable logic hierarchy, APEX II -> SRAM-based FPGA -> programmable logic -> semiconductor. Its reprogrammability, high pin count, and embedded MultiCore architecture made it popular for telecom line cards, baseband processing, and high-speed data-path prototyping in the early 2000s.
Key features of the EP2A40F672I7 include embedded MultiCore blocks combining lookup tables and product-term logic, a high-bandwidth MultiCore interconnect fabric, support for multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, LVDS), and a configurable JTAG-based configuration port. The APEX II architecture combines fine-grain LUTs with coarse-grain Embedded System Blocks (ESBs) to balance logic density and arithmetic performance.
The 672-ball FC-FBGA package exposes 8 dedicated clock inputs, up to 24 user I/O banks, and a high pin density suitable for dense PCB escape routing. Multiple speed grades are available: -6 (fastest), -7, -8, and -9 (slowest). EP2A40F672I7 is the industrial-temperature speed-grade 7 variant.
Typical applications include telecommunications line interfaces, DSP co-processing, high-speed bus bridging, and legacy industrial control systems that require drop-in compatibility with other EP2A40 F672-pin FPGAs.
Designers should provide a stable 1.5 V core and a separate I/O VCCIO rail (3.3 V or 2.5 V typical), follow Altera's JTAG configuration guidelines, and observe the 220 °C peak reflow temperature limit required by the FC-FBGA's MSL-3 moisture sensitivity rating.
This page synthesizes distributor availability, pin-compatible speed-grade alternatives, and lifecycle observations not consolidated in the original APEX II datasheet.
直接替換替代品，適用於 EP2A40F672I7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2A40F672I7 （相同外形與佔位） — 差異在於 Speed Grade, Package, Process Technology, Operating Temperature, Operating Temperature Grade.
EP2A40F672I-8
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A40F672I-9
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A40F672C9N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A40F672C8N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A40F672C7N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A40F672I7 最大額定值與電氣特性
| Family | APEX II |
| Logic Elements | 38,400 |
| Maximum System Gates | 1,500,000 |
| Core Voltage (VCCINT) | 1.5 V |
| Process Technology | 0.15 µm CMOS |
| Core Frequency (max) | 562 MHz |
| 工作溫度 | -40 °C to +85 °C (Industrial) |
| 封裝 | 672-ball FC-FBGA |
| Package Family | Fine-pitch Chip-scale BGA |
| 安裝類型 | Surface Mount |
| Speed Grade | -7 (speed grade 7) |
| 濕度敏感等級 (MSL) | 3 |
| Peak Reflow Temperature | 220 °C |
| Configuration Method | JTAG / Passive Serial / Active Serial |
| RoHS 狀態 | unknown |
EP2A40F672I7 fine-pitch chip-scale bga 腳位配置指南
EP2A40F672I7（fine-pitch chip-scale bga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2A40F672I7.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2A40F672I7 適用於 6 應用s: Telecommunications Line-Card Aggregation, Legacy DSP Co-Processor / FIR Accelerator, High-Speed Bus Bridge and Protocol Converter, Legacy Industrial Control and SCADA, Telecom Backplane Cross-Point Switch, Aerospace and Defense Avionics (Legacy).
Telecommunications Line-Card Aggregation
The EP2A40F672I7's 1.5M system gates and 38,400 logic elements are well-matched to telecom line-card aggregation duties, where multiple E1/T1 or STM-1 framers, HDLC controllers, and traffic-management state machines must coexist on a single programmable device. The 562 MHz core frequency gives the design enough headroom for high-rate crosspoint switching and packet-classification pipelines. The 672-ball FC-FBGA exposes sufficient user I/O to terminate multi-port PHY interfaces (MII, RMII, GMII, POS-PHY Level 2/3) without external bus muxing. Industrial -40 °C to +85 °C operation (the 'I' suffix) lets the line card populate outdoor cabinets and central-office frames without derating. The MultiCore interconnect fabric and Embedded System Blocks provide deterministic timing for time-division multiplexed backplane traffic.
推薦
Legacy DSP Co-Processor / FIR Accelerator
The APEX II MultiCore architecture integrates dedicated multiplier chains and Embedded System Block memories that the EP2A40F672I7 can instantiate as parallel FIR filters, FFT butterflies, and image-processing pipelines. At 562 MHz core frequency the device sustains multi-tap FIR throughput sufficient for video-rate DSP front-ends and software-defined radio baseband channels. The 0.15 µm CMOS process node gives balanced power and timing margins at 1.5 V VCCINT, allowing fanless operation with copper-pour-only heatsinking. Industrial temperature rating allows direct deployment in factory-floor DSP controllers and ruggedized signal-conditioning equipment. Designers typically pair the EP2A40F672I7 with external SRAM for coefficient storage and a host processor for control sequencing.
推薦
High-Speed Bus Bridge and Protocol Converter
Bus-bridging glue logic between legacy PCI/PMC interfaces and modern processors is a classic APEX II use case. The EP2A40F672I7's 672-ball FC-FBGA exposes enough user I/O to terminate a 64-bit PCI bus alongside a parallel RapidIO or POS-PHY interface, with the MultiCore fabric arbitrating between masters without external muxes. Industrial temperature grading permits deployment in factory automation and military vetronics chassis where commercial-only FPGAs fail reliability screens. The 1.5M-system-gate capacity absorbs full protocol stacks including DMA engines, scatter-gather descriptor controllers, and interrupt concentrators. Quartus II place-and-route produces predictable timing closure thanks to deterministic MultiCore routing.
推薦
Legacy Industrial Control and SCADA
Long-life industrial control platforms built around APEX II continue to operate in chemical, power, and transportation infrastructure. The EP2A40F672I7's industrial -40 °C to +85 °C operating range, 1.5 V regulated core, and 562 MHz timing margin suit deterministic PLC scanning, SCADA telemetry aggregation, and redundant controller supervision tasks. The 672-ball FC-FBGA package supports dense I/O expansion including differential RS-485, isolated 24 V digital inputs, and pulse-counter chains. Its obsolete lifecycle status is offset by long-term reliability records spanning two decades of installed base. Maintenance and refurbishment of these systems is the primary 2026 use case for the EP2A40F672I7.
推薦
Telecom Backplane Cross-Point Switch
The MultiCore interconnect fabric of the EP2A40F672I7 makes it well-suited for non-blocking crosspoint switches that route STS-1/STM-1 and STS-3/STM-3 streams across redundant backplanes. With 1.5 M system gates the device can switch hundreds of serial lanes in parallel and provide embedded diagnostics for BER monitoring, alarm generation, and protection-switching state machines. Industrial temperature rating ensures operation in uncontrolled central-office environments. The 672-ball FC-FBGA allows high pin-count LVDS links to multiple line cards without external transceivers. Quartus II timing closure is reliable across the -7 speed grade at 562 MHz.
推薦
Aerospace and Defense Avionics (Legacy)
Many avionics and defense subsystems designed in the early 2000s continue to operate using APEX II FPGAs, including flight-control test equipment, radar signal pre-processors, and secure-communication modems. The EP2A40F672I7's industrial temperature range and deterministic MultiCore routing make it acceptable for many non-flight-critical ground and lab environments. The 672-ball FC-FBGA supports the high I/O density demanded by parallel ADC/DAC interfaces and discrete digital control lines. Obsolescence management and DMSMS (Diminishing Manufacturing Sources and Material Shortages) programs drive 2026 demand for verified inventory of this part.
推薦
推薦產品摘要
工程參考資料，適用於 EP2A40F672I7 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2A40F672I-8 | EP2A40F672I-9 | EP2A40F672C9N | EP2A40F672C8N | EP2A40F672C7N |
|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) |
| Speed Grade | -7 | -8 (slower) | -9 (slowest) | -9 | -8 | -7 |
| Temperature Grade | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Commercial (0 to +70 C) | Commercial (0 to +70 C) | Commercial (0 to +70 C) |
| Logic Elements | 38,400 | 38,400 (same) | 38,400 (same) | 38,400 (same) | 38,400 (same) | 38,400 (same) |
| System Gates (max) | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| MSL | 3 | 3 | 3 | 3 | 3 | 3 |
主要差異化特點
- Industrial temperature screening on -7 speed grade (對比EP2A40F672C7N)
- Highest fMAX among APEX II F672-pin industrial variants (對比EP2A40F672I-9)
- Same package footprint as APEX 20K600 family (對比EP20K600CF672)
設計說明
Estimated: APEX II static power at 1.5 V VCCINT and 25 °C junction for a fully populated EP2A40F672I7 is typically 1.5 W, with dynamic power scaling linearly with toggle rate up to several watts at 562 MHz fMAX. The 672-ball FC-FBGA requires a minimum 8-layer PCB stack-up with continuous inner ground planes to spread heat. For designs consuming more than 3 W sustained, attach a small copper heatsink or 2 oz copper pour directly under the BGA footprint. Keep junction temperature below 125 °C for industrial-grade reliability.
The 672-ball FC-FBGA uses 1.0 mm ball pitch; PCB escape routing requires microvia or via-in-pad technology on 4-layer stack-ups. Per Altera layout guidelines, place 0.1 µF and 10 µF decoupling capacitors within 100 mils of every VCCINT/VCCIO ball group. Maintain at least 4 ground balls per power ball for return-path integrity. MSL-3 handling requires dry-pack assembly within 168 hours of bag opening, otherwise rebake at 125 °C for 24 hours prior to reflow at the 220 °C peak profile.
Do not assume any APEX II speed grade can be swapped blindly: -7 to -8 to -9 each step reduces fMAX by roughly 15%, which can break timing closure. Verify Quartus II fMAX reports for every clock domain after substitution. JTAG configuration requires VCCIO bank 1 powered before nCONFIG toggles, otherwise configuration fails silently. Pin-compatible commercial-grade ('C' suffix) variants must NOT be used where industrial ('I' suffix) parts are specified — junction-temperature behavior diverges at the -40 °C lower bound and 85 °C upper bound.
合規資訊
Compliance data not published in verified web sources for this obsolete Altera/Intel FPGA. APEX II family predates RoHS-6 directive enforcement in many Altera part numbers, so historical lead-free status cannot be confirmed.