EP2A40F672I-9 - APEX II FPGA, 1.5M Gates, 672-BGA | Intel
MPN： EP2A40F672I-9 ✗ 停產EP2A40F672I-9 概覽
An FPGA (Field Programmable Gate Array) is a programmable logic device whose logic blocks, interconnect, and I/O can be reconfigured after manufacturing, providing ASIC-like density and performance with NRE-free prototyping. FPGAs sit hierarchically between general-purpose CPUs/DSPs and fixed-function ASICs: they deliver higher throughput than a processor for parallel tasks, and faster time-to-market than a mask-programmed ASIC. APEX II parts further integrate dedicated CAM blocks and LVDS channels that simplify communications and datapath designs.
Key features of the EP2A40F672I-9 include 38,400 logic elements, embedded CAM support, dual-port RAM blocks, True-LVDS I/O, and an industrial operating range. The 672-ball FC-FBGA package provides controlled-impedance routing for high-speed interfaces, while 0.15 µm process technology balances density and static power. The device operates from a 1.5 V core supply with separate VCCIO banks supporting mixed-voltage I/O. Hot-socketing capability allows the device to be inserted into a live backplane without damage or data corruption.
Architecturally, APEX II devices pair four-input LUT-based logic elements with embedded system blocks (ESBs) that can be configured as dual-port SRAM, single-port SRAM, ROM, or CAM. True-LVDS receivers and transmitters on dedicated channels deliver data rates up to several hundred Mbps per channel, suitable for LVDS bridges and parallel backplanes. The MultiCore interconnect with DirectDrive technology ensures predictable timing for high-fanout nets across the 672-pin FC-FBGA package.
Typical applications include high-speed communications interfaces, ASIC prototyping, datapath co-processing, and DSP accelerator designs. The combination of CAM, dual-port RAM, and LVDS makes APEX II particularly attractive for ATM switching, protocol translation, and PCI-to-PCI bridges. The industrial temperature grade also supports telecom line cards and industrial control backplanes.
When designing with the EP2A40F672I-9, pay close attention to power sequencing: VCCINT must reach stable 1.5 V before VCCIO is applied, and vice versa on power-down. The device draws significant inrush current during configuration - use the Altera MAX series (EPM7xxx) or discrete supervisory circuitry to hold the FPGA in reset until supplies stabilize. Decoupling requires at least 22 µF bulk + 0.1 µF + 0.001 µF per power pin group.
This page consolidates APEX II datasheet facts, intel/Altera ordering information, and pin-compatible same-family alternatives in a single reference - including 672-pin FC-FBGA drop-in variants and speed-grade siblings - to help procurement and hardware engineers validate EP2A40F672I-9 sourcing decisions.
直接替換替代品，適用於 EP2A40F672I-9 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2A40F672I-9 （相同外形與佔位） — 差異在於 Package, Operating Temperature, Process Technology, Speed Grade, Maximum Internal Frequency.
EP2A40F672I-8
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A40F672I-7
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A40F672C9
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A40F672C9N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A40F672C8
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A40F672C7
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A40F672I-9 最大額定值與電氣特性
| Family | APEX II |
| Device | EP2A40 |
| Logic Elements | 38,400 |
| System Gates | 1,500,000 |
| Maximum Operating Frequency | 366 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked) |
| 工作溫度 | -40 °C to +100 °C (Industrial) |
| 封裝 | 672-pin FC-FBGA (Fine-pitch Ball Grid Array) |
| Speed Grade | -9 |
| True-LVDS Channels | Yes (dedicated) |
| Embedded Memory | Dual-port RAM, single-port RAM, ROM, CAM (via ESBs) |
| Hot Socketing | Supported |
| Configuration Mode | Passive serial, passive parallel synchronous, passive parallel asynchronous, JTAG |
| Moisture Sensitivity Level | MSL 3 |
| Peak Reflow Temperature | 220 °C |
EP2A40F672I-9 672-pin fc-fbga (fine-pitch ball grid array) 腳位配置指南
EP2A40F672I-9（672-pin fc-fbga (fine-pitch ball grid array) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2A40F672I-9.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2A40F672I-9 適用於 6 應用s: High-Speed Communications Interfaces, ASIC Prototyping and Emulation, Datapath and DSP Co-Processing, ATM and Packet Switching, PCI Bus Bridging and Protocol Translation, Telecom Line Cards and Industrial Control.
High-Speed Communications Interfaces
The EP2A40F672I-9's dedicated True-LVDS channels and 38,400 logic elements make it well suited for high-speed communications interfaces such as OC-48/STM-16 framers, SPI-4.2 bridges, and proprietary LVDS backplanes. APEX II delivers up to several hundred Mbps per LVDS pair with predictable timing via DirectDrive interconnect, allowing multi-channel aggregation. The 672-ball FC-FBGA package supports controlled-impedance routing required for clean LVDS eye diagrams. Industrial temperature grade makes it appropriate for telecom line cards and outdoor base-station hardware.
推薦
ASIC Prototyping and Emulation
With 1.5M system gates, the EP2A40F672I-9 is commonly used as an ASIC prototype vehicle for mid-complexity ASICs in the 200K-500K gate range. Multiple FPGAs of this density can be wired together on a prototyping board to emulate larger ASICs. The dual-port RAM and CAM blocks allow direct mapping of common ASIC structures (FIFOs, lookup tables, TCAM). Industrial speed grade -9 provides timing margin for verifying worst-case ASIC paths before tape-out.
推薦
Datapath and DSP Co-Processing
The EP2A40F672I-9's combination of 38,400 logic elements, embedded dual-port RAM, and 366 MHz internal clock rate enables efficient datapath and DSP co-processing - including FIR filters, FFT engines, encryption pipelines, and protocol accelerators. The APEX II architecture supports parallel multiplier implementations via dedicated carry chains, delivering high throughput per MHz. Industrial temperature grade suits military, aerospace, and ruggedized industrial systems where commercial FPGAs cannot operate.
推薦
ATM and Packet Switching
The EP2A40F672I-9 is well matched to ATM and packet-switching fabrics because of its embedded CAM blocks (for routing table lookup), dual-port RAM (for cell/packet buffering), and LVDS I/O (for backplane interconnect). At 366 MHz, the device can sustain multi-gigabit switching rates for access and edge routers. The 672-ball FC-FBGA package supports high fan-out needed for switch-fabric interfaces, and hot socketing allows live insertion into carrier-class chassis.
推薦
PCI Bus Bridging and Protocol Translation
The EP2A40F672I-9 provides ample logic and I/O for implementing PCI/PCI-X bridges, proprietary backplane protocols, and bus-format converters. Its hot-socketing capability and 3.3 V tolerant I/O banks simplify host-adapter card designs where the FPGA must tolerate live insertion. The industrial temperature grade extends support to factory automation and outdoor telemetry systems requiring reliable bus bridging across wide thermal ranges.
推薦
Telecom Line Cards and Industrial Control
With industrial temperature rating (-40 °C to +100 °C), the EP2A40F672I-9 is deployed in telecom line cards, base-station DSP subsystems, and industrial control backplanes where extended thermal ranges and reliability are mandatory. The True-LVDS channels and CAM-based lookup engines support telecom-class TDM and packet processing. The 1.5 V core with bank-selectable I/O voltages makes it compatible with both legacy 3.3 V logic and modern 1.8 V interfaces on the same board.
推薦
推薦產品摘要
工程參考資料，適用於 EP2A40F672I-9 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2A40F672I-8 | EP2A40F672C9 | EP2A40F672C9N | EP2A40F672C8 | EP2A40F672C7 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 672-pin FC-FBGA | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same |
| Speed Grade | -9 (fastest) | -8 | -9 | -9 | -8 | -7 |
| Operating Temperature | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Process Technology | 0.15 um CMOS | 0.15 um CMOS | 0.15 um CMOS | 0.15 um CMOS | 0.15 um CMOS | 0.15 um CMOS |
主要差異化特點
- Industrial temperature grade for harsh environments (對比EP2A40F672C9)
- Highest speed grade for maximum Fmax (對比EP2A40F672I-7)
- Lower pin count and PCB cost vs larger package (對比EP2A40F1020I9)
設計說明
APEX II devices draw substantial inrush current during configuration. The EP2A40F672I-9 requires VCCINT to reach a stable 1.5 V before VCCIO banks are applied, and the reverse sequence on power-down. Use the Altera MAX series (EPM7xxx) or a discrete supervisor to hold nCONFIG low until all rails are in regulation. Decoupling: at minimum 22 µF bulk + 0.1 µF + 0.001 µF per power-pin group, placed within 5 mm of the BGA balls.
Estimated: At full utilization (~80% logic + 50% ESBs) and 366 MHz operation, the EP2A40F672I-9 can dissipate 3-5 W. The 672-pin FC-FBGA requires thermal vias under the die and a thermal pad or copper spreader for designs approaching this envelope. Verify junction temperature against the industrial 100 °C limit at worst-case ambient. Forced airflow (1-2 m/s) is recommended for high-utilization industrial designs.
PCB layout for the 672-ball FC-FBGA demands a 1.0 mm or finer pitch footprint with microvia stack-ups (laser-drilled microvias from L1 to inner layers, plus buried vias for inner-to-outer escape). Use 50 Ω controlled impedance for LVDS pairs and 100 Ω differential. Power planes must be split to isolate VCCINT (1.5 V) from VCCIO banks (1.5 V / 1.8 V / 2.5 V / 3.3 V). Reference the Altera AN 75: High-Speed Board Design for APEX II guidance.
Do not assume newer Quartus versions support APEX II - current Intel Quartus releases have dropped APEX II support; designs targeting EP2A40F672I-9 must use Quartus II 9.1 SP2 or earlier. Configuration bitstreams generated by newer tools are incompatible. Additionally, do not confuse the 672-ball FC-FBGA (F672) with the 1020-ball FC-FBGA (F1020) package - they share the family but have different footprints and pinouts.
合規資訊
RoHS status marked [DATA_NEEDED]: Verified Web Data does not provide RoHS, REACH, lead-free, or halogen-free certification for EP2A40F672I-9. Parts manufactured in the APEX II era (early 2000s) typically predate RoHS, so older date-code lots are likely non-compliant; lead-free / RoHS-compliant variants are the 'N'-suffix parts (e.g., EP2A40F672C9N). AEC-Q100 not applicable to FPGAs. Designers should verify compliance per their application requirements and date-code acceptance.
