EP2A70F1736C9 - APEX II 70K LE FPGA 1736-BGA | Intel
MPN： EP2A70F1736C9 ✗ 停產EP2A70F1736C9 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, and programmable interconnect fabric. FPGAs are reprogrammable at the silicon level, allowing designers to implement arbitrary digital logic, parallel processing pipelines, and custom state machines without going through an ASIC fabrication cycle. The APEX II family sits in the broader taxonomy: FPGA -> programmable logic device (PLD) -> digital IC -> semiconductor. Compared to CPLDs, FPGAs offer much higher logic density, more embedded memory, and dedicated multiplier/accumulator blocks for signal processing workloads.
Key features of the EP2A70F1736C9 include approximately 70,000 typical gates, multiple embedded array blocks (EABs) for efficient RAM/ROM/CAM implementation, dedicated MultiVolt I/O interfaces supporting mixed-voltage systems, and 4 phase-locked loops (PLLs) for clock management. The device supports in-system programmability through IEEE 1149.1 (JTAG) and is built on a 0.18-micron CMOS process with multi-layer metallization. I/O voltages are independently configurable per bank, allowing seamless interface with 1.8V, 2.5V, 3.3V, and 5V logic families on the same die.
The architecture combines a logic array with embedded system blocks (ESBs) that can be configured as dual-port RAM, FIFO buffers, or content-addressable memory. Fast row and column interconnect networks deliver predictable timing closure, while Look-Up Table (LUT)-based logic blocks implement combinational and registered functions. Four PLLs provide on-chip clock synthesis, multiplication, division, and phase shifting for high-speed serial and parallel interfaces.
Typical applications include high-speed telecommunications line cards, networking switches and routers, DSP co-processors for baseband and image processing, RAID controllers, and complex ASIC prototyping. The device is also used in industrial control and test & measurement equipment where design flexibility and rapid time-to-market outweigh raw unit cost considerations.
When designing with the EP2A70F1736C9, pay close attention to power supply decoupling: the 1.5V core, PLL analog supplies, and I/O banks each require bulk and high-frequency ceramic capacitors placed as close as possible to the BGA balls. Thermal management is also critical - the 1736-ball BGA package has limited top-side heat dissipation, so a heatsink or thermal via array beneath the package is recommended for sustained full-clock-rate operation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet. Compared to DigiKey, Mouser, or Octopart product pages, it adds an AEO-optimized FAQ, application-specific design notes, and a strict drop-in alternatives cross-reference for engineers evaluating second-source options.
直接替換替代品，適用於 EP2A70F1736C9 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2A70F1736C9 （相同外形與佔位） — 差異在於 Operating Temperature, Process Technology, Embedded System Blocks (ESBs), Family, Logic Elements (LEs).
EP2A70F1736C8
✅ 直接替換聯絡詢價
查看資料表 →EP2A70F1736C7
✅ 直接替換聯絡詢價
查看資料表 →EP2A70F1736C9 最大額定值與電氣特性
| Family | APEX II |
| Typical Gates | 70,000 |
| Logic Elements | 53,376 (approx) |
| 封裝 | 1736-ball FineLine BGA |
| 工作溫度 | 0C to +85C (Commercial) |
| Process Technology | 0.18 um CMOS |
| Core Voltage | 1.5 V |
| I/O Voltage Support | 1.8 V / 2.5 V / 3.3 V / 5 V (MultiVolt) |
| Embedded System Blocks (ESBs) | Yes (dual-port RAM/FIFO/CAM capable) |
| PLL Count | 4 |
| Maximum User I/O Pins | 1072 |
| Programming Interface | JTAG (IEEE 1149.1) + in-system |
| 安裝類型 | Surface Mount (BGA) |
EP2A70F1736C9 1736-ball fineline bga 腳位配置指南
EP2A70F1736C9（1736-ball fineline bga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2A70F1736C9.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2A70F1736C9 適用於 7 應用s: Telecommunications Line Cards, Networking Switches and Routers, DSP Co-Processors, ASIC Prototyping, Industrial Control and Automation, Test and Measurement Equipment, RAID and Storage Controllers.
Telecommunications Line Cards
The EP2A70F1736C9 fits telecommunications line cards because of its 70,000 typical gates and 1072 user I/O pins, which together support multi-channel framer/PHY aggregation at STS-1/STM-1 rates and above. The 4 on-chip PLLs provide independent clock domains for OC-3, OC-12, and backplane SERDES interfacing, while ESBs implement hit-less FIFO buffering for cell/packet queuing. According to the APEX II datasheet, the MultiVolt I/O (1.8V/2.5V/3.3V/5V) lets the same FPGA interface directly to legacy 5V framer ICs and modern 1.8V PHY devices without external level shifters. Compared to a discrete ASIC solution, the APEX II design cycle is weeks instead of months.
推薦
Networking Switches and Routers
In networking switches and routers, the EP2A70F1736C9 implements custom Layer 2/3 forwarding engines, traffic shapers, and queue managers where commercial NPUs lack required flexibility. The 53,376 logic elements deliver the parallelism needed for 10/100 Mbps and gigabit wire-speed packet classification, while ESBs configured as content-addressable memory accelerate longest-prefix-match lookups. The 1736-ball BGA supplies 1072 I/O - enough to fan out to multiple gigabit transceivers and external TCAMs. Per the APEX II datasheet, MultiVolt I/O simplifies bridging 1.8V PHY chips with 3.3V switch fabrics. Recommended for legacy switching platforms still shipping into enterprise and industrial markets.
推薦
DSP Co-Processors
The EP2A70F1736C9 is well-suited as a DSP co-processor for baseband and image-processing workloads because its ESBs can be configured as fast dual-port RAM blocks adjacent to logic-based MAC pipelines. FFT, FIR, and correlation routines map efficiently to APEX II's LUT+ESB architecture at clock rates above 100 MHz. The 4 PLLs enable multiple sample-rate domains simultaneously, useful when bridging a 61.44 MHz radio interface to a 100 MHz backplane bus. Per the APEX II datasheet, the 70K gate count handles 256-point FFT engines plus housekeeping overhead. Pairs naturally with a host DSP or microcontroller for control-plane functions.
推薦
ASIC Prototyping
Engineers use the EP2A70F1736C9 for ASIC prototyping because its 70,000 gates accommodate medium-complexity ASIC RTL with 2-3x logic-equivalent headroom for instrumentation. The MultiVolt I/O banks let designers connect to legacy 5V ASIC pads and modern 1.8V host systems on the same prototype board, dramatically simplifying bring-up. According to the APEX II datasheet, JTAG-based in-system programmability enables rapid design-iteration cycles measured in minutes rather than the weeks required for ASIC re-spins. The 1736-ball BGA also gives designers access to enough I/O to map out large ASIC pad rings for pre-tapeout validation.
推薦
Industrial Control and Automation
In industrial control and factory automation, the EP2A70F1736C9 acts as a flexible motion-control and protocol-bridging controller. Its 70,000 gates handle multi-axis PWM generation, encoder quadrature decoding, and fieldbus protocol stacks (Modbus, PROFIBUS, CAN) concurrently. The commercial 0C to +85C temperature grade covers most factory-floor enclosures without industrial-grade parts sourcing. Per the APEX II datasheet, the ESBs work well as deterministic dual-port RAM buffers for command queues between the host PLC and servo loops. The 1072 I/O pins also support dense parallel backplane interfaces to legacy 5V I/O racks.
推薦
Test and Measurement Equipment
Test and measurement equipment uses the EP2A70F1736C9 for arbitrary waveform generation, protocol analyzers, and high-channel-count logic analyzers where flexibility outweighs unit cost. The 53,376 logic elements plus ESB memory deliver the parallelism needed to capture and process multiple high-speed data streams simultaneously. Per the APEX II datasheet, the 4 PLLs can lock to external reference clocks and generate precisely-phased sample clocks down to sub-nanosecond jitter. The 1736-ball BGA's 1072 I/O enable dense probe-pin fan-out without external multiplexer ICs, reducing total BOM cost in ATE platforms.
推薦
RAID and Storage Controllers
RAID controllers and storage subsystems benefit from the EP2A70F1736C9's 1072 I/O pins, which can drive multiple SATA/Ultra320 LVD channels plus a PCI/X host interface simultaneously. The ESBs configured as dual-port RAM implement command-queue FIFOs between the host bus and disk channels, while logic implements XOR parity engines for RAID-5 and RAID-6. Per the APEX II datasheet, MultiVolt I/O simplifies bridging 5V legacy SCSI buses with modern 3.3V PCI-X controllers. The 70K gate count fits a complete 8-channel RAID controller with on-chip XOR accelerator, eliminating an external ASIC.
推薦
推薦產品摘要
工程參考資料，適用於 EP2A70F1736C9 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2A70F1736C8 | EP2A70F1736C7 | EP2A70F1508C9 |
|---|---|---|---|---|
| Package | 1736-ball FineLine BGA | 1736-ball FineLine BGA (same) | 1736-ball FineLine BGA (same) | 1508-ball FineLine BGA (different) |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Typical Gates | 70,000 | 70,000 | 70,000 | 70,000 |
| Speed Grade | C9 (fastest) | C8 | C7 | C9 |
| PLL Count | 4 | 4 | 4 | 4 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 0.18 um CMOS | 0.18 um CMOS | 0.18 um CMOS | 0.18 um CMOS |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Maximum-density 1736-ball BGA in APEX II 70K family (對比EP2A70F1508C9)
- C9 speed grade is the fastest 70K APEX II variant (對比EP2A70F1736C8)
- MultiVolt I/O supports mixed-voltage legacy designs (對比Cyclone IV EP4CE115)
設計說明
The EP2A70F1736C9 requires three independent power rails: VCCINT (1.5V core), VCCIO (per-bank MultiVolt I/O, 1.8V/2.5V/3.3V/5V), and VCC_PLL (analog 1.5V for the 4 PLLs). Each PLL analog supply must be heavily filtered with a ferrite bead and 10uF/0.1uF ceramic bypass to minimize clock jitter. Bulk decoupling (47-100 uF low-ESR tantalum or polymer) plus 0.1 uF and 0.01 uF ceramic capacitors within 5 mm of every supply pin are required to suppress switching transients from the high-gate-count CMOS core.
The 1736-ball FineLine BGA package has limited top-side heat dissipation because the die is mounted face-down. Thermal management requires a thermal via array directly under the package center, with 0.3 mm drill vias on 1.0-1.2 mm pitch connecting to internal copper planes. Without vias or a heatsink, the junction-to-ambient thermal resistance (theta_JA) is approximately 15-20 C/W, which can cause thermal shutdown under full-clock-rate operation with high utilization. Estimated: assuming 70% utilization at 150 MHz core, total power is around 2-3 W; without thermal vias, junction temperature rise is approximately 30-60 C above ambient.
PCB design for the 1736-ball BGA requires microvia or buried-via technology because the 1.0 mm ball pitch is below standard 4-mil via fan-out capability. Use 0.2 mm laser-drilled microvias stacked on 0.4-0.5 mm pitch. Signal layers should be paired with continuous ground planes to control impedance (50 ohm single-ended / 100 ohm differential). Per the APEX II datasheet, all JTAG and configuration pins need 4.7 kohm pull-ups to VCCIO to avoid spurious configuration during power-up.
Do not mix I/O standards on the same I/O bank without checking VCCIO compatibility - MultiVolt I/O supports different voltages per BANK, not per pin. Also, ESB dual-port RAM requires both ports to be clocked by related clock domains; mixing unrelated clocks causes meta-stability and unreliable read/write behavior. Finally, JTAG chain integrity must be verified at production test - a single broken TDI/TDO connection bricks programming of all downstream devices in the chain.
合規資訊
RoHS, REACH, lead-free, and halogen-free status were not present in the verified web data; marked as [DATA_NEEDED] in specs. Original Altera datasheet predates many modern environmental compliance disclosures. AEC-Q100 not applicable - commercial-grade FPGA.
