EP2AGX190FF35C5G - 181165 LE Arria II GX FPGA, 612 I/O, FC-FBGA-1152 | Intel / Altera
MPN： EP2AGX190FF35C5G ✓ 啟用中EP2AGX190FF35C5G 概覽
An FPGA (Field-Programmable Gate Array) is a programmable logic device that sits at the top of the digital semiconductor hierarchy: ASIC -> CPLD -> FPGA -> programmable logic -> semiconductor. FPGAs contain configurable logic blocks, programmable routing, and often hard IP cores (transceivers, DSP, memory controllers). The Arria II GX family balances cost, density, and integrated 3.75 Gbps transceivers, positioning it as a 'mid-range' alternative to Stratix (high-end) and Cyclone (low-cost) families for designs that need SERDES without the highest performance tier.
Key features include 8 transceiver channels at 3.75 Gbps, 612 user I/O pins, 28.6 Mbits of block RAM plus 1.2 Mbits of MLAB memory, 840 DSP blocks (18x18 multipliers), 4 hard memory controllers, and 4 PLLs. The device operates from a 0.9V core supply with 1.5V/1.8V/2.5V/3.3V I/O support. Speed grade 'C5' denotes the commercial temperature range (0C to 85C) with mid-tier performance.
Typical applications include wireless baseband processing, video broadcast infrastructure, industrial imaging, and high-speed serial backplane interfaces. The Arria II GX's built-in transceivers support PCIe Gen1/Gen2, CPRI/OBSAI, Serial RapidIO, and gigabit Ethernet, eliminating external PHY ICs in many designs.
When designing with this device, use the Quartus II design suite (v13.0+ supports Arria II GX) and verify transceiver channel placement against board layout - high-speed SERDES require impedance-controlled differential routing. The FF35 package is the largest in the family and shares its ball-map with EP2AGX260, simplifying PCB layout reuse between density variants.
直接替換替代品，適用於 EP2AGX190FF35C5G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2AGX190FF35C5G （相同外形與佔位） — 差異在於 Package, Speed Grade, Operating Temperature, Logic Elements, RoHS Status.
EP2AGX190FF35C4G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX260FF35C5G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX190FF35I5G
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2AGX190FF35C5G 最大額定值與電氣特性
| Family | Arria II GX |
| Logic Elements (LE) | 181,165 |
| Adaptive Logic Modules (ALM) | 71,510 |
| Embedded Memory (M9K blocks) | 1,118 |
| Embedded Memory (total) | 9,594 Kbits (10,123,008 bits) |
| MLAB Memory | 1.2 Mbits |
| DSP Blocks (18x18 multipliers) | 840 |
| Transceivers | 8 channels |
| Transceiver Data Rate (max) | 3.75 Gbps |
| Maximum User I/O Pins | 612 |
| PLLs | 4 |
| Memory Controllers | 4 (hard IP) |
| Core Voltage | 0.9 V |
| I/O Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Node | 40 nm |
| 封裝 | 1152-ball FC-FBGA (FF35) |
| Speed Grade | C5 (commercial, mid-performance) |
| Operating Temperature (commercial) | 0C to +85C |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant |
EP2AGX190FF35C5G 1152-ball fc-fbga (ff35) 腳位配置指南
EP2AGX190FF35C5G（1152-ball fc-fbga (ff35) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2AGX190FF35C5G.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2AGX190FF35C5G 適用於 6 應用s: Wireless Baseband Processing, Video Broadcast and Imaging Infrastructure, Industrial Machine Vision and Inspection, High-Speed Serial Backplane / Switch Fabric, Medical Imaging (Ultrasound / CT Front-End), Test & Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGX190FF35C5G is well suited to wireless baseband signal processing in 3G/4G picocell and small-cell base stations. Its 840 18x18 DSP blocks and 8 CPRI/OBSAI-capable transceivers at up to 3.75 Gbps enable uplink/downlink channelization, FFT/iFFT, and digital up/down-conversion on a single device. The 9,594 Kbits of block RAM buffer MAC-layer data and HARQ state without external memory pressure, while the 0.9V core keeps board-level power below 8W at full utilization. Compared with DSP+ASIC architectures, the FPGA approach allows late firmware updates for evolving LTE/LTE-A features.
推薦
Video Broadcast and Imaging Infrastructure
In video broadcast routers, multi-viewers, and professional SDI/HDMI processing equipment, the EP2AGX190FF35C5G's 181,165 LEs handle 4K video scaling, color-space conversion, and frame-rate conversion in real time. The 8 transceivers aggregate multiple SDI streams (3G-SDI at 2.97 Gbps) without external PHY chips, and the 4 hard memory controllers interface directly to DDR2/DDR3 for line/frame buffers. Per the Arria II GX handbook, the FF35 package's 612 user I/O pins expose parallel camera interfaces and HDMI/DisplayPort links alongside serial streams, simplifying PCB integration.
推薦
Industrial Machine Vision and Inspection
The EP2AGX190FF35C5G drives high-throughput machine vision pipelines in semiconductor inspection, AOI (automated optical inspection), and robotic vision systems. Its 840 DSP blocks accelerate Sobel, Canny, and FFT edge-detection kernels, while the embedded block RAM holds pixel-line buffers with deterministic latency. The 8 transceivers connect to CoaXPress or GigE Vision cameras (each up to 3.75 Gbps), aggregating up to 8 camera channels per FPGA. Industrial users value the commercial-grade reliability and the Quartus II tool chain for IEC 61508/ISO 13849 certification paths in factory automation.
推薦
High-Speed Serial Backplane / Switch Fabric
The EP2AGX190FF35C5G's 8 transceivers operating at 3.75 Gbps with PCIe Gen1/Gen2, Serial RapidIO, and gigabit Ethernet make it a strong fit for ATCA/cPCI backplane line cards and small-port Ethernet switches. Its 4 PLLs provide independent reference clocks for multi-rate ports, while 612 user I/O pins expose legacy management interfaces (I2C, SPI, MDIO). The FF35 1152-ball FC-FBGA package has 1.0mm ball pitch per the Arria II GX handbook, suitable for high-layer-count backplane PCBs.
推薦
Medical Imaging (Ultrasound / CT Front-End)
In ultrasound beamformers and CT scanner front-ends, the EP2AGX190FF35C5G performs real-time beamforming, FIR filtering, and envelope detection across 64 to 128 channels. Its 840 DSP blocks (each implementing 18x18 multipliers plus adders) deliver the parallel arithmetic required for delay-and-sum beamforming across the full channel count. The 8 transceivers digitize upstream ADC data at LVDS rates up to 1.6 Gbps per differential pair, while the 9.6 Mbits of block RAM buffer channel data between processing stages. Per Altera medical reference designs, the FPGA's deterministic latency simplifies FDA 510(k) submission paths for imaging algorithms.
推薦
Test & Measurement Instrumentation
The EP2AGX190FF35C5G drives modular instrumentation such as protocol analyzers, digitizers, and ATE (automated test equipment) pin-electronics. Its 8 transceivers at 3.75 Gbps capture and replay high-speed serial protocols (PCIe, SATA, USB 3.0 PHY layer), while 612 user I/O pins connect to parallel stimulus/response buses. The 840 DSP blocks accelerate FFTs for spectrum analysis and correlation for pattern generation. The commercial C5 speed grade provides margin for laboratory temperature environments, and the FF35 FC-FBGA package supports the controlled-impedance stack-ups used in precision instrumentation.
推薦
推薦產品摘要
工程參考資料，適用於 EP2AGX190FF35C5G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2AGX190FF35C4G | EP2AGX260FF35C5G | EP2AGX190FF35I5G |
|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 1152-ball FC-FBGA (FF35) | 1152-ball FC-FBGA (FF35) - same | 1152-ball FC-FBGA (FF35) - same | 1152-ball FC-FBGA (FF35) - same |
| Logic Elements | 181,165 | 181,165 (same) | 244,400 (+35%) | 181,165 (same) |
| DSP Blocks (18x18) | 840 | 840 (same) | 1,368 (+63%) | 840 (same) |
| Transceivers | 8 at 3.75 Gbps | 8 at 3.75 Gbps | 8 at 3.75 Gbps | 8 at 3.75 Gbps |
| Embedded Memory | 9,594 Kbits | 9,594 Kbits (same) | 13,107 Kbits | 9,594 Kbits (same) |
| User I/O Pins | 612 | 612 (same) | 612 (same) | 612 (same) |
| Speed Grade | C5 (commercial, mid) | C4 (commercial, slower) | C5 (same) | I5 (industrial) |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Process / Core Voltage | 40 nm / 0.9 V | 40 nm / 0.9 V (same) | 40 nm / 0.9 V (same) | 40 nm / 0.9 V (same) |
主要差異化特點
- Highest logic density in Arria II GX FF35 family at C5 speed grade (對比EP2AGX125EF35C5G)
- Commercial temperature grade with mid-tier C5 speed (vs industrial I5 grade) (對比EP2AGX190FF35I5G)
- 8 transceivers at 3.75 Gbps vs Cyclone V's 5 Gbps but lower LE density per cost (對比Cyclone V GT (5CGXFC7C7F23C8N))
設計說明
Estimated: The 1152-ball FC-FBGA FF35 package uses a 1.0 mm ball pitch and requires a high-layer-count PCB (typically 12+ layers) with microvia (laser-drilled) stack-ups. Per the Arria II GX handbook, the FF35 ball-map is shared with EP2AGX260, enabling PCB layout reuse across density variants. Use a 1.2mm-thick core and 0.2mm dielectric layers for matched 50-ohm single-ended and 100-ohm differential impedance on transceiver channels.
Estimated: Each of the 8 transceiver channels requires AC-coupling capacitors (typically 100 nF 0402-size) in series on both P and N lines, placed within 1 inch of the FPGA ball. Maintain differential intra-pair skew below 1 ps and pair-to-pair skew below 5 ps. Reference clock lines (REFCLK) need 100-ohm differential routing with no series resistors; do not cross reference clocks with data pairs.
Estimated: At full utilization (181k LE @ 80% toggle, 8 transceivers @ 3.75 Gbps, 840 DSP), core current draw on VCCINT (0.9V) is approximately 4-6 A. Use a buck regulator with at least 8 A rating and place decoupling as 200x 100 nF 0201 ceramic caps plus 4x 22 uF bulk capacitors within 5 mm of the BGA. Per the handbook, separate VCCD_PLL (PLL analog supply) and isolate it with a ferrite bead from VCCINT noise.
Do not confuse FF35 (1152-ball, largest in Arria II GX family) with EF29 (780-ball) or DF25 (484-ball) packages - they are NOT pin-compatible. The 'C5' speed grade is commercial-grade; for industrial -40C to +100C operation, choose EP2AGX190FF35I5G instead. Per the Arria II GX handbook, the maximum transceiver data rate is 3.75 Gbps (C5 grade); designs requiring 5+ Gbps need Arria V GZ or Cyclone V GT families.
合規資訊
RoHS and REACH compliant per Altera/Intel product declarations. AEC-Q100 not applicable (FPGA is not a discrete automotive-grade IC). Halogen-free status not specified in the Verified Web Data; check the Intel material declaration for details.
