EP2AGX260EF29C6 - Arria II GX 244K Logic Elements FPGA | Intel
MPN： EP2AGX260EF29C6 ✓ 啟用中EP2AGX260EF29C6 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs) within the integrated circuits taxonomy: FPGA -> PLD -> logic IC -> semiconductor. Unlike fixed-function ASICs, FPGAs can be reconfigured after the application is deployed, enabling hardware-level parallelism, rapid prototyping, and post-sale design updates. The Arria II GX family sits between Cyclone (low-cost) and Stratix (high-performance) in Intel's FPGA lineup.
Key features of the EP2AGX260EF29C6 include 244,188 logic elements, 12,038,144 bits of embedded memory, 612 embedded 18x18 multipliers for DSP, 12 transceiver channels supporting data rates up to 6.375 Gbps, and 372 general-purpose I/O pins. The device operates from a 0.9 V core supply and supports commercial temperature grades (0C to +85C). The 780-ball FC-FBGA package integrates flip-chip interconnect for high signal integrity at multi-gigabit speeds.
Architecturally, the Arria II GX uses 8-input adaptive logic modules (ALMs), each containing two combinational adaptive LUTs (ALUTs) and four dedicated registers. This structure delivers fine-grained logic utilization and efficient implementation of wide fan-in functions. The transceiver blocks integrate physical coding sublayer (PCS) and physical medium attachment (PMA) layers, supporting protocols such as PCIe Gen1/Gen2, Serial RapidIO, GPON, and CPRI. Hard memory controllers and PLLs reduce fabric utilization for common system tasks.
Typical applications include high-definition video processing, wireless baseband, military radar signal processing, ASIC prototyping, and high-speed serial interface bridging. The combination of transceiver bandwidth and DSP resources makes this device particularly well-suited for systems requiring real-time signal processing with multi-gigabit I/O.
When designing with this part, plan PCB layout for the FC-FBGA package using microvia and via-in-pad technology; signal integrity on transceiver channels depends on controlled-impedance routing and proper decoupling. Quartus II design software is required for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the Arria II GX family, and PCB-layout design notes not duplicated in the manufacturer datasheet.
直接替換替代品，適用於 EP2AGX260EF29C6 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2AGX260EF29C6 （相同外形與佔位） — 差異在於 Package, Speed Grade, Operating Temperature, Mounting Type, Process Technology.
EP2AGX260EF29C5N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX260EF29C5G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX260EF29C4N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX260EF29C4G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX260EF29C5
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2AGX260EF29C4
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2AGX260EF29C6 最大額定值與電氣特性
| Family | Arria II GX |
| Logic Elements | 244,188 |
| Memory Bits | 12,038,144 bits |
| Embedded 18x18 Multipliers | 612 |
| LABs (Logic Array Blocks) | 10,260 |
| User I/O Pins | 372 |
| Transceiver Channels | 12 |
| Transceiver Data Rate (max) | 6.375 Gbps |
| Process Technology | 40 nm TSMC |
| Core Voltage | 0.9 V |
| 封裝 | 780-ball FC-FBGA (EF29) |
| 工作溫度 | 0C to +85C (commercial) |
| 安裝類型 | Surface Mount (flip-chip BGA) |
| Design Software | Quartus II |
EP2AGX260EF29C6 780-ball fc-fbga (ef29) 腳位配置指南
EP2AGX260EF29C6（780-ball fc-fbga (ef29) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2AGX260EF29C6.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2AGX260EF29C6 適用於 7 應用s: High-Definition Video Processing, Wireless Baseband Signal Processing, ASIC Prototyping and Emulation, PCIe Gen2 Endpoint Card, Military Radar Signal Processing, High-Speed Serial Protocol Bridging, Industrial Machine Vision Systems.
High-Definition Video Processing
The EP2AGX260EF29C6's 244,188 logic elements and 612 18x18 multipliers deliver the parallelism required for real-time multi-stream HD/3G-SDI video processing at full frame rate. The 12,038,144 bits of embedded memory act as line buffers and frame stores without external SRAM, simplifying board layout. Its 12 transceiver channels handle SDI, HDMI, and DisplayPort bridging. This part replaces multiple ASSP video processors, reducing BOM cost in broadcast encoders and studio equipment.
推薦
Wireless Baseband Signal Processing
The 612 DSP blocks in the EP2AGX260EF29C6 implement LTE and WiMAX baseband FFT/iFFT, channel estimation, and turbo decoding at line rate. Transceiver rates up to 6.375 Gbps connect to RF front-end ADCs/DACs via CPRI or OBSAI. The 40 nm process balances dynamic power and performance for 4G small cells. Quartus II DSP Builder accelerates model-based design from MATLAB/Simulink directly into RTL.
推薦
ASIC Prototyping and Emulation
With 244,188 logic elements, the EP2AGX260EF29C6 emulates ASIC RTL at near-ASIC clock rates. Two or more devices can be tiled via transceivers to extend capacity to multi-million-gate ASIC prototypes. The Arria II GX architecture minimizes compile time versus larger FPGAs, accelerating verification cycles. Quartus II supports standard ASIC flows including SDC constraints and gate-level netlists from Synopsys Design Compiler.
推薦
PCIe Gen2 Endpoint Card
The EP2AGX260EF29C6 hard IP supports PCIe Gen1 (2.5 Gbps) and Gen2 (5 Gbps) with x1/x2/x4 lane configurations, eliminating soft PCIe cores and saving fabric. 12 transceivers permit multiple PCIe endpoints or combo cards with PCIe + SATA + GbE. The 780-ball FC-FBGA EF29 package fits standard PCIe card form factors with adequate BGA escape routing. Quartus II PCIe Compiler generates the complete TLP and config-space logic.
推薦
Military Radar Signal Processing
The 244K logic elements and 612 DSP blocks of the EP2AGX260EF29C6 execute pulse-Doppler and SAR processing in real time at multi-MHz sample rates. The 12 transceivers digitize and aggregate multiple ADC data streams at up to 6.375 Gbps. Extended-temperature Arria II GX variants exist for harsh-environment radar systems. Pin-compatible industrial-temperature speed grades (I3/I5) are drop-in options for defense applications.
推薦
High-Speed Serial Protocol Bridging
The 12 transceiver channels at 6.375 Gbps enable protocol bridging between SATA, Serial RapidIO, GPON, CPRI, and custom serial interfaces in one device. The hard PCS and PMA layers reduce latency versus soft SERDES implementations. 12 Mb of embedded memory provides packet buffering without external SRAM. Industrial-grade variants of the same die operate in telecom outdoor units and base-station backhaul equipment.
推薦
Industrial Machine Vision Systems
The EP2AGX260EF29C6 processes multi-camera machine-vision pipelines including image preprocessing, blob detection, and pattern recognition on the factory floor. 244K logic elements support 8 to 16 simultaneous CameraLink or CoaXPress streams. The 12 transceivers aggregate multiple CoaXPress links at 6.25 Gbps. Industrial-temperature variants extend operating range for harsh manufacturing environments.
推薦
推薦產品摘要
工程參考資料，適用於 EP2AGX260EF29C6 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2AGX260EF29C5N | EP2AGX260EF29C5G | EP2AGX260EF29C4N | EP2AGX260EF29C4G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FC-FBGA (EF29) | 780-ball FC-FBGA (EF29) - same | 780-ball FC-FBGA (EF29) - same | 780-ball FC-FBGA (EF29) - same | 780-ball FC-FBGA (EF29) - same |
| Logic Elements | 244,188 | 244,188 | 244,188 | 244,188 | 244,188 |
| Memory Bits | 12,038,144 | 12,038,144 | 12,038,144 | 12,038,144 | 12,038,144 |
| DSP 18x18 Multipliers | 612 | 612 | 612 | 612 | 612 |
| Speed Grade | C6 (commercial) | C5 (faster) | C5 (faster, Pb-free) | C4 (fastest) | C4 (fastest, Pb-free) |
| Transceiver Channels | 12 | 12 | 12 | 12 | 12 |
| User I/O Pins | 372 | 372 | 372 | 372 | 372 |
主要差異化特點
- Drop-in same-package speed-grade upgrade available (對比EP2AGX260EF29C5N)
- Largest Arria II GX device in 780-ball EF29 package (對比EP2AGX190EF29C6G)
- Industrial-temperature drop-in option exists (對比EP2AGX260EF29I3N)
設計說明
The 780-ball FC-FBGA EF29 package requires a multilayer PCB with microvia or via-in-pad technology to escape the dense ball array. Use 1 oz copper outer layers with low-loss dielectric (e.g., FR-4 Megtron 6) for the transceiver channels. Maintain 100 ohm differential impedance on transceiver pairs and 50 ohm single-ended on general-purpose I/O. Provide at least 4 GND balls per power ball to limit return-path inductance.
Estimated: power-supply decoupling requires at least 20 low-ESR ceramic capacitors (0.1uF and 10uF) within 100 mils of each power ball. Core supply (VCC) is 0.9 V and may draw up to 5 A under heavy DSP utilization. Use a dedicated LDO or DC-DC regulator with remote sensing at the package balls; shared supplies with other ICs will inject switching noise into the FPGA core and degrade timing margin.
Transceiver channels operating above 5 Gbps require pre-emphasis and equalization settings to be configured in the Quartus II ALT2GX megafunction. AC-coupling capacitors (100 nF) must be placed within 250 mils of each transmitter ball. Use IBIS-AMI models for channel simulation; the Arria II GX handbook Chapter 12 lists recommended pre-emphasis and VOD values per protocol. Avoid routing transceiver signals over power-plane splits.
Do not confuse EP2AGX260EF29C6 (commercial temperature, speed grade 6) with EP2AGX260EF29I3N (industrial temperature, speed grade 3); the temperature and speed grade are inverted and dropping an industrial-rated part into a commercial-only PCB does not always meet timing. Also note that 'EF29' is the package code, not a die revision - all EF29 Arria II GX 260 devices share the same die.
合規資訊
RoHS/REACH status was not in the verified web data; for Pb-free confirmation use EP2AGX260EF29C5G or EP2AGX260EF29C4G (G suffix indicates Pb-free/Green packaging). The Arria II GX family is not AEC-Q100 qualified - use industrial variants only for non-automotive extended-temperature environments.
