EP2AGX260EF29I5N - Arria II GX FPGA, 244K LE, 780-FBGA | Intel
MPN： EP2AGX260EF29I5N ✗ 停產EP2AGX260EF29I5N 概覽
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to implement arbitrary digital logic, memory blocks, DSP blocks, and high-speed serial interfaces on a single silicon die. FPGAs sit hierarchically within semiconductor devices as integrated circuits that combine the flexibility of software-configurable hardware with deterministic parallel processing. The Arria II GX family targets mid-range applications that bridge the gap between Cyclone low-cost devices and Stratix high-performance devices, offering a balance of logic density, transceiver bandwidth, and power efficiency for communications, broadcast, and military/aerospace systems.
Key features include 372 user I/O pins, 12 transceivers arranged in 4 transceiver blocks, support for DDR2/DDR3/QDRII/QDRII+ external memory interfaces, and dedicated PLL resources per quadrant. The device fabric uses Altera's adaptive logic module (ALM) architecture with 8-input fracturable look-up tables (LUTs), enabling efficient mapping of complex combinational and sequential logic. The 780-ball FCBGA package exposes 372 general-purpose I/O plus dedicated high-speed serial, clock, and configuration pins.
The Arria II GX architecture pairs a robust logic fabric with hardened intellectual property (IP) blocks such as PCIe Gen2 hard IP, external memory controllers, and on-chip termination (OCT) calibration. This integration reduces soft-IP overhead and frees fabric resources for application logic. Transceivers support multiple bonding configurations and reference clock topologies (including differential and single-ended) to accommodate a wide variety of PCB layouts.
Typical applications include wireless baseband processing, broadcast video processing, radar and electronic warfare signal chains, military secure communications, industrial imaging, and high-speed serial protocol bridging. Designers also use Arria II GX in test and measurement equipment where deterministic latency and flexible I/O are required.
When designing with this FPGA, plan for JTAG-based configuration using an Altera/Intel download cable (USB-Blaster or equivalent) and ensure the PCB includes clean transceiver analog supply rails (VCCA, VCCP, VCCR) with proper decoupling. The 780-FCBGA package requires a multilayer PCB with controlled-impedance routing for the transceiver channels and matched-length lanes within each transceiver bank.
This page synthesizes distributor pricing, industrial temperature and speed grade variants, and practical design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 EP2AGX260EF29I5N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2AGX260EF29I5N （相同外形與佔位） — 差異在於 Operating Temperature, Package, Speed Grade, Transceivers, Mounting Type.
EP2AGX260EF29I5G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX260EF29I5
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX260EF29I3N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX260EF29I3G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX260EF29C6N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX260EF29C5N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX260EF29C5G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX260EF29I5N 最大額定值與電氣特性
| Series | Arria II GX |
| Family | Arria II |
| Logic Elements | 244,188 |
| Adaptive Logic Modules (ALMs) | 10260 LABs |
| Embedded Memory Bits | 12,038,144 bits |
| Maximum User I/O | 372 |
| Number of I/O | 372 |
| Number of Transceivers | 12 |
| Transceiver Data Rate (CPLL) | up to 3.75 Gbps |
| Transceiver Data Rate (Channel PLL) | up to 5 Gbps |
| 18x18 Multipliers | 1,152 |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | 5 |
| Package Type | 780-BBGA, FCBGA (Flip-Chip BGA) |
| Package Dimensions | 29 mm x 29 mm |
| 安裝類型 | Surface Mount |
| Lead Free | Yes |
| RoHS 狀態 | Compliant |
| Process Technology | CMOS |
| Configuration | JTAG / passive serial / fast passive parallel |
EP2AGX260EF29I5N 29 mm x 29 mm 腳位配置指南
EP2AGX260EF29I5N（29 mm x 29 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2AGX260EF29I5N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2AGX260EF29I5N 適用於 6 應用s: Wireless Baseband Processing, Broadcast Video Processing and SDI Routing, Radar and Electronic Warfare Signal Chains, Industrial Imaging and Machine Vision, Test and Measurement Instrumentation, High-Speed Protocol Bridging and Aggregation.
Wireless Baseband Processing
The EP2AGX260EF29I5N is well-suited for wireless baseband processing because its 244,188 logic elements and 1,152 18x18 multipliers deliver the parallel DSP throughput required for LTE and WCDMA channelization, equalization, and FFT operations. The 12 transceivers at up to 5 Gbps handle CPRI or OBSAI links between baseband and radio units, while the industrial temperature range supports outdoor base station enclosures. Compared to a discrete DSP+ASIC solution, the EP2AGX260EF29I5N provides a single-chip upgrade path with reconfigurable protocol support.
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Broadcast Video Processing and SDI Routing
For broadcast video routers and SDI processing, the EP2AGX260EF29I5N provides 12 transceivers that natively support SD-SDI, HD-SDI, 3G-SDI, and dual-link 3G-SDI standards. The 12,038,144 bits of embedded memory buffer large video frames with low latency, while the 372 user I/O connect to HDMI, DisplayPort, and audio interfaces. Designers can implement de-interlacers, color-space converters, and multiviewers using the abundant DSP blocks. The 780-FBGA package footprint matches the EP2AGX260EF29I5G, enabling drop-in upgrades for halogen-free compliance.
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Radar and Electronic Warfare Signal Chains
Radar and EW systems benefit from the EP2AGX260EF29I5N because its 1,152 18x18 multipliers accelerate pulse compression, beamforming, and channelization algorithms in real time. The 12 high-speed transceivers digitize and route ADC data streams at sample rates up to 5 Gbps, while the large logic capacity implements adaptive MTI and CFAR detection. The industrial temperature range and the robustness of the Arria II GX architecture make it suitable for harsh electromagnetic environments. Designers can prototype on the EP2AGX260EF29I3N for lower-power pre-production validation.
推薦
Industrial Imaging and Machine Vision
Machine vision systems leverage the EP2AGX260EF29I5N for high-throughput image processing, with the 12 transceivers aggregating multi-camera CoaXPress or Camera Link streams at line rates up to 5 Gbps each. The 1,152 DSP blocks perform real-time convolution, FFT-based pattern matching, and defect detection algorithms. Industrial temperature grade (-40C to +100C) supports factory-floor deployment without active cooling. The 780-FBGA footprint enables compact frame-grabber card designs with reusable PCB layouts across the EP2AGX260 family.
推薦
Test and Measurement Instrumentation
Test and measurement instruments use the EP2AGX260EF29I5N as a flexible signal-processing backbone with deterministic latency and reconfigurable test vectors. The 12 transceivers handle multi-lane protocols such as PCIe Gen2, SATA, and USB 3.0 over PIPE bridges, while 372 user I/O connect to DACs, ADCs, and front-panel display controls. The abundant ALM resources implement custom modulation, error injection, and protocol decoding in real time. Designers often pair the EP2AGX260EF29I5N with the lower-cost EP2AGX125EF35C6G for entry-level instruments.
推薦
High-Speed Protocol Bridging and Aggregation
The EP2AGX260EF29I5N excels as a multi-protocol bridge aggregating serial links from PCIe Gen2, Serial RapidIO, and Gigabit Ethernet into a unified system. Its 12 transceivers run simultaneous independent protocols at different line rates, while 244K logic elements implement application-layer packet processing and traffic shaping. The 780-FBGA package's high pin count exposes sufficient I/O for multiple PHY connections, status LEDs, and configuration buses. The same silicon is reused in the EP2AGX260EF29I5G with halogen-free compliance for medical and aerospace system integrators.
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推薦產品摘要
工程參考資料，適用於 EP2AGX260EF29I5N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2AGX260EF29I5G | EP2AGX260EF29I5 | EP2AGX260EF29I3N | EP2AGX260EF29I3G | EP2AGX260EF29C6N | EP2AGX260EF29C5N | EP2AGX260EF29C5G |
|---|---|---|---|---|---|---|---|---|
| Package | 780-FBGA (29x29 mm) | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 244,188 | 244,188 | 244,188 | 244,188 | 244,188 | 244,188 | 244,188 | 244,188 |
| Speed Grade | 5 | 5 | 5 | 3 (slower, lower power) | 3 (slower, lower power) | 6 (faster) | 5 | 5 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Number of Transceivers | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| Embedded Memory (bits) | 12,038,144 | 12,038,144 | 12,038,144 | 12,038,144 | 12,038,144 | 12,038,144 | 12,038,144 | 12,038,144 |
| Lead-Free / Halogen-Free | Lead-free (no halogen-free suffix) | Lead-free + Halogen-free | Lead-bearing (non-RoHS) | Lead-free (no halogen-free suffix) | Lead-free + Halogen-free | Lead-free (no halogen-free suffix) | Lead-free (no halogen-free suffix) | Lead-free + Halogen-free |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Industrial temperature grade with speed grade 5 balance (對比EP2AGX260EF29C5N)
- Lead-free packaging compliant with RoHS (對比EP2AGX260EF29I5 (non-N suffix))
- Halogen-free compliance alternative available as drop-in (對比EP2AGX260EF29I5G)
設計說明
The Arria II GX device family requires multiple separate supply rails: core VCC, VCCD_PLL, VCCA (transceiver analog), VCCP (transceiver PMA), VCCR (transceiver receiver), VCCIO for each I/O bank, and VCCPD for pre-drivers. Per the Arria II GX Handbook, decouple each rail with a 0.1 uF ceramic cap within 50 mils of every supply pin, plus bulk tantalum or polymer capacitors at the PCB power plane entry. Use a PowerTree controller such as the LTC3566 or LTM4615 to sequence rails in the order specified by the handbook to avoid latch-up. Power estimation in early design phases should use the Early Power Estimator (EPE) spreadsheet provided by Altera/Intel.
The 780-FBGA package requires a multilayer PCB (typically 8-12 layers) with microvia or stacked-via technology for fanout from the 1.0 mm pitch BGA. Transceiver channel traces must be routed as 100 ohm differential pairs with intra-pair skew under 1 ps and inter-pair length matching per the Arria II GX transceiver layout guidelines. Place the VCCA, VCCP, and VCCR planes as solid reference planes directly under the transceiver balls, separated from the core VCC plane to isolate switching noise. Reference the Altera AN 484 / AN 531 transceiver board design application notes for trace geometries and via stitching recommendations.
Do not assume all 'EP2AGX260EF29' package variants are interchangeable. The 'I' suffix is industrial temperature grade and the 'C' suffix is commercial grade - substituting a commercial part into an industrial design can cause field failures outside the 0C to +85C range. The '5' versus '3' speed grade affects timing closure - downgrading to speed grade 3 reduces the maximum transceiver data rate and Fmax. The trailing 'N' indicates lead-free, while the 'G' suffix adds halogen-free compliance. For RoHS markets always use the 'N' or 'G' variant; the non-N lead-bearing version is restricted to legacy or military markets.
合規資訊
RoHS compliant and lead-free per the 'N' suffix in the part number, confirmed by DigiKey, Mouser, and AmpHeo product listings. The non-'G' variant is NOT halogen-free - use the EP2AGX260EF29I5G for halogen-free requirements. AEC-Q100 is not applicable since this is an FPGA, not a discrete automotive IC.
