EP2AGZ225HF40C4G - 225K LE Arria II GZ FPGA, 1517-FBGA | Intel
MPN： EP2AGZ225HF40C4G ✓ 啟用中EP2AGZ225HF40C4G 概覽
An FPGA (Field-Programmable Gate Array) is a programmable semiconductor device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory blocks, and DSP slices. FPGAs sit in the programmable-logic layer of the digital design hierarchy, above general-purpose microcontrollers and below fixed-function ASICs, and are widely used for hardware-acceleration, prototyping, and time-to-market-sensitive designs.
Key features of the EP2AGZ225HF40C4G include 8 dedicated 3.125 Gbps transceivers (C4 speed grade, commercial, 0.85V Vcc), 1,224 18x18 hardware multipliers for high-performance DSP, 12.5 Mbits of embedded RAM, and 734 general-purpose user I/Os that support multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. The HF40 package designation indicates a high-density FineLine BGA with 1517 balls.
The Arria II GZ architecture combines a fine-grained logic fabric with hardened memory and DSP blocks, achieving an optimal balance between logic density, performance, and power. Transceivers support protocols such as PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and SerialLite II, enabling high-speed serial connectivity for communications, broadcast, and military designs.
Typical applications include high-speed serial-interface bridging cards, DSP co-processing cards, software-defined radio (SDR) baseband cards, telecom line cards, military radar and signal-intelligence prototypes, and ASIC prototyping platforms that demand hundreds of I/Os and multi-gigabit transceivers.
When designing with this device, ensure adequate power-rail decoupling near every transceiver supply pin, controlled-impedance routing on all high-speed serial lanes, and thermal relief for the FineLine BGA through adequate PCB copper and airflow.
This page synthesizes distributor pricing, drop-in Arria II GZ alternatives, and practical board-design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 EP2AGZ225HF40C4G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2AGZ225HF40C4G （相同外形與佔位） — 差異在於 Logic Elements (LE), Package, Speed Grade, Package Type, Operating Temperature.
EP2AGZ225HF40C3G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGZ225HF40C3N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGZ225FF35I4N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGZ225HF40C4G 最大額定值與電氣特性
| Logic Elements (LE) | 225,000 |
| Embedded Memory | 12.5 Mbits (M9K blocks) |
| 18x18 Hardware Multipliers | 1,224 |
| Transceivers | 8 channels, up to 3.125 Gbps |
| Maximum User I/O | 734 |
| 封裝 | 1517-FBGA (FineLine BGA), 40 mm x 40 mm class |
| Process Technology | 40 nm TSMC low-power CMOS |
| Core Voltage (Vcc) | 0.85 V (typical, speed grade C4) |
| Speed Grade | C4 (commercial, mid-performance) |
| 工作溫度 | 0C to +85C (commercial) |
| 安裝類型 | Surface Mount (BGA) |
| MSL 等級 | 3 (168 hours) |
| RoHS 狀態 | Compliant |
EP2AGZ225HF40C4G 1517-fbga (fineline bga), 40 mm x 40 mm class 腳位配置指南
EP2AGZ225HF40C4G（1517-fbga (fineline bga), 40 mm x 40 mm class 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2AGZ225HF40C4G.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2AGZ225HF40C4G 適用於 6 應用s: Telecom Line Card / Backplane Bridge, Software-Defined Radio (SDR) Baseband Processing, ASIC Prototyping Platform / Emulation, High-Speed Serial Interface Bridge Card, Industrial Imaging / Machine Vision, Military / Aerospace Signal Intelligence.
Telecom Line Card / Backplane Bridge
The EP2AGZ225HF40C4G fits telecom line cards because its 8 integrated transceivers operate up to 3.125 Gbps and support Serial RapidIO and Gigabit Ethernet protocols. With 225K logic elements, the device absorbs packet classification, traffic shaping, and OAM processing on a single die, replacing multi-ASIC solutions. The 734 user I/Os provide ample connectivity for SGMII/SFI4.1 fan-out, timing-card interfaces, and fabric backplanes. Compared with a discrete ASSP, the FPGA variant enables late-binding protocol updates in the field via JTAG configuration. Designers typically combine the EP2AGZ225 with 64-bit DDR3 memory and an external PHY such as the TLK2711 or 88E1111 for full-rate serial links.
推薦
Software-Defined Radio (SDR) Baseband Processing
The 1,224 18x18 hardware multipliers on the EP2AGZ225HF40C4G deliver massive DSP throughput, making it well-suited for SDR baseband cards that implement FFT, channelization, and digital down-conversion on a single FPGA. With 12.5 Mbits of embedded M9K RAM, the device holds large window buffers, sample storage, and twiddle-factor tables without external memory pressure. The 8 transceivers connect directly to ADC/DAC JESD204B or LVDS lanes at multi-gigabit rates, and the 1517-FBGA package provides 734 I/Os for parallel data capture, GPIO expansion, and clock distribution. Designers can prototype LTE, 5G NR, or military waveforms in firmware while preserving hardware reuse for next-generation standards.
推薦
ASIC Prototyping Platform / Emulation
ASIC prototyping benefits from the EP2AGZ225HF40C4G's 225K logic elements, abundant embedded memory, and 734 user I/Os that map almost any mid-complexity ASIC partition. The 1517-FBGA package supports high-speed serial links for chip-to-chip bridging between multiple FPGAs in a multi-FPGA emulator. Hardened multipliers accelerate embedded-DSP emulation paths without consuming general fabric. Designers partition the target ASIC into the EP2AGZ225 plus companion FPGAs such as the EP2AGX190FF35C4G or EP2AGX260EF35C4G to scale capacity. The commercial C4 speed grade is adequate for functional validation rather than full-speed emulation, where the C3 speed grade is preferred.
推薦
High-Speed Serial Interface Bridge Card
The 8 transceivers of the EP2AGZ225HF40C4G are well-matched to PCIe Gen1/Gen2 endpoint or root-port bridge cards, Serial RapidIO bridges, and SATA/SerialLite II fan-out cards. With up to 3.125 Gbps per lane and hardened PCS/PMA blocks, the FPGA can drive PCIe x4/x8 endpoints, 10GbE SFP+ interfaces, or SAS expanders. The 734 user I/Os allow extensive parallel interfaces for legacy bus bridging, and the 12.5 Mbits of embedded RAM buffer packets or video frames in real time. System designers often pair the FPGA with external retimers such as the TLK2711 or DS80PCI402 for cable reach beyond 1 metre.
推薦
Industrial Imaging / Machine Vision
Industrial imaging systems leverage the EP2AGZ225HF40C4G's 734 user I/Os to receive parallel data from multiple high-resolution image sensors at base, medium, or Camera Link rates, while the 1,224 hardware multipliers accelerate real-time image pre-processing such as convolution, Bayer demosaicing, and edge detection. The 12.5 Mbits of embedded memory holds line buffers and lookup tables, reducing external DDR pressure. The 8 transceivers support 10GbE or CoaXPress uplink to host PCs. Designers implement line-scan and area-scan cameras, multi-head inspection rigs, and 3D laser triangulation systems on a single Arria II GZ die. The C4 commercial speed grade is suitable for image-acquisition bandwidth up to ~6 Gbps aggregate.
推薦
Military / Aerospace Signal Intelligence
For military and aerospace signal-processing platforms, the EP2AGZ225HF40C4G combines DSP-rich logic with multi-gigabit transceivers, enabling wideband signal-intelligence front-ends, electronic-warfare jammers, and radar pre-processors. The 225K logic elements support wideband FFTs and channelizers, and the 1,224 multipliers accelerate digital beamforming in phased-array radar. The 1517-FBGA package supports 734 I/Os for ADCs, DACs, and digital beam data. Designers targeting defence platforms often migrate prototype code from this commercial variant to industrial or MIL-PRF graded siblings in the same family. Air-flow and thermal copper pours are essential because BGA packages concentrate heat under the die.
推薦
推薦產品摘要
工程參考資料，適用於 EP2AGZ225HF40C4G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2AGZ225HF40C3G | EP2AGZ225HF40C3N | EP2AGZ225FF35I4N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 1517-FBGA | 1517-FBGA - same | 1517-FBGA - same | 1517-FBGA - same ball map |
| Logic Elements | 225,000 | 225,000 - same | 225,000 - same | 225,000 - same die |
| Speed Grade | C4 | C3 (faster) | C3 (faster) | I4 (industrial) |
| Embedded Memory | 12.5 Mbits | 12.5 Mbits - same | 12.5 Mbits - same | 12.5 Mbits - same die |
| 18x18 Multipliers | 1,224 | 1,224 - same | 1,224 - same | 1,224 - same |
| Transceivers | 8 @ 3.125 Gbps | 8 @ 3.125 Gbps - same | 8 @ 3.125 Gbps - same | 8 @ 3.125 Gbps - same die |
| RoHS Compliance | Yes (G suffix) | Yes (G suffix) | No (N suffix) | No (N suffix) |
主要差異化特點
- Only 225K LE Arria II GZ variant with 8 transceivers and 734 user I/Os (對比EP2AGZ225HF40C3G)
- RoHS/lead-free finish with 1517-FBGA high-pin-count package (對比EP2AGZ225HF40C3N)
- Commercial temperature grade C4 for cost-optimised designs (對比EP2AGZ225FF35I4N)
- Hardened transceiver PCS/PMA blocks eliminate external PHY cost (對比Discrete ASSP bridge (e.g., TLK2711))
設計說明
The 1517-FBGA FineLine BGA package requires controlled-impedance routing for all high-speed serial lanes (100 ohm differential for transceivers, 50 ohm single-ended for clocks). Use 8-layer stack-up with continuous GND/PWR planes adjacent to signal layers; place a stitching via fence every 200 mils around BGA breakouts to suppress parallel-plate resonances. Per IPC-2222 type-IV design rules, escape trace width should be 0.1 mm (4 mil) with 0.1 mm via-pad pitch to fit BGA breakouts. Ensure microvia aspect ratio stays below 1:1 for stack-up reliability on the top two layers.
Decouple each transceiver supply pin (VCCA_PLL, VCCA_TX, VCCA_RX, VCCHIP) with 0.1 uF X7R ceramic plus 4.7 uF X5R bulk within 50 mils of the ball. Use separate regulator rails for VCCINT (0.85V), VCCIO (1.5V-3.3V depending on bank), and VCCPD. Place a 22 uF tantalum near the VCCINT ball and ensure 1 oz copper planes supply >2 A peak current to the VCCINT rail. Estimated: typical VCCINT current at full utilisation is 5-8 A; verify with Altera's PowerPlay early power estimator before layout finalisation.
Estimated: at 100% utilisation with full transceiver activity, the EP2AGZ225HF40C4G can dissipate 8-12 W. The 1517-FBGA has theta_JA of approximately 6-8 C/W with a 6x6 microvia array PCB; expect 50-95 C junction temperature rise above ambient. For reliable operation in commercial grade (max 85C), mount a 4-6 mm heatsink with thermal interface material, and consider a forced-air 200 LFM airflow across the BGA. Place 12 thermal vias (0.3 mm drill) under the die-expose pad to spread heat through inner GND planes.
Do not route any high-speed serial lane over a PWR plane split - this destroys return-path continuity and causes EMI failures. Verify that all transceiver reference-clock inputs are AC-coupled with 0.1 uF capacitors and meet the differential V_OD of at least 200 mV. The configuration flash (EPCS64) must be programmed with a Cyclone III/IV/V-compatible image; using an Altera-specific file format (POF) requires Quartus II 13.0sp1 or later. Finally, leave all 8 transceivers powered even if unused to avoid leakage on internal bias networks.
For 3.125 Gbps links, set TX pre-emphasis to 'pre-emphasis 1' and RX equaliser to 'adaptive' to compensate for 10+ inch FR4 trace loss. Use Agilent ADS or SiSoft SIplus to model channel insertion loss and crosstalk before tape-out. Match differential intra-pair skew within 5 mils and pair-to-pair skew within 30 mils per PCIe CEM specification. Reference clock jitter must be < 100 fs RMS for Serial RapidIO compliance; use a dedicated low-jitter clock such as the CDCE72010.
合規資訊
RoHS compliance indicated by G suffix in MPN per Intel/Altera part-number convention. AEC-Q100 is not applicable as this is a programmable logic IC, not an automotive-grade discrete semiconductor. REACH compliance declared by Intel product policy.
