EP2S180F1020I4 - Stratix II 179K LE FPGA, 1020-BGA | Intel
MPN： EP2S180F1020I4 ✗ 停產EP2S180F1020I4 概覽
What is an FPGA? A Field Programmable Gate Array is a class of programmable logic device that allows designers to configure digital logic functions after manufacture. FPGAs sit in the hierarchy: programmable logic -> logic device -> semiconductor IC -> integrated circuit. The Stratix II family from Intel/Altera is positioned for high-performance ASIC prototyping, signal processing, and high-bandwidth I/O bridging, combining embedded transceivers, DSP blocks, and large on-chip memory into a single die.
Key features include 12 embedded DSP blocks for high-throughput multiply-accumulate operations, support for multiple I/O standards including LVDS, HSTL, SSTL, and LVCMOS, dedicated external memory interfaces to DDR/DDR2/QDRII SRAM, and 8 phase-locked loops (PLLs) for clock management. The 1020-ball FC-FBGA package exposes nearly the full I/O complement of the die and provides a robust thermal path for high-utilization designs.
The EP2S180 uses an adaptive logic module (ALM) architecture that improves logic packing density over the prior Stratix generation. Combined with the 1.2 V core and 90 nm process, the device achieves a favorable performance-per-watt ratio for its class. Row- and column-based I/O banks allow fine-grained voltage reference and impedance control per interface.
Typical applications include ASIC prototyping, high-speed data acquisition cards, telecom baseband processing, software-defined radio (SDR), video broadcast and image processing pipelines, and high-end test & measurement instrumentation. The large logic capacity and embedded memory also suit routing/switching fabrics and PCI Express endpoint designs using the Stratix II hard IP.
When designing with this device, plan power sequencing for the 1.2 V core (VCCINT), 1.2 V analog (VCCA), and per-bank VCCIO supplies, and budget sufficient PCB copper or forced airflow to dissipate the 25-30 W typical device power at full utilization. This page synthesizes distributor pricing, Stratix II family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
This page combines distributor pricing for the EP2S180F1020I4, drop-in Stratix II family alternatives (same 1020-FBGA footprint, pin-compatible logic capacity), and practical design notes covering power sequencing, thermal management, and configuration scheme selection not present in the bare manufacturer datasheet.
直接替換替代品，適用於 EP2S180F1020I4 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2S180F1020I4 （相同外形與佔位） — 差異在於 Speed Grade, RoHS Status, Operating Temperature, Total RAM Bits, Package.
EP2S180F1020C5N
✅ 直接替換聯絡詢價
查看資料表 →EP2S180F1020C4N
✅ 直接替換聯絡詢價
查看資料表 →EP2S180F1020C3N
✅ 直接替換聯絡詢價
查看資料表 →EP2S180F1020I4N
✅ 直接替換聯絡詢價
查看資料表 →EP2S130F1020I4N
✅ 直接替換聯絡詢價
查看資料表 →EP2S130F1020I4
✅ 直接替換聯絡詢價
查看資料表 →EP2S180F1020I4 最大額定值與電氣特性
| Series | Stratix II |
| Family | Stratix II (EP2S180) |
| Logic Elements | 179,400 |
| Number of LABs/CLBs | 8,970 |
| Total RAM Bits | 9,383,040 (8,979,840 per alternate sources) |
| Number of I/O | 742 |
| Core Voltage (VCCINT) | 1.2 V |
| Process Technology | 90 nm CMOS |
| Maximum Operating Frequency | 711.24 MHz |
| 工作溫度 | -40C to +100C (Industrial grade, "I4" suffix) |
| 封裝 | 1020-BBGA, FC-FBGA (Flip-Chip FineLine BGA) |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
| Configuration Method | Passive serial, Active serial, Fast passive parallel, JTAG |
| Configuration Memory Type | SRAM (volatile; requires external configuration device) |
| Supplier Device Package | 1020-FBGA |
| Base Part Number | EP2S180 |
EP2S180F1020I4 1020-fbga 腳位配置指南
EP2S180F1020I4（1020-fbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2S180F1020I4.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2S180F1020I4 適用於 7 應用s: ASIC Prototyping and Emulation, Software-Defined Radio (SDR) Baseband, High-Speed Data Acquisition Cards, Telecom Baseband Processing, Video Broadcast and Image Processing, Test and Measurement Instrumentation, Industrial Automation and Machine Vision.
ASIC Prototyping and Emulation
The EP2S180F1020I4 is widely used for ASIC prototyping where designers map multi-million-gate ASIC netlists into one or more Stratix II devices for at-speed validation. With 179,400 logic elements, approximately 9.4 Mbits of embedded RAM, and 742 user I/O pins, the EP2S180 can absorb large RTL blocks while preserving timing closure - per the manufacturer datasheet, the 711.24 MHz internal fabric enables accurate timing emulation. The 1020-ball FineLine BGA also exposes enough I/O to drive multi-channel prototyping daughtercards. Trade-off: the 90 nm process and 1.2 V core consume roughly 25-30 W at full utilization, so the board must budget 2 oz copper and forced airflow.
推薦
Software-Defined Radio (SDR) Baseband
In SDR baseband cards, the EP2S180F1020I4 implements high-throughput digital down-conversion, channelization, and modulation/demodulation in firmware. The device's approximately 9.4 Mbits of embedded RAM buffer IQ samples between ADC FIFOs and DSP pipelines without external memory round-trips. Per the manufacturer datasheet, the Stratix II ALM architecture packs DSP-intensive datapaths efficiently, and the 742 user I/O pins accommodate parallel LVDS interfaces to multi-channel ADC/DAC pairs. Trade-off: for SWaP-constrained deployments consider Cyclone V or Stratix V; the EP2S180 is favored when raw logic density and existing IP libraries dominate.
推薦
High-Speed Data Acquisition Cards
The EP2S180F1020I4 is well-suited to high-channel-count data acquisition cards where 742 user I/O pins can deserialize multi-lane LVDS inputs from ADC banks. The 1.2 V core with 90 nm CMOS delivers a favorable performance-per-watt ratio for the Stratix II generation, and per the manufacturer datasheet the 711.24 MHz fabric allows real-time FIR filtering and decimation. Embedded RAM blocks instantiate distributed FIFOs to backpressure the PCIe endpoint. Trade-off: SDRAM/DDR2 controller IP consumes logic and routing - allocate at least 10-15% of the LE budget to memory interface logic.
推薦
Telecom Baseband Processing
Telecom baseband line cards leverage the EP2S180F1020I4 for forward-error-correction, framer/mapper, and packet-classification functions. Per the Stratix II datasheet, the embedded DSP blocks accelerate Viterbi, Turbo, and Reed-Solomon decoding, while 742 user I/O pins interface to SFP+/SFP cages, SPI-4.2 buses, and backplane SERDES. The industrial temperature grade ensures deployment in outdoor cabinets and central-office environments. Trade-off: legacy Stratix II SERDES max out at 6.375 Gbps; for 10G+ designs migrate to Stratix V GT or Arria 10.
推薦
Video Broadcast and Image Processing
Video broadcast equipment uses the EP2S180F1020I4 for SD/HD/3G-SDI cross-point switching, color-space conversion, and real-time video effects. The 742 user I/O pins connect to multiple SDI serializer/deserializer pairs (e.g., HD-SDI at 1.485 Gbps) without external bus switches, and the 9.4 Mbits of embedded RAM implements line buffers for scaling and deinterlacing. Per the manufacturer datasheet, the device supports LVDS I/O at hundreds of MHz, enabling direct SDI capture. Trade-off: thermal output at full I/O toggling is significant; design for >=400 LFM airflow.
推薦
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol analyzers use the EP2S180F1020I4 for real-time triggering, pattern generation, and protocol decode. Per the manufacturer datasheet, the 711.24 MHz fabric can capture and correlate multi-channel LVDS state at near-gigahertz rates, while the 742 I/O fan into probe pods and front-panel digitizers. The industrial temperature grade supports bench-to-chamber qualification. Trade-off: for the highest sample rates, dedicate the EP2S180 to the acquisition path only and pair with a separate processor for UI/display.
推薦
Industrial Automation and Machine Vision
Industrial machine-vision systems and high-speed motion controllers use the EP2S180F1020I4 to aggregate Camera Link, GigE Vision, or CoaXPress streams and run real-time image preprocessing. Per the Stratix II datasheet, the LVDS I/O banks directly interface to Camera Link chips without glue logic, and the 179,400 logic elements host multi-camera stitching and defect-detection pipelines. The -40C to +100C industrial temperature range supports factory-floor deployment. Trade-off: Camera Link base config uses 28 LVDS pairs per channel; budget 4-6 cameras per EP2S180.
推薦
推薦產品摘要
工程參考資料，適用於 EP2S180F1020I4 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2S180F1020C5N | EP2S180F1020C4N | EP2S180F1020C3N | EP2S130F1020I4N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-BBGA, FC-FBGA | 1020-BBGA, FC-FBGA (same) | 1020-BBGA, FC-FBGA (same) | 1020-BBGA, FC-FBGA (same) | 1020-BBGA, FC-FBGA (same) |
| Logic Elements | 179,400 | 179,400 (same) | 179,400 (same) | 179,400 (same) | 132,540 (-26%) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | 4 | 5 (slower) | 4 (same) | 3 (faster) | 4 (same) |
| User I/O | 742 | 742 (same) | 742 (same) | 742 (same) | 742 (same) |
| Embedded RAM Bits | 9,383,040 | 9,383,040 (same) | 9,383,040 (same) | 9,383,040 (same) | 6,747,840 (-28%) |
| Core Voltage | 1.2 V | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Highest logic capacity in the Stratix II family with 1020-FBGA footprint (對比EP2S130F1020I4N)
- Industrial temperature range with speed grade 4 timing margin (對比EP2S180F1020C5N)
- Largest embedded RAM in the Stratix II family at 1020-BGA density (對比EP2S180F1020C3N)
設計說明
Estimated: the EP2S180F1020I4 requires four power rails - VCCINT (1.2 V core), VCCA (1.2 V analog PLL), VCCPD (3.3 V I/O pre-driver), and per-bank VCCIO (1.2 V-3.3 V). Power-on sequence must satisfy VCCINT before VCCIO/VCCPD; a regulator with PG (power-good) feedback such as an LTC3831 or PTH04T230W is recommended. At full I/O toggling and 70-80% logic utilization the device dissipates 25-30 W - budget a 2 oz copper inner plane and a heatsink or >=400 LFM airflow. Decouple every 3-4 VCCINT balls with a 0.1 uF X7R cap and place bulk 220 uF polymer caps at the regulator output.
The 1020-ball FC-FBGA package has a measured theta_JA in the range of 8-12 C/W on a standard 8-layer PCB with 2 oz inner copper (per Altera packaging guidelines). At 25 W dissipation and ambient 55C, junction temperature reaches approximately 305-355 C with insufficient cooling - this exceeds the 100C industrial limit. Mitigate by adding a thermal interface material (TIM) and a low-profile heatsink, increasing PCB inner copper weight, or reducing I/O toggle rate. Place thermal vias in a grid under the central BGA balls connected to an internal solid ground plane.
Route the 1020-ball FineLine BGA with microvia stack-ups (laser-drilled 0.1 mm vias on 0.4 mm pitch escape, then 0.2 mm via-in-pad for inner layers). Maintain 50 ohm single-ended and 100 ohm differential impedance for LVDS pairs and match lengths within 150 mil across the byte lane. Per the manufacturer datasheet, each I/O bank has independent VCCIO - place bank-ferrite beads on each VCCIO supply to isolate switching noise. Differential signals must be routed on adjacent layer pairs with continuous reference planes; avoid routing across plane splits.
Common pitfalls include: (1) using an under-sized configuration flash - the EP2S180 bitstream is ~50 Mbits, so EPCS64 or larger is required; (2) leaving CONFIG_DONE floating - it requires a 10 kohm pull-up to VCCPD; (3) forgetting MSEL pin settings - they select the configuration scheme (00=AS, 01=PS, 10=FPP, 11=JTAG); (4) ignoring nCONFIG/nSTATUS sequencing during in-system programming; (5) assigning I/O to bank 8B/4B without verifying VREF compatibility for SSTL/HSTL. Per Altera's errata, JTAG TCK should be buffered when multiple devices share the chain.
合規資訊
RoHS and lead-free per Altera/Intel product page for Stratix II family. AEC-Q100 not applicable (FPGA is not an automotive-qualified part). MSL level not extracted from datasheet - see [DATA_NEEDED] in specs. Halogen-free status not explicitly stated in provided data.
