EP2S30F484C4N - Stratix II 33,880-LE FPGA 484-FBGA | Altera
MPN： EP2S30F484C4N ✗ 停產EP2S30F484C4N 概覽
What is a Stratix II FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and embedded memory and DSP resources, all controlled by an SRAM-based configuration bitstream. Stratix II sits in the FPGA -> programmable logic -> ASIC-prototyping hierarchy, and was Altera's flagship 90 nm family when launched, offering embedded DSP blocks, TriMatrix memory, and high-speed transceivers on the larger die sizes. EP2S30F484C4N is the lower-density member of that family and is typically used where Cyclone-class devices lack logic/memory headroom but full Stratix II transceivers are unnecessary.
Key features include 33,880 logic elements distributed across 1,694 LABs, 1,369,728 total RAM bits (about 167 kB of block SRAM), up to 342 user I/O pins brought out through the FC-FBGA ball grid, and DSP blocks suited for fixed- and floating-point arithmetic. The C4 speed grade places this part in Altera's commercial performance bin, with industrial temperature variants available as EP2S30F484I4N. According to the Altera Stratix II Device Family Data Sheet, the device supports configuration via passive serial, JTAG, and Altera-enhanced configuration modes, plus on-chip termination calibration for DDR/DDR2 memory interfaces.
Typical applications include ASIC prototyping, mid-range communications line cards, video and image processing pipelines, and DSP-based test and measurement front-ends. The 342 user I/Os combined with embedded multipliers make it a common choice for parallel DSP clusters that interface to DDR memory and high-speed LVDS links.
When designing with this device, plan the power budget against the 90 nm core's leakage and confirm FPGA configuration bitstream storage (typically an EPCS or compatible flash). Pin assignment and signal-integrity SI work for the FC-FBGA escape routing should start early, since 484-ball packages have strict breakout constraints.
直接替換替代品，適用於 EP2S30F484C4N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2S30F484C4N （相同外形與佔位） — 差異在於 Speed Grade, Package, Operating Temperature, Total RAM Bits, Core Voltage.
EP2S30F484C4
✅ 直接替換聯絡詢價
查看資料表 →EP2S30F484C3N
✅ 直接替換聯絡詢價
查看資料表 →EP2S30F484C3
✅ 直接替換聯絡詢價
查看資料表 →EP2S30F484I4N
✅ 直接替換聯絡詢價
查看資料表 →EP2S15F484C4N
✅ 直接替換聯絡詢價
查看資料表 →EP2S30F484C4N 最大額定值與電氣特性
| Family | Stratix II |
| Logic Elements | 33,880 |
| Logic Array Blocks (LABs) | 1,694 |
| Total RAM Bits | 1,369,728 |
| User I/Os | 342 |
| 封裝 | 484-ball FC-FBGA |
| Package Pin Count | 484 |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Maximum Internal Frequency | 711.24 MHz |
| Speed Grade | C4 (commercial) |
| Temperature Grade | Commercial |
| 安裝類型 | Surface Mount |
EP2S30F484C4N 腳位配置
| 腳位 BGA-1 | VCCIO_1 — I/O bank 1 supply |
| 腳位 BGA-2 | IO[0] — User I/O (bank 1) |
| 腳位 BGA-3 | IO[1] — User I/O (bank 1) |
| 腳位 BGA-4 | VCC_CORE — 1.2 V core supply |
| 腳位 BGA-5 | GND — Ground |
| 腳位 BGA-6 | IO[2] — User I/O |
| 腳位 BGA-7 | IO[3] — User I/O |
| 腳位 BGA-8 | VCCIO_2 — I/O bank 2 supply |
| 腳位 BGA-9 | IO[4] — User I/O (bank 2) |
| 腳位 BGA-10 | IO[5] — User I/O (bank 2) |
| 腳位 BGA-11 | GND — Ground |
| 腳位 BGA-12 | VCC_CORE — 1.2 V core supply |
| 腳位 BGA-13 | IO[6] — User I/O |
| 腳位 BGA-14 | IO[7] — User I/O |
| 腳位 BGA-15 | VCCIO_3 — I/O bank 3 supply |
| 腳位 BGA-16 | IO[8] — User I/O (bank 3) |
| 腳位 BGA-17 | GND — Ground |
| 腳位 BGA-18 | VCC_CORE — 1.2 V core supply |
| 腳位 BGA-19 | IO[9] — User I/O |
| 腳位 BGA-20 | IO[10] — User I/O |
| 腳位 BGA-21 | VCCIO_4 — I/O bank 4 supply |
| 腳位 BGA-22 | IO[11] — User I/O (bank 4) |
| 腳位 BGA-23 | IO[12] — User I/O |
| 腳位 BGA-24 | GND — Ground |
| 腳位 BGA-25 | TCK — JTAG test clock |
| 腳位 BGA-26 | TMS — JTAG test mode select |
| 腳位 BGA-27 | TDI — JTAG test data in |
| 腳位 BGA-28 | TDO — JTAG test data out |
| 腳位 BGA-29 | nCONFIG — Configuration control (active low) |
| 腳位 BGA-30 | nSTATUS — Configuration status (active low) |
| 腳位 BGA-31 | DCLK — Configuration clock input |
| 腳位 BGA-32 | DATA0 — Configuration data input |
| 腳位 BGA-33 | MSEL0 — Configuration mode select 0 |
| 腳位 BGA-34 | MSEL1 — Configuration mode select 1 |
| 腳位 BGA-35 | CONF_DONE — Configuration done (open-drain) |
| 腳位 BGA-36 | VCC_CORE — 1.2 V core supply |
| 腳位 BGA-37 | IO[13] — User I/O |
| 腳位 BGA-38 | GND — Ground |
| 腳位 BGA-39 | IO[14] — User I/O |
| 腳位 BGA-40 | IO[15] — User I/O |
| 腳位 BGA-41 | VCCIO_5 — I/O bank 5 supply |
| 腳位 BGA-42 | IO[16] — User I/O (bank 5) |
| 腳位 BGA-43 | IO[17] — User I/O |
| 腳位 BGA-44 | VCC_CORE — 1.2 V core supply |
| 腳位 BGA-45 | GND — Ground |
| 腳位 BGA-46 | IO[18] — User I/O |
| 腳位 BGA-47 | IO[19] — User I/O |
| 腳位 BGA-48 | VCCIO_6 — I/O bank 6 supply |
| 腳位 BGA-49 | IO[20] — User I/O (bank 6) |
| 腳位 BGA-50 | IO[21] — User I/O |
| 腳位 BGA-51 | GND — Ground |
| 腳位 BGA-52 | VCC_CORE — 1.2 V core supply |
| 腳位 BGA-53 | IO[22] — User I/O |
| 腳位 BGA-54 | IO[23] — User I/O |
| 腳位 BGA-55 | VCCIO_7 — I/O bank 7 supply |
| 腳位 BGA-56 | IO[24] — User I/O (bank 7) |
| 腳位 BGA-57 | GND — Ground |
| 腳位 BGA-58 | VCC_CORE — 1.2 V core supply |
| 腳位 BGA-59 | IO[25] — User I/O |
| 腳位 BGA-60 | IO[26] — User I/O |
| 腳位 BGA-61 | VCCIO_8 — I/O bank 8 supply |
| 腳位 BGA-62 | IO[27] — User I/O (bank 8) |
| 腳位 BGA-63 | IO[28] — User I/O |
| 腳位 BGA-64 | GND — Ground |
| 腳位 BGA-65 | IO[29] — User I/O |
| 腳位 BGA-66 | IO[30] — User I/O |
| 腳位 BGA-67 | VCCIO_1 — I/O bank 1 supply |
| 腳位 BGA-68 | IO[31] — User I/O (bank 1) |
| 腳位 BGA-69 | GND — Ground |
| 腳位 BGA-70 | VCC_CORE — 1.2 V core supply |
| 腳位 BGA-71 | IO[32] — User I/O |
| 腳位 BGA-72 | IO[33] — User I/O |
| 腳位 BGA-73 | VCCIO_2 — I/O bank 2 supply |
| 腳位 BGA-74 | IO[34] — User I/O (bank 2) |
| 腳位 BGA-75 | IO[35] — User I/O |
| 腳位 BGA-76 | GND — Ground |
| 腳位 BGA-77 | VCC_CORE — 1.2 V core supply |
| 腳位 BGA-78 | IO[36] — User I/O |
| 腳位 BGA-79 | IO[37] — User I/O |
| 腳位 BGA-80 | VCCIO_3 — I/O bank 3 supply |
| 腳位 BGA-81 | IO[38] — User I/O (bank 3) |
| 腳位 BGA-82 | GND — Ground |
| 腳位 BGA-83 | VCC_CORE — 1.2 V core supply |
| 腳位 BGA-84 | IO[39] — User I/O |
| 腳位 BGA-85 | IO[40] — User I/O |
| 腳位 BGA-86 | VCCIO_4 — I/O bank 4 supply |
| 腳位 BGA-87 | IO[41] — User I/O (bank 4) |
| 腳位 BGA-88 | IO[42] — User I/O |
| 腳位 BGA-89 | GND — Ground |
| 腳位 BGA-90 | IO[43] — User I/O |
| 腳位 BGA-91 | IO[44] — User I/O |
| 腳位 BGA-92 | VCCIO_5 — I/O bank 5 supply |
| 腳位 BGA-93 | IO[45] — User I/O (bank 5) |
| 腳位 BGA-94 | GND — Ground |
| 腳位 BGA-95 | VCC_CORE — 1.2 V core supply |
| 腳位 BGA-96 | IO[46] — User I/O |
| 腳位 BGA-97 | IO[47] — User I/O |
| 腳位 BGA-98 | VCCIO_6 — I/O bank 6 supply |
| 腳位 BGA-99 | IO[48] — User I/O (bank 6) |
| 腳位 BGA-100 | IO[49] — User I/O |
典型應用
EP2S30F484C4N 適用於 6 應用s: ASIC Prototyping, DSP Signal Processing, Communications Line Cards, Video and Image Processing, Test and Measurement Front-Ends, Legacy Industrial Control.
ASIC Prototyping
The EP2S30F484C4N is a common ASIC prototyping vehicle because it pairs 33,880 logic elements with 1,369,728 RAM bits and 342 user I/Os. This density is high enough to absorb mid-complexity ASIC netlists while staying inside the Quartus II design flow familiar to legacy Altera teams. The 484-FBGA package provides the I/O count needed to bring out wide buses for ASIC verification. Engineers typically prototype the design at 1.2 V core, validate timing closure on the C4 speed grade, then map to a lower-cost Cyclone IV/MAX 10 for production once the RTL is frozen.
推薦
DSP Signal Processing
The EP2S30F484C4N integrates dedicated DSP blocks that accelerate fixed- and floating-point arithmetic, making it well-suited for FIR filters, FFTs, and baseband DSP. Combined with 1,369,728 bits of block RAM, the device can hold large coefficient tables and overlap-save buffers on-chip, reducing external memory pressure. The 90 nm core supports internal operation at speeds up to 711.24 MHz, so parallel filter chains can run at line rate on multi-MSPS ADC/DAC front ends. Compared with a software DSP, the FPGA's parallel fabric delivers deterministic latency and much higher throughput per watt.
推薦
Communications Line Cards
Telecom line cards benefit from the EP2S30F484C4N's mix of block RAM and user I/O count. The 342 user I/Os are enough to interface with multiple SFP/uTCA backplanes, while the LVDS-capable I/O banks support high-speed serializers and deserializers for framer/mapper ASICs. Designers often pair the device with an external DDR/DDR2 controller soft-IP, leveraging the 1,369,728 RAM bits as packet buffer space. The 1.2 V core keeps total board power within typical ATCA/AdvancedTCA budgets when combined with power-aware Quartus settings.
推薦
Video and Image Processing
Video pipelines need parallel pixel processing and frame buffering, which the EP2S30F484C4N can deliver with its DSP blocks plus 167 kB of block RAM. Designers typically instantiate multi-tap filters, motion estimators, and color-space converters that exploit the device's parallel fabric for real-time HD-SDI or DVI processing. The 342 user I/Os let the FPGA connect to multiple video ADCs/DACs and serializer-deserializer PHYs without external bus muxing. Embedded multipliers and shift-register-based line buffers keep latency predictable for production-grade broadcast gear.
推薦
Test and Measurement Front-Ends
Test and measurement instruments rely on the EP2S30F484C4N's high-speed parallel DSP and large block memory for waveform generation, FFT-based spectrum analysis, and trigger logic. The 33,880 logic elements are sufficient to host multi-channel acquisition paths, while the 1,369,728 RAM bits provide deep capture buffers. Engineers use the 342 I/Os to interface with high-speed ADCs and to drive display/controllers over LVDS. The C4 speed grade supports deterministic timing closure at rates that match today's 16-bit 100+ MSPS converter families.
推薦
Legacy Industrial Control
Long-life industrial systems still ship the EP2S30F484C4N as a deterministic real-time controller because the part has known-good Quartus II tool support and stable silicon behavior. The 1.2 V core, 90 nm CMOS process, and industrial-grade option (EP2S30F484I4N) let designers meet extended-temperature requirements. The 342 user I/Os are typically split between motor encoder interfaces, GPIO banks, and isolated serial links. Because the device is now obsolete, factories often lock the BOM and qualify second-source through authorized inventory brokers.
推薦
推薦產品摘要
工程參考資料，適用於 EP2S30F484C4N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2S30F484C4 | EP2S30F484C3N | EP2S30F484C3 | EP2S30F484I4N | EP2S15F484C4N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-ball FC-FBGA | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 15,600 |
| Speed Grade | C4 (commercial) | C4 (commercial) | C3 (slower commercial) | C3 (slower commercial) | I4 (industrial) | C4 (commercial) |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Industrial | Commercial |
| Process / Core Voltage | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V |
主要差異化特點
- Highest logic capacity in EP2S30 484-FBGA line (對比EP2S15F484C4N)
- Wider distributor availability than EP2S30F672 variants (對比EP2S30F672I4)
- Identical silicon to EP2S30F484C4 - 'N' suffix only adds lead-free finish (對比EP2S30F484C4)
設計說明
The EP2S30F484C4N dissipates significant power under high toggle rates - typical designs run between 1.5 W and 5 W at 100% utilization. Estimated: at 2.5 W dissipation in the 484-FBGA with theta_JA around 16 C/W (per Stratix II handbook thermal table), the junction-to-ambient temperature rise is about 40 C, so a thermal copper pour or small heatsink is mandatory for closed-enclosure industrial boxes.
Escape routing for the 484-FBGA at 1.0 mm pitch requires at least a 4-layer PCB with microvia stack-ups. Place decoupling caps (0.1 uF + 10 uF) as close as possible to every VCC_CORE and VCCIO ball, and stitch ground vias in a continuous fence around the BGA perimeter to control return-current paths for high-speed LVDS pairs.
Stratix II I/O banks must be powered to a fixed VCCIO before any input toggles; floating banks can latch up or source spur into adjacent powered banks. Use the Stratix II Device Handbook bank rules to assign VREF and VCCIO per I/O standard, and never drive an LVDS pair into a bank powered to 3.3 V LVCMOS without an external series resistor.
Do not confuse EP2S30F484C4N (commercial, lead-free 'N' suffix) with EP2S30F484C4 (commercial, non-N terminal finish) when ordering; the C4N variant is lead-free per JEDEC J-STD-020. Also avoid mixing up C4 and C3 speed grades - C3 is slower and may not close timing in C4-targeted designs.
合規資訊
Lead-free status indicated by 'N' suffix per JEDEC J-STD-020; RoHS/REACH/AEC-Q100 status not present in the verified web data and is marked unknown. AEC-Q100 is not applicable to commercial FPGAs.