EP2S30F484I5N - Stratix II FPGA 33,880 LE FC-FBGA-484 | Intel
MPN： EP2S30F484I5N ✗ 停產EP2S30F484I5N 概覽
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) within the broader integrated circuit taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. FPGAs combine configurable logic blocks (LCLBs / ALMs), programmable routing, embedded memory blocks (M4K/M512), DSP blocks, and high-speed I/O transceivers, allowing designers to implement custom digital signal processing, control, and interconnect functions that are re-programmable in-system. The Stratix II family specifically introduced the ALM (Adaptive Logic Module) architecture that improves logic packing efficiency over the original Stratix ALM-predecessor ALMs and made the family well-suited for ASIC prototyping and high-performance DSP.
Key features of the EP2S30F484I5N include 33,880 logic elements, 13,552 Adaptive Logic Modules (ALMs), up to 1,369,728 bits of embedded memory, dedicated DSP blocks for high-throughput multipliers, multi-gigabit transceiver support on equivalent package variants, and a flexible I/O structure supporting multiple single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The FC-FBGA-484 package exposes 484 balls in a fine-pitch array that supports high I/O count and short signal paths for high-speed designs.
Architecturally, Stratix II FPGAs use a 90 nm, 1.2 V CMOS process with 9-layer routing, dedicated on-chip termination (OCT), and a structured ASIC-like column-based DSP and memory layout. The internal TriMatrix memory subsystem supports three memory block sizes (M512, M4K, M-RAM) optimized for different buffer and lookup table applications. The 33,880-LE device sits in the mid-density tier of the Stratix II family (below EP2S60, EP2S90, EP2S130, EP2S180), making it appropriate for designs that need more capacity than Cyclone II but less than the largest Stratix II.
Typical applications include ASIC prototyping, high-speed digital signal processing, telecom baseband processing, video and image processing pipelines, military and aerospace signal processing, and industrial control systems. The -I5N industrial temperature grade (-40C to +100C ambient, +125C junction) supports designs that must operate in harsh thermal environments such as outdoor telecom, transportation, and defense systems.
When designing with the EP2S30F484I5N, plan the power distribution network carefully: Stratix II devices can exceed 20 W in high-utilization designs, requiring a multi-rail core and I/O supply with extensive decoupling. Use the Altera/Intel Quartus II design software (legacy versions support Stratix II) for synthesis, place-and-route, power analysis, and timing closure. Verify signal integrity on the FC-FBGA-484 footprint using controlled-impedance traces and matched-length routing, especially for DDR memory interfaces.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 EP2S30F484I5N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2S30F484I5N （相同外形與佔位） — 差異在於 Speed Grade, Package, Maximum Internal Frequency, PLLs, Mounting Type.
EP2S30F484I4N
✅ 直接替換聯絡詢價
查看資料表 →EP2S30F484C5N
✅ 直接替換聯絡詢價
查看資料表 →EP2S30F484C4N
✅ 直接替換聯絡詢價
查看資料表 →EP2S30F484C3N
✅ 直接替換聯絡詢價
查看資料表 →EP2S15F484C5N
✅ 直接替換聯絡詢價
查看資料表 →EP2S30F484I5N 最大額定值與電氣特性
| Family | Stratix II |
| Logic Elements | 33,880 |
| Adaptive Logic Modules (ALMs) | 13,552 |
| Maximum Operating Frequency | 609.76 MHz |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| 封裝 | 484-ball FC-FBGA |
| Number of Pins/Balls | 484 |
| Speed Grade | I5 (industrial) |
| Temperature Grade | Industrial (-40C to +100C ambient) |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
| Cell Count | 33,880 cells |
EP2S30F484I5N 484-ball fc-fbga 腳位配置指南
EP2S30F484I5N（484-ball fc-fbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2S30F484I5N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2S30F484I5N 適用於 6 應用s: ASIC Prototyping, Telecom Baseband Processing, High-Speed Digital Signal Processing (DSP), Video and Image Processing, Industrial Control Systems, Military and Aerospace Signal Processing.
ASIC Prototyping
The EP2S30F484I5N's 33,880 logic elements, 1,369 Kbits of embedded memory, and DSP blocks make it a strong ASIC prototyping vehicle. Mid-density designs (e.g., a complete SoC subsystem with processor cores, peripherals, and interconnect fabric) map efficiently to this device with margin for design-for-test and debug instrumentation. The industrial temperature grade ensures validation of prototypes that will deploy in harsh environments. Quartus II provides ASIC prototype flows including partitioning across multiple FPGAs and gate-level netlist ingestion. Compared with simulation, real-time FPGA prototyping reveals timing bugs and integration issues that pure simulation misses.
推薦
Telecom Baseband Processing
Telecommunication baseband processing demands parallel DSP throughput, and the EP2S30F484I5N delivers this through dedicated DSP blocks and 13,552 ALMs. With 33,880 logic elements and high embedded memory bandwidth, the device can implement multiple channels of QAM/QPSK modulation, channel coding (Viterbi, Turbo), and FFT/iFFT pipelines. The FC-FBGA-484 package provides sufficient I/O for parallel LVDS data paths to companion ADCs/DACs. Industrial temperature grade supports outdoor base station and backhaul equipment. Designers typically pair this device with a high-speed ADC such as the AD9230 for receive paths and a DAC such as the AD9779 for transmit paths.
推薦
High-Speed Digital Signal Processing (DSP)
The EP2S30F484I5N's dedicated DSP blocks implement hardened 18x18 multipliers and accumulator chains that accelerate FIR filters, FFTs, and matrix operations. With 33,880 logic elements, the device handles parallel DSP pipelines used in radar, sonar, software-defined radio, and medical imaging systems. The 1.2 V core and 90 nm process provide a favorable performance-per-watt ratio for portable DSP applications. Designers typically use the Altera DSP Builder tool to translate MATLAB/Simulink DSP designs into optimized FPGA implementations. Industrial temperature grade allows deployment in field-deployed radar and remote sensing systems.
推薦
Video and Image Processing
Video processing pipelines for broadcast, surveillance, and machine vision require large amounts of parallel logic and embedded memory - exactly the EP2S30F484I5N's strengths. The 33,880 logic elements and TriMatrix memory (M512/M4K/M-RAM blocks) support real-time HD video processing including scaling, deinterlacing, color space conversion, and motion estimation. The device interfaces to external DDR/DDR2 memory via dedicated PHY blocks for frame buffering. The 484-ball FC-FBGA exposes enough LVDS pairs for parallel camera interfaces (Camera Link) and HDMI/DVI connectivity through external bridge chips.
推薦
Industrial Control Systems
Industrial control applications including PLCs, motor drives, and SCADA systems benefit from the EP2S30F484I5N's industrial temperature range, robust I/O standards, and flexible logic capacity. The 33,880 logic elements handle multi-axis motor control loops (FOC, PWM generation, encoder feedback) and complex communication protocols (EtherCAT, PROFINET, Modbus). The FC-FBGA-484 package supports 12 I/O banks with mix-and-match voltage standards, simplifying interfaces to legacy 5V and modern 3.3V/2.5V peripherals. The 90 nm process and 1.2 V core deliver predictable performance across the industrial temperature range of -40C to +100C.
推薦
Military and Aerospace Signal Processing
The EP2S30F484I5N's industrial temperature grade (-40C to +100C ambient, +125C junction) and rugged FC-FBGA-484 packaging make it suitable for military and aerospace signal processing applications including electronic warfare, radar, and secure communications. With 33,880 logic elements and high DSP throughput, the device implements channelized receivers, matched filters, and cryptographic accelerators. Designers targeting defense programs should verify part qualification status with the manufacturer; some military programs require specific part screening beyond the standard industrial grade. Lead times and obsolescence planning are critical - the NRND status of Stratix II requires proactive migration planning.
推薦
推薦產品摘要
工程參考資料，適用於 EP2S30F484I5N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2S30F484I4N | EP2S30F484C5N | EP2S30F484C4N | EP2S30F484C3N | EP2S15F484C5N |
|---|---|---|---|---|---|---|
| Package | FC-FBGA-484 | FC-FBGA-484 (same) | FC-FBGA-484 (same) | FC-FBGA-484 (same) | FC-FBGA-484 (same) | FC-FBGA-484 (same) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 15,600 |
| Adaptive Logic Modules | 13,552 | 13,552 | 13,552 | 13,552 | 13,552 | 6,240 |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | I5 | I4 (faster) | C5 | C4 (faster) | C3 (fastest) | C5 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
主要差異化特點
- Industrial temperature grade option in same package (對比EP2S30F484C5N)
- Mid-density capacity with industrial temperature grade (對比EP2S15F484C5N)
- Slower speed bin (I5) for cost reduction (對比EP2S30F484I4N)
設計說明
Stratix II FPGAs can exceed 20 W in high-utilization designs. Use the Quartus II PowerPlay Power Analyzer early in the design flow to estimate worst-case power dissipation, then plan a thermal solution (heatsink, thermal vias, or forced airflow) accordingly. The FC-FBGA-484 package's exposed die (flip-chip construction) provides a direct thermal path; the PCB top layer thermal via array under the package should be sized for the target theta-JA. Industrial temperature grade parts are rated for -40C to +100C ambient and +125C junction.
The FC-FBGA-484 package uses a 1.0 mm ball pitch with controlled-impedance signal paths required for high-speed LVDS and DDR interfaces. Use 4 to 6 PCB layers minimum with continuous ground and power planes adjacent to the BGA fanout. Fanout traces should escape between BGA balls using via-in-pad or dog-bone patterns; verify with the Stratix II device handbook's recommended PCB design guidelines. Decoupling capacitors (0.1 uF, 1 uF, and bulk 22-47 uF) must be placed close to each power pin per the Pin Connection Guidelines.
The 'I5' suffix indicates an industrial temperature grade in the slowest speed bin. If timing closure fails, consider moving to an I4 or C4 speed grade (EP2S30F484I4N or EP2S30F484C4N) without changing PCB layout. Additionally, verify that Quartus II (legacy version) is the design software - modern Quartus Prime releases do NOT support Stratix II. For new designs, consider migrating to Cyclone IV or Stratix IV to avoid legacy tool dependency and end-of-life risk.
合規資訊
RoHS compliant per 'N' suffix in MPN and per Altera/Intel product documentation. Industrial temperature grade (-40C to +100C) per 'I' prefix in speed grade. AEC-Q100 not applicable as this is an FPGA rather than an automotive-grade IC.