EP2A25F672I7N - APEX II 900K Gates FPGA | Intel / Altera
MPN： EP2A25F672I7N ✗ 停產EP2A25F672I7N 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks, embedded memory blocks, and programmable routing that the designer programs after manufacture. APEX II sits within Intel/Altera's programmable logic hierarchy as a high-density, multi-vendor-standard logic family: FPGA -> programmable logic -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The architecture combines look-up tables (LUTs), product-term logic, embedded system blocks (ESBs) for memory and FIFO, and high-speed I/O elements that support multiple single-ended and differential I/O standards.
Key features of the EP2A25F672I7N include 24,320 logic elements, embedded memory for distributed and block RAM, dedicated high-speed I/O supporting LVDS and other differential signaling, four phase-locked loops (PLLs) for clock management, and a 672-ball FC-FBGA package that maximizes I/O count while minimizing board area. The device supports in-system programming through the IEEE 1149.1 JTAG interface and configuration via the passive serial, fast passive parallel, and other Altera configuration schemes.
Architecturally, APEX II combines a MultiCore architecture with embedded system blocks for memory and arithmetic, supporting complex system-on-chip designs including on-chip microprocessors, custom DSP datapaths, and high-bandwidth bus interfaces. The 0.15 µm process provides a balance between density and static power consumption, while the 1.5 V core voltage reduces dynamic power dissipation relative to older 2.5 V families.
Typical applications include telecommunications line cards, high-speed serial protocol bridging, ASIC prototyping, image processing pipelines, and industrial automation controllers. The combination of high logic capacity, embedded memory, and high-speed I/O makes the EP2A25F672I7N well suited for designs that previously required multiple smaller FPGAs or a custom ASIC.
When designing with this part, plan power distribution carefully: a 672-ball BGA requires a multi-layer PCB with dedicated power and ground planes, and the 1.5 V core supply typically needs a separate regulator such as a low-dropout (LDO) or DC-DC converter. Use Altera Quartus II design software for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, same-brand APEX II variants, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 EP2A25F672I7N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2A25F672I7N （相同外形與佔位） — 差異在於 Package, Speed Grade, Process Technology, Configuration Method, Operating Temperature.
EP2A25F672I6
✅ 直接替換聯絡詢價
查看資料表 →EP2A25F672I-9
✅ 直接替換聯絡詢價
查看資料表 →EP2A25F672I-7
✅ 直接替換聯絡詢價
查看資料表 →EP2A25F672C9N
✅ 直接替換聯絡詢價
查看資料表 →EP2A25F672ES
✅ 直接替換聯絡詢價
查看資料表 →EP2A25F672I7N 最大額定值與電氣特性
| Family | APEX II |
| Logic Elements (Cells) | 24,320 |
| Typical Gate Count | 900,000 |
| Maximum Internal Frequency | 500 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage | 1.5 V |
| 封裝 | 672-ball FC-FBGA |
| Pin/Ball Count | 672 |
| 安裝類型 | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial (I) |
| Speed Grade | 7 |
| Configuration Interface | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel |
| Design Software | Quartus II |
| 生命週期狀態 | Not Recommended for New Designs (NRND) |
EP2A25F672I7N 672-ball fc-fbga 腳位配置指南
EP2A25F672I7N（672-ball fc-fbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2A25F672I7N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2A25F672I7N 適用於 6 應用s: Telecommunications Line Card Interface, ASIC Prototyping and Emulation, Industrial Automation Controller, Image Processing Pipeline, Software Defined Radio (SDR) Baseband, High-Speed Data Acquisition System.
Telecommunications Line Card Interface
The EP2A25F672I7N's 24,320 logic elements and high-speed LVDS-capable I/O make it well-suited for telecom line cards requiring multi-gigabit serial protocol bridging. Its 500 MHz internal frequency and embedded system blocks enable on-chip FIFO buffering for inter-lane deskew, while the 672-ball FC-FBGA provides the pin density needed to route 16+ high-speed serial lanes. According to Altera application notes, APEX II supports the I/O voltage and impedance standards required by SONET/SDH framer interfaces when paired with an external PHY.
推薦
ASIC Prototyping and Emulation
The 900,000-gate capacity of the EP2A25F672I7N positions it as an ASIC prototyping platform for designs of moderate complexity, such as custom microcontrollers, DSP pipelines, or peripheral subsystems. Engineers can map RTL blocks one-to-one to APEX II logic elements, validate system-level behavior at near-ASIC clock rates, and use JTAG-based debug to inspect internal signals. The industrial temperature grade also supports bring-up in chassis and environmental chambers. Quartus II provides synthesis compatibility with Verilog and VHDL targeting the APEX II architecture.
推薦
Industrial Automation Controller
Industrial motion controllers and PLCs benefit from the EP2A25F672I7N's combination of 24,320 logic elements, embedded memory for axis trajectory buffers, and rugged industrial temperature grade. The device can implement multi-axis PID loops, encoder interfaces (incremental, SSI, EnDat via LVDS), and fieldbus bridges (PROFIBUS, CANopen, EtherCAT slave) on a single chip. The 672-ball FC-FBGA package supports the high pin count needed to fan out to many optically isolated I/O channels, while the 0.15 µm process gives predictable timing closure at industrial operating temperatures.
推薦
Image Processing Pipeline
Real-time image processing pipelines for machine vision, medical imaging, or video broadcast benefit from the EP2A25F672I7N's embedded system blocks, which can be configured as dual-port RAM or FIFO buffers for line/frame storage. The 500 MHz internal frequency supports real-time convolution, color-space conversion, and edge-detection filters at HD video rates. High-speed LVDS I/O enables direct connection to CMOS image sensors and HDMI/DVI transmitters. Quartus II includes reference designs for common vision algorithms, simplifying time-to-market for vision integrators.
推薦
Software Defined Radio (SDR) Baseband
Software-defined radio baseband processors use the EP2A25F672I7N's high logic density to implement digital down/up-conversion, channelization, and modulation/demodulation in reconfigurable logic. The device's embedded multipliers and DSP-friendly routing support efficient implementation of FIR filters and FFT cores, while high-speed differential I/O interfaces cleanly to ADC/DAC converters. The industrial temperature grade is suitable for outdoor base-station and tactical radio enclosures.
推薦
High-Speed Data Acquisition System
High-speed data acquisition cards for test-and-measurement use the EP2A25F672I7N to buffer ADC samples, perform on-FPGA decimation, and stream data over PCIe or proprietary high-speed serial links. The 672-ball FC-FBGA package provides the pin count needed to interface multiple parallel ADCs and a high-bandwidth host interface simultaneously. Embedded memory blocks serve as circular sample buffers, while dedicated PLL blocks generate low-jitter ADC sampling clocks. Industrial temperature grade supports deployment in lab and field environments.
推薦
推薦產品摘要
工程參考資料，適用於 EP2A25F672I7N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2A25F672I6 | EP2A25F672I-9 | EP2A25F672I-7 | EP2A25F672C9N | EP2A25F672ES |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA | 672-ball FC-FBGA | 672-ball FC-FBGA | 672-ball FC-FBGA | 672-ball FC-FBGA |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Speed Grade | 7 | 6 (faster) | 9 (slower) | 7 | 9 | ES |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Commercial | Engineering Sample |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Maximum Internal Frequency | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | Engineering Sample |
主要差異化特點
- Highest density in the APEX II family at 24,320 logic elements (對比EP2A15F672I8)
- Industrial temperature grade for harsh-environment deployment (對比EP2A25F672C9N)
- Speed grade 7 provides balanced performance vs cost (對比EP2A25F672I6)
設計說明
The 672-ball FC-FBGA package requires a multi-layer PCB (typically 8+ layers) with dedicated power and ground planes and microvia-in-pad or via-on-pad technology for breakout. Escape routing beneath the BGA must follow the manufacturer's recommended land pattern with appropriate solder mask-defined (SMD) or non-solder-mask-defined (NSMD) pads. Plan for X-ray inspection post-assembly because BGA solder joints cannot be visually inspected.
The 1.5 V core supply must be generated by a low-impedance regulator (LDO or DC-DC) with bulk decoupling placed within 25 mm of the BGA. According to Altera application notes, APEX II devices require at least 12 bulk decoupling capacitors distributed across the package periphery plus high-frequency 0.1 µF and 0.01 µF capacitors at every power pin group. Use a multi-rail sequencing circuit if the design includes 2.5 V or 3.3 V I/O supplies to avoid latch-up.
Do not attempt to migrate an APEX II design to Quartus Prime releases newer than 13.0, because APEX II device support was removed. Retain Quartus II 13.0 (or Web Edition 13.0) on a dedicated legacy workstation to regenerate configuration bitstreams. Also confirm JTAG chain ordering carefully when the EP2A25F672I7N shares the chain with other devices; mismatched TCK frequencies can cause configuration failures.
The FC-FBGA package exposes a die-side thermal pad that should be soldered to a thermally conductive land on the PCB for heat dissipation. For industrial temperature designs running at full 500 MHz toggle rates, provide thermal vias under the package and consider a heatsink or forced-air cooling to keep the junction below 100 °C. Estimated: at 1.5 V core and full utilization, dynamic power can exceed 3-4 W, depending on toggle rate.
合規資訊
RoHS, REACH, lead-free and halogen-free status must be verified per specific date code and lot documentation. AEC-Q100 is not applicable because this is a commercial/industrial programmable logic device, not an automotive-grade IC.