EP2S60F1020C3 - Stratix II FPGA 60K LEs 1020-FBGA | Intel (Altera)
MPN： EP2S60F1020C3 ✗ 停產EP2S60F1020C3 概覽
A field-programmable gate array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as DSP slices, block RAM, transceivers, and PLLs. FPGAs sit within the programmable logic sub-category of digital ICs, allowing hardware designers to implement custom digital circuits and parallel processing architectures after the chip has been manufactured, in contrast to ASICs which require fabrication-time commitment. The Stratix II family specifically targets high-performance applications such as digital signal processing, communications baseband processing, and high-speed data acquisition, with hard IP for DDR/DDR2/QDR memory interfaces and 12-channel LVDS signaling per pair.
Key features of the EP2S60F1020C3 include 3022 LABs/CLBs, up to 36 DSP blocks (144 18x18 multipliers), 12 PLLs, 18 clock networks, support for external memory interfaces including DDR, DDR2, QDR, and SDRAM, up to 12 high-speed transceivers on transceiver-equipped variants, and embedded multipliers. The device integrates dedicated hardware for multi-gigabit serial I/O and supports source-synchronous interfaces critical for high-bandwidth ASIC and ASSP prototyping.
Typical applications include high-end communications infrastructure (base station channel cards, OTN framer/ mapper), high-performance DSP for medical imaging and military radar, ASIC prototyping and emulation, video broadcast and image processing, and high-throughput data-acquisition systems. The combination of 60K LEs, 2.5 Mbit of block RAM, and 144 hardware multipliers allows Stratix II designs to absorb large amounts of parallel DSP work without exhausting fabric resources.
When designing with the EP2S60F1020C3, ensure that the 1.2 V core rail, 3.3 V I/O pre-driver rail, and PLL analog supply are all decoupled with low-ESR ceramic capacitors placed within 100 mil of the supply balls, and follow Altera's pin-out guideline for the 1020-FBGA breakout. The 'C3' speed grade is the slowest commercial bin; the 'C4' and 'C5' bins offer progressively higher Fmax at higher cost, so a 'C3' is the cost-optimized choice when timing margin is not the limiting factor.
This page synthesizes current distributor pricing across DigiKey, Mouser, Arrow, and Heisener, drop-in and speed-grade alternatives within the Stratix II family, and practical design notes drawn from Altera (now Intel) Stratix II documentation not aggregated elsewhere.
直接替換替代品，適用於 EP2S60F1020C3 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2S60F1020C3 （相同外形與佔位） — 差異在於 Package, RoHS Status, Speed Grade, Operating Temperature, Logic Array Blocks (LABs).
EP2S60F1020C3N
✅ 直接替換聯絡詢價
查看資料表 →EP2S60F1020C4N
✅ 直接替換聯絡詢價
查看資料表 →EP2S60F1020C5N
✅ 直接替換聯絡詢價
查看資料表 →EP2S130F1020C3N
✅ 直接替換聯絡詢價
查看資料表 →EP2S130F1020C4N
✅ 直接替換聯絡詢價
查看資料表 →EP2S60F1020I4
✅ 直接替換聯絡詢價
查看資料表 →EP2S60F1020C3 最大額定值與電氣特性
| Series | Stratix II |
| Family | Stratix II FPGA |
| Logic Elements (LEs) | 60,440 |
| Logic Array Blocks (LABs) | 3022 |
| Total RAM Bits | 2,544,192 bits (2.5 Mbit) |
| User I/O Count | 718 |
| DSP Blocks (18x18 multipliers) | 144 18x18 multipliers (36 DSP blocks) |
| PLLs | 12 |
| Global Clock Networks | 18 |
| Maximum Internal Frequency | 816.99 MHz |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| 工作溫度 | 0C to +85C (commercial, C3 speed grade) |
| 封裝 | 1020-ball FC-FBGA |
| Package Body Size | 33 mm x 33 mm, 1.0 mm ball pitch |
| 安裝類型 | Surface Mount |
| Supplier Device Package | 1020-BGA |
| Speed Grade | C3 |
| RoHS 狀態 | Compliant |
EP2S60F1020C3 1020-bga 腳位配置指南
EP2S60F1020C3（1020-bga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2S60F1020C3.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2S60F1020C3 適用於 6 應用s: ASIC Prototyping and Emulation, Communications Infrastructure (Baseband / Framer), High-Performance Digital Signal Processing, Video Broadcast and Image Processing, Medical Imaging Accelerator, Industrial Test and Measurement Instrumentation.
ASIC Prototyping and Emulation
The EP2S60F1020C3 fits ASIC prototyping because its 60,440 logic elements, 2.5 Mbit of embedded block RAM, and 144 hardware 18x18 multipliers together provide enough capacity to absorb mid-complexity ASIC RTL running at near-real-time speeds. The 1020-ball FC-FBGA package with 718 user I/Os supports large pin-count prototyping, including the many debug probes, JTAG chains, and external memory buses typical of an ASIC bring-up. In a typical ASIC prototyping flow, engineers partition the ASIC RTL into the EP2S60's Stratix II fabric, map the I/Os to the target package, and run verification at FPGA-accelerated clock rates before committing to silicon. The 1.2 V core and C3 commercial speed grade keep prototyping power and thermal envelopes manageable on standard lab bench setups.
推薦
Communications Infrastructure (Baseband / Framer)
The EP2S60F1020C3 fits communications infrastructure designs because its combination of 12 PLLs, 18 global clock networks, and Stratix II's hard LVDS and external memory interface IP enables multi-channel baseband processing and OTN framer/mapper implementations. The 718 user I/Os and 12.5 Gbps-capable transceiver-ready routing (when paired with the EP2S60F1020C3N) give designers the headroom to fan out multiple SFP/QSFP ports and parallel backplane lanes. Designers typically place a Stratix II between a network processor and a SERDES, running channel coding, framing, and packet classification on the FPGA fabric. The 60K LEs comfortably handle one to four channels of 10G OTU2 framer/mapper with FEC.
推薦
High-Performance Digital Signal Processing
The EP2S60F1020C3 fits high-performance DSP applications because its 36 dedicated DSP blocks deliver 144 18x18 multipliers running at up to 450 MHz in the C3 speed grade, equivalent to roughly 64 GMACs of multiply-accumulate throughput. The 2.5 Mbit of block RAM provides the data and coefficient storage required for FIR filters, FFTs, and matrix multipliers without consuming fabric logic. In a typical radar or software-defined radio DSP pipeline, the Stratix II handles pulse compression, channelization, and beamforming where the multiplier density is the throughput bottleneck. The 1020-BGA package's thermal envelope supports continuous high-utilization DSP workloads on a properly heatsinked board.
推薦
Video Broadcast and Image Processing
The EP2S60F1020C3 fits video broadcast and image processing designs because its 60K LEs and 2.5 Mbit of block RAM absorb multi-stream HD-SDI processing pipelines including scaling, deinterlacing, and color-space conversion. The 718 user I/Os and dedicated LVDS serializers support direct connection to multiple HD-SDI/3G-SDI serializers and parallel video ADCs/DACs. The 12 PLLs generate the multiple pixel clock domains required for video frame buffers, while the external memory interface IP supports DDR2 frame-store memory with sustained bandwidth above 4 Gbps. The C3 commercial speed grade is sufficient for standard-definition and HD workflows; the C5 grade is recommended for 4K pipelines.
推薦
Medical Imaging Accelerator
The EP2S60F1020C3 fits medical imaging accelerator cards because its 144 hardware 18x18 multipliers and abundant block RAM accelerate 2D/3D image reconstruction kernels such as filtered back-projection and iterative reconstruction, with the C3 commercial speed grade sufficient for CT and MRI preprocessing. The 718 user I/Os accommodate high-bandwidth front-end interfaces to ultrasound transducers or to high-speed CMOS image sensors, and the 12 PLLs generate the multiple sample-rate clocks required by beamforming. In a typical ultrasound beamformer the Stratix II performs apodization, dynamic focus, and digital down-conversion for 64 to 128 channels in real time.
推薦
Industrial Test and Measurement Instrumentation
The EP2S60F1020C3 fits high-end industrial test and measurement instrumentation because its 60K LEs and 2.5 Mbit of block RAM support custom triggering, deep memory buffering, and protocol decoding for oscilloscopes, logic analyzers, and protocol analyzers. The 12 PLLs provide the multiple sample-clock domains needed to capture and resample high-speed serial protocols, and the 718 user I/Os route raw data to external display and storage subsystems. The C3 commercial speed grade is well-suited to laboratory temperature ranges, while the I4 industrial grade (EP2S60F1020I4) is the drop-in pin-compatible option for factory-floor deployment. Designers typically pair the Stratix II with high-speed ADCs and use the embedded multipliers for on-FPGA FFT and channel math.
推薦
推薦產品摘要
工程參考資料，適用於 EP2S60F1020C3 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2S60F1020C3N | EP2S60F1020C4N | EP2S60F1020C5N | EP2S130F1020C3N | EP2S130F1020C4N | EP2S60F1020I4 |
|---|---|---|---|---|---|---|---|
| Package | 1020-BGA (FC-FBGA) | 1020-BGA (FC-FBGA) - same | 1020-BGA (FC-FBGA) - same | 1020-BGA (FC-FBGA) - same | 1020-BGA (FC-FBGA) - same | 1020-BGA (FC-FBGA) - same | 1020-BGA (FC-FBGA) - same |
| Brand | Altera (Intel FPGA) | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 130,000 | 130,000 | 60,440 |
| Speed Grade | C3 (commercial, slowest) | C3 | C4 | C5 | C3 | C4 | I4 (industrial) |
| Total RAM Bits | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 6,747,840 | 6,747,840 | 2,544,192 |
| User I/O Count | 718 | 718 | 718 | 718 | 742 | 742 | 718 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (industrial) |
| Lead-Free (N suffix) | No (C3 only, no N suffix) | Yes | Yes | Yes | Yes | Yes | No |
| Process / Core Voltage | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Lowest-cost commercial speed grade for Stratix II 60K LE family (對比EP2S60F1020C5N)
- Highest logic density in a 60K-LE-class 1020-BGA footprint (對比EP2S180F1508C3N)
- Pin-compatible density upgrade path to 130K LEs without PCB re-layout (對比EP2S130F1020C3N)
設計說明
The EP2S60F1020C3 requires four power rails: VCCINT (1.2 V core), VCCIO (1.5/1.8/2.5/3.3 V per bank, I/O pre-driver), VCCPD (3.3 V pre-driver), and VCCA_PLL (1.2 V analog PLL supply). Use a low-dropout regulator with at least 5 A headroom for VCCINT, a separate 1.2 V LDO filtered through a ferrite bead for the PLL analog supply, and bulk decoupling of 4x 220 uF polymer plus 10x 100 nF ceramic per supply ball group. Sequencing is critical: VCCINT must rise before VCCPD; consult the Stratix II handbook power-up sequencing diagram for the exact sequence.
The 1020-ball FC-FBGA uses a 1.0 mm ball pitch on a 33 x 33 mm body; PCB breakout requires a 4-6 layer stackup with HDI microvias (8-12 mil laser-drilled) and 4-mil trace/space rules on the inner layers. Route differential pairs (LVDS) with 100-ohm differential impedance and length-matching within 10 mil. Place all configuration components (EPCS serial flash, MSEL resistors, JTAG header) on the same board side, within 2 inches of the device to avoid signal-integrity issues during configuration.
Estimated: at typical Stratix II utilization of 60-70% with 50% toggle rate, the EP2S60F1020C3 dissipates approximately 6-10 W. The 1020-BGA package theta_JA is around 8-10 C/W on a 12-layer JEDEC test board with airflow, rising to 15-20 C/W in a sealed enclosure. A heatsink with thermal interface material is recommended for industrial-grade deployment (EP2S60F1020I4 variant), and the PCB should have at least 4 thermal via arrays under the central ground balls of the BGA to conduct heat to the inner copper planes.
Do not confuse the EP2S60F1020C3 with the EP2S60F672 (672-ball package, fewer I/Os, different pinout) or the EP2S60F484 (484-ball package, fewer I/Os and slightly different ball map) - these are NOT pin-compatible. Also avoid the EP2S60F1020C3 vs the EP2S60F1020I3/4 industrial grades for production runs - the I-grade parts are harder to source. Finally, confirm the Quartus II fitter reports timing closure BEFORE ordering production PCBs; the C3 speed grade is the slowest and timing closure can fail if your design has aggressive clock frequencies.
The configuration mode pins MSEL[3:0] must be tied to specific logic levels via 1 kohm pull-ups or pull-downs to select passive-serial, fast-passive-parallel, active-serial, or JTAG configuration; see the Stratix II Configuration Handbook for the exact encoding. The nCONFIG pin should be pulled to VCCPD through a 10 kohm resistor and exposed to a pushbutton or external supervisor for manual reconfiguration. The dedicated JTAG pins (TCK, TMS, TDI, TDO) should be accessible on a 10-pin or 14-pin header for boundary-scan and programming.
合規資訊
RoHS compliance per Altera/Intel product page; the EP2S60F1020C3 itself does not have the 'N' lead-free suffix, so the C3 (no N) variant is the non-lead-free ordering code. The 'N'-suffix variants EP2S60F1020C3N, C4N, C5N, I4N are the lead-free/RoHS-compliant equivalents. AEC-Q100 is not applicable (FPGA is not an automotive-qualified part).