EP1SGX40DF1020I5 - Stratix GX FPGA 41,250 LEs 1020-BGA | Altera
MPN： EP1SGX40DF1020I5 ✗ 停產EP1SGX40DF1020I5 概覽
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory blocks (M4K/M512), DSP blocks, and programmable routing. Within the broader taxonomy FPGAs sit alongside ASICs and CPLDs as programmable logic devices, and Stratix GX specifically targets designs that require embedded multi-gigabit transceivers (MGTs) for protocols such as PCI Express, Serial RapidIO, XAUI, and 1/2/4 Gbps Fibre Channel. By integrating hard serial-deserializer (SerDes) blocks, Stratix GX removes the need for external PHY chips.
Key features include embedded transceiver channels with data rates up to 3.1875 Gbps, TriMatrix on-chip memory, dedicated DSP blocks for high-throughput arithmetic, and Quartus II / Quartus Prime software support. The 1020-ball FBGA delivers ample user I/O and differential pairs needed for parallel memory buses and high-speed serial links. Industrial-grade temperature operation and the military screening grade make this part attractive to defense, aerospace, and high-reliability industrial customers.
Architecturally, the EP1SGX40DF1020I5 combines a fine-grained logic fabric with embedded MGTs, PLLs, and on-chip memory; this heterogeneous mix allows designers to consolidate what would otherwise require a discrete SerDes, an FPGA, and glue logic onto a single die. The 130 nm process node places this device in the legacy Stratix GX generation, which is widely understood and supported by mature toolchains.
Typical applications include high-speed serial interface bridging, custom telecom backplane aggregation, defense radar signal processing, test & measurement instrumentation with embedded SERDES, and industrial control backplanes. The wide I/O count and on-chip transceivers make it a strong fit for protocol bridging and aggregation designs.
When designing with this part, verify that the 1020-ball FBGA land pattern, power-rail decoupling scheme, and MGT reference-clock architecture match your board; Quartus II toolchain support is required. The 'I5' speed-grade and 'I' temperature-grade suffix indicate industrial temperature and a specific speed bin.
This page synthesizes distributor pricing, drop-in alternatives from the same Stratix GX family, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single reference for sourcing and selection.
直接替換替代品，適用於 EP1SGX40DF1020I5 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX40DF1020I5 （相同外形與佔位） — 差異在於 Operating Temperature, Package, Speed Grade, Process Technology, Series.
EP1SGX40DF1020I5ES
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP1SGX40CF1020I5
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1SGX40DF1020C7N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1SGX40DF1020C6N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1SGX40DF1020C5N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1S80F1020C7
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1SGX40DF1020I5 最大額定值與電氣特性
| Family | Stratix GX |
| Device Series | EP1SGX40 |
| Logic Elements | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Process Technology | 130 nm CMOS |
| Core Voltage (Nominal) | 1.5 V |
| Supply Voltage Range | 1.425 V to 1.575 V |
| Operating Temperature Grade | Industrial / Military (-40C to +100C) |
| Speed Grade | I5 |
| 封裝 | 1020-ball FC-FBGA |
| Terminal Pitch | 1.00 mm |
| 安裝類型 | Surface Mount |
| Toolchain Support | Quartus II / Quartus Prime |
| Lead-Free | yes (per Altera ordering info) |
EP1SGX40DF1020I5 腳位配置
| 腳位 A1 | VCC — Core supply voltage (1.5 V nominal) |
| 腳位 A2 | GND — Common ground reference |
| 腳位 A3 | IO_BANK_1 — User I/O - Bank 1 |
| 腳位 B1 | VCCA_PLL — PLL analog supply |
| 腳位 B2 | GND — Common ground reference |
| 腳位 B3 | IO_BANK_2 — User I/O - Bank 2 |
| 腳位 C1 | VCC_PGM — Configuration supply |
| 腳位 C2 | MSEL — Mode select for configuration scheme |
| 腳位 C3 | nCONFIG — Configuration control (active low) |
| 腳位 D1 | DATA0 — Configuration data input |
| 腳位 D2 | nCE — Chip enable (active low) |
| 腳位 D3 | DCLK — Configuration clock input |
| 腳位 E1 | REFCLK_P — Transceiver reference clock positive |
| 腳位 E2 | REFCLK_N — Transceiver reference clock negative |
| 腳位 E3 | RX_P — Transceiver receive positive |
| 腳位 F1 | RX_N — Transceiver receive negative |
| 腳位 F2 | TX_P — Transceiver transmit positive |
| 腳位 F3 | TX_N — Transceiver transmit negative |
| 腳位 G1 | JTAG_TCK — JTAG test clock |
| 腳位 G2 | JTAG_TMS — JTAG test mode select |
典型應用
EP1SGX40DF1020I5 適用於 6 應用s: Multi-Gigabit Serial Interface Bridging, Defense Radar Signal Processing, Telecom Backplane Aggregation, Test and Measurement Instrumentation, Industrial Control Backplanes, Aerospace Flight-Control Interfaces.
Multi-Gigabit Serial Interface Bridging
The EP1SGX40DF1020I5 fits multi-gigabit serial interface bridging because it integrates hard SERDES channels alongside 41,250 logic elements, allowing designers to consolidate PHY and protocol logic on a single die. With its 130 nm Stratix GX architecture the part supports protocols such as PCI Express, Serial RapidIO, XAUI, and 1/2/4 Gbps Fibre Channel, eliminating external PHY chips and reducing board complexity. The 1020-ball FC-FBGA exposes enough differential pairs to fan out multiple transceiver channels to backplane connectors while leaving ample user I/O for control-plane logic. Placed between a host ASIC and a backplane, the device translates between an internal parallel bus and the multi-gigabit serial link, with on-chip PLLs generating the required reference clocks. Compared with discrete SERDES + glue logic, the integrated approach reduces BOM cost, PCB area, and signal-integrity risk, while the 41k LE capacity absorbs protocol-state-machine and link-layer logic.
推薦
Defense Radar Signal Processing
The EP1SGX40DF1020I5 is well suited for defense radar signal processing because it combines industrial/military temperature grade operation (-40C to +100C) with the parallel DSP throughput of 41,250 logic elements and dedicated DSP blocks. Radar front-ends digitize IF signals and push them into FPGAs for pulse compression, MTI filtering, and CFAR detection; the Stratix GX fabric's TriMatrix memory provides the high-bandwidth buffering needed for matched-filter taps, while dedicated DSP blocks accelerate FIR/FFT operations. The 1020-ball FC-FBGA supports wide data buses from multi-channel ADCs, and the device's high-speed transceivers stream processed data to downstream recorders or display subsystems. Its military temperature screening and long-life-cycle support from Altera/Intel PSG make it attractive for radar programs that span decades. Estimated: at 200 MHz DSP-block throughput the part can sustain tens of GMACs for real-time pulse processing.
推薦
Telecom Backplane Aggregation
The EP1SGX40DF1020I5 fits telecom backplane aggregation by aggregating multiple lower-rate serial links into a single high-rate uplink, leveraging the on-chip multi-gigabit transceivers and ample logic for protocol mapping. Common Aggregation architectures fan-in 8-16 SFP+ 1G/2.5G links into a 10G XAUI or 4G FC uplink; the Stratix GX architecture provides the SERDES channels and the 41k LE fabric for MAC, framing, and link-management logic. The 1020-ball FC-FBGA delivers the differential-pair density required for multi-channel aggregation, while industrial temperature grade supports outdoor cabinet deployments. Placed on a line card with multiple SFP cages, the FPGA consolidates what would otherwise require a network processor plus a separate SERDES chip. The 1.5 V core and on-chip PLLs simplify power architecture compared with multi-rail legacy designs.
推薦
Test and Measurement Instrumentation
The EP1SGX40DF1020I5 is appropriate for test-and-measurement instrumentation because its 41,250 logic elements provide flexible DSP-style processing, and the embedded multi-gigabit transceivers stream digitized waveforms to capture memory or downstream analysis engines. Applications include arbitrary waveform generators, protocol analyzers, and high-speed digitizers where the FPGA performs real-time triggering, decimation, and FFT pre-processing before transferring data over PCIe or 10G Ethernet. The 1020-ball FC-FBGA accommodates wide parallel LVDS buses from interleaved ADC arrays, while the 1.5 V core supports low-noise analog integration. Industrial temperature grade is a strong fit for lab and field instrumentation that operates in uncontrolled environments. Compared with fixed-function ASICs, the FPGA's reconfigurability lets manufacturers ship one hardware platform and update measurement algorithms in firmware.
推薦
Industrial Control Backplanes
The EP1SGX40DF1020I5 supports industrial control backplane aggregation by providing protocol bridging between legacy fieldbuses (Profibus, CAN, RS-485) and modern Ethernet/IP or EtherCAT, leveraging on-chip transceivers for high-speed uplinks and ample logic for protocol-stack implementation. The industrial/military temperature range (-40C to +100C) handles factory-floor enclosures, while the 1020-ball FC-FBGA supports a mix of high-speed serial and parallel I/O. The 41k LE fabric absorbs the protocol stacks, real-time control loops, and safety logic required for SIL-rated industrial controllers. Compared with microcontroller-based solutions, the FPGA delivers deterministic latency and parallel I/O bandwidth for high-axis-count motion-control systems.
推薦
Aerospace Flight-Control Interfaces
The EP1SGX40DF1020I5 suits aerospace flight-control interface aggregation because the -40C to +100C industrial/military temperature grade and high pin count support the redundant, isolated I/O needed for flight-critical systems. The Stratix GX architecture provides CRC, ARINC 429, MIL-STD-1553, and Ethernet channelization in a single device, with on-chip SERDES for high-rate sensor aggregation (LiDAR, radar, IMU buses). The 1020-ball FC-FBGA delivers enough differential pairs for redundant channel groups and ECC memory interfaces. Long-life-cycle support from Altera/Intel PSG and mature Quartus II toolchain are major advantages for DO-254 certification programs that span decades. Compared with discrete interface ASICs, the FPGA's reconfigurability simplifies late-stage spec changes during flight-certification testing.
推薦
推薦產品摘要
工程參考資料，適用於 EP1SGX40DF1020I5 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1SGX40DF1020I5ES | EP1SGX40CF1020I5 | EP1SGX40DF1020C7N | EP1SGX40DF1020C6N | EP1S80F1020C7 |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 79,040 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | Industrial/Military (-40C to +100C) | Industrial/Military | Industrial/Military | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I5 | I5ES | I5 | C7 | C6 | C7 |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
主要差異化特點
- Industrial/Military temperature grade for high-reliability deployments (對比EP1SGX40DF1020C7N)
- I5 speed grade at industrial temperature (對比EP1SGX40DF1020C6N)
- Stratix GX architecture with integrated multi-gigabit transceivers (對比EP1S80F1020C7)
設計說明
Estimated: at full utilization of the 41,250 logic fabric with multi-gigibt transceivers active, the EP1SGX40DF1020I5 core and transceiver rails can draw 5-15 W. Design the 1.5 V core rail with at least 20% margin (so 12-18 W capability), place 10uF ceramic + 100uF bulk decoupling within 1 inch of the BGA balls, and use a dedicated switching regulator with sub-50 mVpp ripple for the analog PLL supplies (VCCA_PLL) to minimize jitter on the SERDES channels.
The 1020-ball FC-FBGA exposes a moderate-size thermal pad via inner-row balls; populate the central balls as thermal vias to a full inner-plane copper pour. Estimated: without a heatsink or 6+ layer PCB with continuous ground plane, the device can sustain roughly 2-3 W at industrial ambient before junction-temperature derating is required. For military-grade deployments that fill the transceiver utilization, a 1 square-inch copper pour with thermal vias is the minimum recommended thermal management.
The 1.00 mm pitch 1020-ball FC-FBGA requires high-density PCB fabrication: 0.10 mm via-in-pad with filled-and-capped vias, 4/4 mil trace/space stackup, and high-Tg FR-4 or low-loss PCB material for SERDES channel lengths. Matched-impedance 100-ohm differential routing for transceiver pairs is mandatory; reference the Altera Stratix GX Board Design Guidelines for via-pattern, length-matching, and AC-coupling capacitor placement near the BGA balls.
Do not assume any Stratix GX 1020-ball variant is fully interchangeable - the 'I' (industrial/military) vs 'C' (commercial) temperature grade is functionally identical for silicon but causes thermal-derating divergence; also the ES (engineering-sample) suffix may not meet full production screening. Verify transceiver count, on-chip memory, and DSP blocks against the target datasheet before substitution, and ensure Quartus II / Quartus Prime toolchain supports the specific speed-grade suffix.
合規資訊
FPGAs in 1020-ball FC-FBGA from Altera are typically lead-free with Pb-free terminations per JEDEC J-STD-020; explicit RoHS/REACH documentation not included in the verified web data - request from Altera/Intel PSG for mission-critical certifications.