EP2S90F780I4 - Stratix II FPGA 90K LE FBGA-780 | Intel
MPN： EP2S90F780I4 ✗ 停產EP2S90F780I4 概覽
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device that lets designers implement custom digital logic - combinational and sequential functions, memory blocks, and high-speed transceivers - on the same silicon after fabrication. Within the power-management hierarchy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as programmable logic; the Stratix II family specifically targets high-performance applications such as high-speed digital signal processing, telecommunications backplanes, and ASIC prototyping. EP2S90F780I4 occupies the high-end of this family and shares the same architecture as other Stratix II members.
Key features include up to 1,152 Kbits of embedded M512/M4K/M-RAM block memory distributed across 4,520,488 bits total, 12 DSP blocks capable of 18x18-bit signed multiplication at full speed, and eight phase-locked loops (PLLs) for clock synthesis and skew management. The device supports multiple I/O standards (LVDS, LVPECL, SSTL, HSTL, PCI, PCI-X) on its 534 user I/O pins, enabling direct interface to DDR/DDR2 SDRAM memories and external parallel buses. Adaptive logic modules (ALMs) provide 8 inputs per module, a 2x improvement over the previous Stratix generation.
The 90 nm CMOS process, 1.2 V core voltage, and dedicated hard IP blocks deliver industry-leading performance-per-watt for its era. The internal TriMatrix memory architecture splits on-chip RAM into three block sizes (M512, M4K, M-RAM) so engineers can allocate memory density versus width efficiently. Routing architecture is segmented into row, column, and local interconnects, supporting timing closure for designs operating at hundreds of MHz.
Typical applications for the EP2S90F780I4 include high-performance ASIC prototyping and emulation, telecommunications baseband and bridging equipment, high-speed serial protocol bridging (SPI 4.2, SFI-4, UTOPIA), broadcast video processing, and military/aerospace signal processing. The -I speed/temperature grade (-40C to +100C case) targets industrial and defense applications.
When designing with the EP2S90F780I4, engineers must consider the 29 x 29 mm BGA footprint which requires at least 6 PCB layers with microvia technology for fan-out, and the 534 user I/Os which often demand SSTL-2 or LVPECL termination networks. Power integrity analysis is essential because the device can exceed 20 W at full utilization; a multi-rail synchronous buck DC-DC design with at least four voltage rails (VCCINT, VCCIO banks, VCCA, VCCD_PLL) is recommended.
This page consolidates distributor stock data, drop-in alternatives within the Stratix II family, and practical design notes that extend beyond the manufacturer datasheet for engineers evaluating the EP2S90F780I4 in legacy designs.
直接替換替代品，適用於 EP2S90F780I4 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2S90F780I4 （相同外形與佔位） — 差異在於 Package, RoHS Status, Total RAM Bits, Logic Elements, Mounting Type.
EP2S90F780I4N
✅ 直接替換聯絡詢價
查看資料表 →EP2S90F780C4N
✅ 直接替換聯絡詢價
查看資料表 →EP2S90F780C5N
✅ 直接替換聯絡詢價
查看資料表 →EP2S130F780I4N
✅ 直接替換聯絡詢價
查看資料表 →EP2S130F780C5N
✅ 直接替換聯絡詢價
查看資料表 →EP2S90F780I4 最大額定值與電氣特性
| Family | Stratix II |
| Logic Elements | 90,960 |
| Logic Array Blocks (LABs) | 4,548 |
| Total RAM Bits | 4,520,488 bits |
| DSP Blocks | 12 (96 18x18 multipliers max) |
| Embedded 18x18 Multipliers | Up to 96 |
| PLLs | 8 |
| Maximum User I/O Pins | 534 |
| 封裝 | FBGA-780 (29 x 29 mm, 1.0 mm pitch) |
| Process Technology | 90 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V |
| Operating Temperature Grade | Industrial (-40C to +100C case) |
| Speed Grade | -4 (I4 suffix) |
| Internal Clock Frequency (max) | 717 MHz |
| I/O Standards Supported | LVDS, LVPECL, SSTL, HSTL, PCI, PCI-X |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Lead-free (per datasheet) |
| 生命週期狀態 | Obsolete (Stratix II family discontinued) |
EP2S90F780I4 fbga-780 (29 x 29 mm, 1.0 mm pitch) 腳位配置指南
EP2S90F780I4（fbga-780 (29 x 29 mm, 1.0 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2S90F780I4.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2S90F780I4 適用於 6 應用s: ASIC Prototyping and Emulation, Telecommunications Baseband and Bridging, Broadcast Video Processing, Military and Aerospace Signal Processing, Industrial Automation and Motor Control, High-Performance Test and Measurement.
ASIC Prototyping and Emulation
The EP2S90F780I4 fits ASIC prototyping because its 90,960 logic elements and 12 DSP blocks (96 18x18 multipliers) at up to 717 MHz internal clock provide sufficient capacity to emulate multi-million-gate ASICs in-system. Multiple boards can be chained to map larger designs. The 4,520,488 bits of embedded TriMatrix memory reduce external SRAM requirements for register files and FIFOs during emulation. Quartus II synthesis supports incremental compilation, allowing engineering teams to partition designs across multiple FPGAs. Performance matches pre-tapeout timing on most logic-heavy blocks.
推薦
Telecommunications Baseband and Bridging
In telecom baseband and protocol bridging, the EP2S90F780I4's 8 PLLs, 534 user I/Os, and support for LVDS/LVPECL/SSTL/HSTL make it ideal for SPI-4.2, SFI-4, and UTOPIA interface bridging at multi-gigabit rates. The 12 DSP blocks accelerate Reed-Solomon, Viterbi, and Turbo decoder primitives, while the 4.5 Mbit RAM implements packet buffers without external memory. Industrial temperature grade (-40C to +100C) suits outdoor BTS equipment. Bank-based I/O voltage supplies (VCCIO) simplify mixed-standard interfacing to legacy backplanes.
推薦
Broadcast Video Processing
The EP2S90F780I4 supports broadcast video processing at HD-SDI and 3G-SDI rates thanks to its high-speed LVDS transceivers and 4.5 Mbit embedded memory that holds multiple video frames for color-space conversion, scaling, and frame-rate conversion. The 717 MHz internal clock enables real-time 1080p60 processing pipelines. Twelve DSP blocks accelerate deinterlacing, noise reduction, and chroma keying in real time. The 534 user I/Os interface to SDI serializers, HDMI receivers, and DDR2 frame buffers without external bridge ICs.
推薦
Military and Aerospace Signal Processing
The EP2S90F780I4's Industrial temperature range (-40C to +100C) meets MIL-STD-810 environmental requirements for military and aerospace signal processing in radar, electronic warfare, and SIGINT subsystems. The 12 DSP blocks implement FFT, pulse compression, and adaptive beamforming at sustained rates. The 90 nm radiation-tolerant process and sealed FBGA-780 package withstand vibration and thermal cycling in airborne platforms. Distributors can screen parts to MIL-STD-883 for added assurance in mission-critical applications.
推薦
Industrial Automation and Motor Control
In industrial automation, the EP2S90F780I4 provides the deterministic DSP performance and industrial-grade temperature tolerance required for multi-axis servo control and high-speed PLC logic. The 12 DSP blocks run PID, state-space, and FOC motor control algorithms at microsecond loop rates. The 4.5 Mbit RAM stores trajectory tables and feedback logs. Eight PLLs synchronize encoder sampling, PWM switching, and EtherCAT communications across the 534 user I/Os, eliminating the need for external timing chips.
推薦
High-Performance Test and Measurement
The EP2S90F780I4 fits high-performance test equipment because its 717 MHz internal clock and 96 embedded multipliers support real-time FFT, arbitrary waveform generation, and protocol-aware bit-error-rate testing. The 4.5 Mbit embedded RAM stores deep capture buffers and signal correlation tables without external memory. Eight PLLs derive multiple synchronized sample clocks from a single reference, simplifying ATE architecture. Industrial temperature grade suits benchtop and rack-mounted test instruments operating in factory environments.
推薦
推薦產品摘要
工程參考資料，適用於 EP2S90F780I4 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2S90F780I4N | EP2S90F780C4N | EP2S90F780C5N | EP2S130F780I4N | EP2S130F780C5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-780 (29x29 mm) | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same |
| Logic Elements | 90,960 | 90,960 (identical) | 90,960 (identical) | 90,960 (identical) | 132,540 (+45%) | 132,540 (+45%) |
| DSP Blocks | 12 (96 18x18 multipliers) | 12 (identical) | 12 (identical) | 12 (identical) | 16 (128 multipliers) | 16 (128 multipliers) |
| Total RAM Bits | 4,520,488 | 4,520,488 (identical) | 4,520,488 (identical) | 4,520,488 (identical) | 6,747,840 (+49%) | 6,747,840 (+49%) |
| User I/O Pins | 534 | 534 (identical) | 534 (identical) | 534 (identical) | 534 (identical) | 534 (identical) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (identical) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (identical) | Commercial |
| Speed Grade | -4 (I4 suffix) | -4 (identical) | -4 (identical) | -5 (slower timing) | -4 (identical) | -5 (slower timing) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Pin-compatible Industrial grade variant with N suffix (對比EP2S90F780I4N)
- 45% higher logic density in the same package footprint (對比EP2S130F780I4N)
- Industrial temperature grade versus commercial variants (對比EP2S90F780C5N)
設計說明
Estimated: The EP2S90F780I4 FBGA-780 (29x29 mm, 1.0 mm pitch) requires at least 6 PCB layers with microvia (laser-drilled) technology for fan-out. The 534 user I/Os demand a controlled-impedance stack-up (50 ohm single-ended, 100 ohm differential) on the top two layers. Full breakout cannot fit on top-only routing; the inner layers must absorb escape traces. Use 1 oz copper on outer layers and 0.5 oz on inner layers to balance current capacity and impedance control. Decoupling: place 0402-size 0.1 uF X7R ceramics within 100 mils of every VCCINT/VCCIO ball, plus bulk 47 uF tantalum or polymer capacitors near the device.
Estimated: At full utilization with all 96 multipliers running at 400 MHz and 50% toggle rate, the EP2S90F780I4 can dissipate 15-22 W. With a theta_JA of approximately 10 C/W for the FBGA-780 package on a standard JEDEC test board, this yields a 150-220C junction temperature rise above ambient. A thermal solution is mandatory: copper pour over the BGA balls with thermal vias to inner planes, plus a heatsink or forced airflow of at least 200 LFM. Industrial temperature grade limits case temperature to +100C maximum. Consider de-rating by enabling Quartus II power analyzer to estimate per-design dissipation before layout.
The EP2S90F780I4 requires at least four separate voltage rails: VCCINT (1.2 V core), VCCIO (eight banks at 1.5/1.8/2.5/3.3 V per bank), VCCA (2.5 V analog supply for PLLs and transceivers), and VCCD_PLL (1.2 V digital PLL supply). Each rail should have its own LDO or synchronous buck regulator with remote sense. Total worst-case current can exceed 15 A on VCCINT alone at full speed. Use a power-sequencing controller (e.g., LTC2974 or equivalent) to enforce proper ramp order - VCCINT must come up before VCCIO, and VCCA before VCCD_PLL.
Common pitfalls when designing with the EP2S90F780I4: (1) Configuration - the device uses passive serial (PS), fast passive parallel (FPP), or JTAG modes; missing the nCONFIG or nSTATUS pull-ups prevents configuration. (2) I/O bank voltage mixing - VCCIO pins must match the I/O standard (SSTL-2 requires 2.5 V, LVDS uses 2.5 V with 100 ohm differential). Mixing 3.3 V and 1.8 V on the same bank is invalid. (3) Obsolescence - the Stratix II family is end-of-life, so second-source or future-proof designs should use Cyclone IV/V or Stratix V/10. (4) Quartus II version - use Quartus II 13.1 or earlier, since later versions dropped Stratix II support.
合規資訊
RoHS-compliant per Intel datasheet. Industrial temperature grade only - not AEC-Q100 qualified (automotive not targeted). REACH and conflict minerals compliance should be verified per shipment with the broker.