EP3C10M164C7N - 10,320-LC Cyclone III FPGA | Intel
MPN： EP3C10M164C7N ✓ 啟用中EP3C10M164C7N 概覽
A field-programmable gate array, or FPGA, is a reconfigurable semiconductor whose logic blocks and programmable interconnect can be configured after manufacture. FPGAs sit between fixed-function logic devices and software-programmable processors in the broader digital-semiconductor hierarchy. Unlike an application-specific integrated circuit, an FPGA can implement multiple interface protocols, control functions, and data-processing pipelines in one device while retaining the ability to update its configuration during product maintenance.
The EP3C10M164C7N provides 10,320 logic elements and 106 I/O pins, making it suitable for designs requiring substantial parallel logic without the resource level of a large FPGA. Its 437.5 MHz maximum switching frequency supports clocked control, communication, and signal-processing functions. The 423,936 embedded-memory bits add on-chip storage for buffers, lookup tables, state machines, and temporary data paths, reducing dependence on external memory for modest workloads.
The 164-TFBGA package supports a dense, board-level FPGA implementation with 164 package balls. Because ball-grid packages expose connections on multiple sides and may include thermal and power-distribution balls, designers should follow the manufacturer's package and device-pin documentation when assigning power, ground, configuration, clock, and user I/O connections. Exact ball names and configuration requirements should be taken directly from the manufacturer pin-assignment tables.
Typical applications include industrial control modules, communications interface adapters, instrumentation control, embedded test equipment, and industrial networking. The 106 available I/O positions are particularly relevant to parallel buses, digital control interfaces, and multi-channel acquisition systems. Designers should also account for configuration flash or another supported configuration source and verify board-level voltage compatibility before committing the FPGA to a design.
A key design consideration is resource balancing. The device combines 10,320 logic elements with 423,936 embedded-memory bits, so a design that consumes most available memory may still lack logic capacity, while a logic-heavy design may require external memory. Timing closure should be evaluated with the intended clock, I/O standards, and device speed grade rather than from the maximum frequency alone.
This product page combines the exact orderable MPN, device characteristics, package information, sourcing guidance, and cross-reference review into an engineering-oriented resource. It also highlights where replacement decisions require direct comparison of package balls, speed-grade suffix, configuration behavior, and design resource usage.
直接替換替代品，適用於 EP3C10M164C7N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3C10M164C7N （相同外形與佔位） — 差異在於 Embedded Memory, Package, Process Technology.
EP3C10M164C8N
✅ 直接替換📋 參考替代品（不在目錄中）
EP3C10M164C7N 最大額定值與電氣特性
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) |
| Logic Elements | 10,320 cells |
| Embedded Memory | 423,936 bits |
| User I/O | 106 pins |
| Maximum Switching Frequency | 437.5 MHz |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.2 V |
| 封裝 | 164-TFBGA |
| Device Family | Cyclone III |
EP3C10M164C7N 164-tfbga 腳位配置指南
EP3C10M164C7N（164-tfbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3C10M164C7N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3C10M164C7N 適用於 6 應用s: Industrial Control Logic, Communications Interface Adapter, Data Acquisition Front End, Programmable Test and Measurement, Network Edge and Protocol Gateway, Custom Embedded Interface Controller.
Industrial Control Logic
The EP3C10M164C7N fits industrial control modules that require parallel digital inputs, sequencing logic, and moderate local data handling. Its 106 I/O positions can support control signals and field-bus interfaces, while 10,320 logic elements provide capacity for state machines, interlocks, timing logic, and supervisory functions. The 437.5 MHz maximum switching frequency supports clocked processing where required. Designers should allocate I/O standards, verify clock-domain requirements, and preserve timing margin when compiling control paths. Because manufacturing lifecycle and environmental requirements matter in industrial equipment, confirm the exact temperature grade, supply configuration, and long-term availability before a production release.
Communications Interface Adapter
The EP3C10M164C7N is suitable for compact communications adapters that translate between a host processor and one or more peripheral interfaces. Its 106 user I/O positions allow several parallel buses or serial transceiver interfaces to share one programmable fabric, and 423,936 embedded-memory bits can support packet buffering, command queues, and interface state tracking. The 10,320 logic elements provide parallel lanes, framing logic, CRC processing, and protocol state machines. For robust performance, use the device timing report to constrain clocks and external interfaces, and verify the electrical characteristics of every connected transceiver rather than assuming compatibility from the FPGA family name.
Data Acquisition Front End
The EP3C10M164C7N can implement digital control and parallel data movement around external converters in a data-acquisition front end. With 106 I/O positions, the device can support multiple converter data buses, capture control, channel enables, and interface timing, while 10,320 logic elements can implement filtering, decimation, or formatting pipelines. Its maximum switching frequency of 437.5 MHz provides a useful ceiling for parallel datapaths, although practical acquisition rates remain limited by external converter timing, input standards, and system clocking. Use registered I/O paths, synchronize asynchronous inputs where required, and complete timing analysis for the complete converter-to-processing chain.
Programmable Test and Measurement
The EP3C10M164C7N fits compact test and measurement products requiring configurable stimulus generation, status sequencing, and parallel instrument interfaces. Its 10,320 logic elements can implement counters, timing patterns, result processing, and control sequences, while 423,936 embedded-memory bits can hold test vectors or short capture buffers. The 106 I/O positions allow connection to multiple measurement peripherals and backplane signals. For instrumentation, isolate clock domains carefully, account for input threshold and slew requirements, and avoid routing sensitive analog functions directly through the FPGA. Configuration persistence and field update requirements should also be addressed so an instrument can retain or reload its bitstream as intended.
Network Edge and Protocol Gateway
The EP3C10M164C7N can support edge devices that terminate one network-oriented interface and translate it into a local parallel or serial interface. The 106 I/O positions and 10,320 logic elements permit header parsing, flow control, framing, checksums, and local arbitration, while the 423,936 embedded-memory bits provide buffer space for short traffic bursts. Its 437.5 MHz maximum switching frequency supports moderate parallel processing rates. A gateway design should establish clock domains for each external interface, use appropriate I/O standards, and include reset and configuration behavior in system verification. Resource utilization and timing margins should be reviewed with realistic traffic rather than peak benchmark activity.
Custom Embedded Interface Controller
The EP3C10M164C7N is suitable for a dedicated interface controller that replaces several fixed-function glue devices with one configurable FPGA. Its 10,320 logic elements can implement multiple command decoders, FIFOs, protocol converters, and status monitors, while 423,936 embedded-memory bits support buffering between domains with different transfer rates. The 106 I/O positions allow several external peripherals to remain connected without a large external bridge. To maximize reliability, constrain each interface independently, register slow external signals, synchronize asynchronous controls, and verify reset behavior across every supported operating mode. A prototype should also confirm that configuration storage and power sequencing fit the complete board design.
工程參考資料，適用於 EP3C10M164C7N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3C10M164C8N |
|---|---|---|
| Brand | Intel | Altera |
| Package | 164-TFBGA | 164-TFBGA |
| Device Family | Cyclone III | Cyclone III |
主要差異化特點
- Established low-density Cyclone III resource balance (對比EP3C10M164C8N)
- 106 user I/O positions in a 164-TFBGA package (對比EP3C10M164C8N)
- 437.5 MHz maximum switching frequency (對比EP3C10M164C8N)
設計說明
Treat the 164-TFBGA layout as a complete power-and-ground assignment rather than a 164-user-I/O package. Place the manufacturer-specified bypass capacitors adjacent to their relevant supply balls, use short ground returns, and preserve continuous return paths beneath the device. Follow the manufacturer package documentation for ball pitches, solder-mask design, via-in-pad use, and reflow profiles. Validate escape routing for clocks, configuration signals, and high-speed interfaces using the actual board stack-up.
Budget the 1.2 V core rail for dynamic consumption determined by the design's logic activity, I/O loading, and clocking. Estimated: core dissipation equals 1.2 V multiplied by the measured core current; total board dissipation also includes external I/O and configuration circuitry. Use a supply with suitable transient response and sequence the rails according to the manufacturer guidelines. Do not derive thermal margin from maximum switching frequency alone, since a lightly used clocked design and a fully utilized design can have substantially different activity factors.
Constrain every clock and high-speed interface path in the FPGA timing tool, and use the device-specific timing reports rather than the 437.5 MHz headline frequency as a guaranteed system rate. Synchronize asynchronous control inputs, register boundary crossings, and constrain external interface timing against the actual peripheral devices. Pay particular attention to output-drive strength, input threshold, slew rate, and I/O-standard compatibility, because a pin may be present on the package without supporting the electrical standard assumed by the design.
Do not substitute EP3C10M164C8N for EP3C10M164C7N solely because the base family, 164-TFBGA package, and I/O count appear similar. Confirm the meaning of the speed-grade suffix, electrical limits, temperature rating, configuration behavior, and every affected ball assignment in the manufacturer documentation. Also avoid designing to the complete package-ball count as if all balls were user I/O; power, ground, clock, configuration, and dedicated balls reduce the 106 user-I/O figure.
合規資訊
The manufacturer documentation cited for this product does not explicitly establish RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. The part is not presented as an AEC-Q100-qualified automotive device.
