EP3C40U484C8N - Cyclone III FPGA 40K LE, 484-FBGA | Intel / Altera
MPN： EP3C40U484C8N ✓ 啟用中EP3C40U484C8N 概覽
What is a Cyclone III FPGA? Cyclone III is a 65 nm SRAM-based low-power FPGA family from Intel/Altera targeting cost-sensitive, high-volume applications. In the broader taxonomy it sits below: FPGA -> programmable logic device (PLD) -> digital IC -> integrated circuit -> semiconductor. The family is known for low static and dynamic power, integrated transceivers on selected members, and a Quartus Prime / Quartus II toolchain that supports both HDL and IP-based design flows.
Key features include 4 PLLs, 20 global clock networks, 39600 logic elements, 1161216 bits of RAM, 126 DSP (18x18) blocks, and operation from a 1.2 V core supply with hot-socketing support. The C8 speed grade targets cost-optimized designs where maximum Fmax is not critical. JTAG (IEEE 1149.1) configuration is supported alongside passive serial, fast passive parallel, and active serial modes via the dedicated configuration pins.
Typical applications for the EP3C40U484C8N span industrial motor and motion control, video/image processing pipelines, software-defined radio front ends, telecom line-card glue logic, and embedded display controllers. The 484-ball package provides ample I/O and routing density for parallel memory buses (DDR/DDR2) and multiple high-speed serial interfaces. The -40C to +85C industrial temperature range supports factory-floor and outdoor deployments.
When designing with this device, plan power sequencing carefully - the 1.2 V VCCINT must ramp monotonically. Use the Quartus PowerPlay analyzer to estimate junction temperature and apply thermal relief on inner BGA balls. The UBGA-484 footprint requires a 0.8 mm-pitch PCB land pattern with via-in-pad recommended for reliable assembly.
直接替換替代品，適用於 EP3C40U484C8N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3C40U484C8N （相同外形與佔位） — 差異在於 Package, Speed Grade, RoHS Status, Process Technology, Operating Temperature.
EP3C40U484C8
✅ 直接替換聯絡詢價
查看資料表 →EP3C40U484C7N
✅ 直接替換聯絡詢價
查看資料表 →EP3C40U484C6N
✅ 直接替換聯絡詢價
查看資料表 →EP3C40U484C7
✅ 直接替換聯絡詢價
查看資料表 →EP3C40U484C6
✅ 直接替換聯絡詢價
查看資料表 →EP4CE40F23C8LN
✅ 直接替換聯絡詢價
查看資料表 →EP3C40U484C8N 最大額定值與電氣特性
| Series | Cyclone III |
| Family | Cyclone III (65 nm low-power FPGA) |
| Logic Elements | 39,600 |
| Embedded Memory | 1,161,216 bits |
| Embedded 18x18 Multipliers | 126 |
| User I/O Pins | 331 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Core Voltage (VCCINT) | 1.2 V |
| 工作溫度 | 0C to +85C (commercial) |
| 封裝 | 484-FBGA (UBGA, 19x19 mm, 0.8 mm pitch) |
| Speed Grade | 8 (C8, slowest / lowest-cost) |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant (lead-free) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, Active Serial, JTAG (IEEE 1149.1) |
EP3C40U484C8N 484-fbga (ubga, 19x19 mm, 0.8 mm pitch) 腳位配置指南
EP3C40U484C8N（484-fbga (ubga, 19x19 mm, 0.8 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3C40U484C8N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3C40U484C8N 適用於 6 應用s: Industrial Motor and Motion Control, Video and Image Processing Pipeline, Software-Defined Radio Front End, Telecom Line-Card Glue Logic, Embedded Display Controller, Factory Automation PLC Backplane.
Industrial Motor and Motion Control
The EP3C40U484C8N is widely used in industrial servo drives and motion controllers where the 39,600 logic elements, 126 18x18 multipliers, and 4 PLLs together implement multi-axis PID loops, space-vector PWM, and encoder interface logic on a single chip. The 1.2 V core with hot-socketing support simplifies hot-swap redundant-controller designs, and the 331 user I/Os comfortably accommodate parallel encoder feedback (quadrature, SSI, EnDat) plus SPI/parallel DAC chains. Estimated: at 100 MHz operation, the DSP blocks handle ~6.3 GMACs, sufficient for 4-6 axis current loops sampled at 16 kHz. The commercial 0-85C temperature range covers most factory-floor enclosures when paired with industrial-rated airflow. Power consumption stays under 1.5 W typical - well within the 484-UBGA 19x19 mm thermal envelope without a heatsink.
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Video and Image Processing Pipeline
The EP3C40U484C8N's 1,161,216 bits of embedded RAM and 126 18x18 multipliers make it well-suited to real-time video processing: 3-tap or 5-tap FIR filters, color-space conversion (YUV/RGB), and 2D deinterlacing at D1/720p resolutions. The 4 PLLs derive independent pixel clocks for ITU-R BT.656/BT.1120 input, memory controller, and display output, while 331 user I/Os accept wide parallel video buses plus DDR2 line buffers. The C8 speed grade comfortably supports 74.25 MHz HD-SDI pixel rates and 148.5 MHz 1080p rates with -6 speed grade headroom. Quartus II Video and Image Processing Suite (VIP) IP cores (Scaler, Deinterlacer, Color Space Converter) target this density tier directly. Memory bandwidth from the DDR2 controller IP sustains ~3.2 GB/s for 1080p60 processing.
推薦
Software-Defined Radio Front End
In SDR receiver designs, the EP3C40U484C8N implements the digital down-conversion chain (CIC, FIR, CORDIC NCO) after a high-speed ADC. The 126 18x18 multipliers deliver 31.5 GMACs of DSP throughput at 250 MHz, sufficient to run a 16-tap polyphase filter bank at 100 MSPS input rate. The 4 PLLs generate sample clocks, LO synthesis for NCOs, and system reference clocks from a single 10-50 MHz crystal. The 1,161,216-bit block RAM buffers 16K-sample complex IQ windows between the ADC and the host processor (typically a Nios II soft-core on-chip or external ARM). The commercial temperature range suits indoor base-station and test-instrument deployments; for outdoor small-cell use select the I-grade -40-85C variant. The 484-UBGA footprint provides clean power distribution for the noise-sensitive PLL analog supplies.
推薦
Telecom Line-Card Glue Logic
The EP3C40U484C8N serves as a high-density protocol-bridging FPGA on telecom line cards: TDM-to-Ethernet conversion, HDLC/PPP framing, UTOPIA/Posphy interfaces, and clock/data recovery for E1/T1/J1 trunks. The 39,600 logic elements absorb custom framing and rate-adaptation logic that does not fit in a fixed-function ASSP, while the 126 18x18 multipliers accelerate Reed-Solomon and convolutional FEC encoders. The 4 PLLs are well-matched to multi-rate TDM clocking (1.544/2.048/8.192 MHz hierarchies). Power consumption around 1-1.5 W fits within typical NEBS thermal envelopes when deployed on a vertical blade with modest airflow. Hot-socketing allows the line card to be replaced without shutting down the shelf. Source: Altera Cyclone III Telecom reference design (AN 519).
推薦
Embedded Display Controller
The EP3C40U484C8N is a strong fit for TFT-LCD and OLED panel timing controllers in industrial HMIs and medical imaging displays, generating HSYNC/VSYNC/DE pixel clocks, gamma-correction LUTs, and color-depth conversion (18-bit to 24-bit, RGB666 to RGB888) from 8-bit MCU host data. The 1,161,216 bits of embedded RAM hold two full frame buffers (D1 or 800x480 WXGA) and multiple gamma LUTs. The 331 user I/Os support 24-bit parallel RGB plus SPI/I2C touch interfaces and backlight PWM. The 4 PLLs derive the pixel clock from a low-frequency reference; C8 grade is sufficient for panels up to XGA (1024x768) at 60 Hz. Source: Altera Cyclone III Display Reference Design.
推薦
Factory Automation PLC Backplane
The EP3C40U484C8N is used as a programmable backplane controller in modular PLC racks, handling fieldbus protocol bridging (Modbus, PROFIBUS, EtherCAT slave, CANopen) and deterministic I/O scanning across backplane connectors. The 39,600 logic elements implement multiple soft-IP fieldbus stacks concurrently; the 4 PLLs align I/O scanning clocks across backplane slots. With 331 user I/Os the FPGA can drive 16+ slots of 16-bit parallel backplane data plus SPI/I2C/GPIO side-channels. The commercial 0-85C range suits IP54 industrial enclosures with active cooling. Hot-socketing allows live module replacement. The 1.2 V core voltage and 65 nm low-power process yield typical 0.9-1.3 W power consumption, well within the thermal envelope of sealed enclosures. Source: Altera Industrial Ethernet reference design.
推薦
推薦產品摘要
工程參考資料，適用於 EP3C40U484C8N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3C40U484C8 | EP3C40U484C7N | EP3C40U484C6N | EP4CE40F23C8LN |
|---|---|---|---|---|---|
| Package | 484-FBGA (UBGA-484, 19x19 mm) | 484-FBGA (UBGA-484, 19x19 mm) - same | 484-FBGA (UBGA-484, 19x19 mm) - same | 484-FBGA (UBGA-484, 19x19 mm) - same | 484-FBGA (19x19 mm) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same |
| Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone IV E |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 |
| Speed Grade | C8 (slowest, lowest cost) | C8 | C7 (~15% faster Fmax) | C6 (~25% faster Fmax) | C8 (lower power) |
| Embedded Memory | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits |
| 18x18 Multipliers | 126 | 126 | 126 | 126 | 126 |
| PLLs | 4 | 4 | 4 | 4 | 6 |
| User I/O | 331 | 331 | 331 | 331 | 331 |
| Process / Static Power | 65 nm / baseline | 65 nm / baseline | 65 nm / baseline | 65 nm / baseline | 60 nm / ~25% lower |
主要差異化特點
- Cyclone III C8 speed grade - lowest cost in the 40K-LE family (對比EP3C40U484C6N)
- 4 PLLs and 20 global clock networks (對比EP3C40F484C8N (different package variant))
- Direct drop-in compatibility within the EP3C40U484 family (對比EP4CE40F23C8LN (Cyclone IV E))
設計說明
Estimated: at 80% utilization and 100 MHz toggle, the EP3C40U484C8N consumes ~1.0-1.4 W from a 1.2 V VCCINT rail. Use the Quartus PowerPlay Early Power Estimator (EPE) spreadsheet for design-specific budgeting before board bring-up. VCCINT must ramp monotonically in 0.5-100 ms; failed monotonic ramps trigger POR events and configuration failure. Place 100 uF bulk + 10 uF + 0.1 uF decoupling within the BGA footprint with via-in-pad on the 484 balls to keep the high-frequency impedance below 1 mOhm through 100 MHz.
The 484-UBGA 19x19 mm package at 0.8 mm pitch requires 4-layer or 6-layer PCB stack-up with 0.4 mm laser-drilled microvias and via-in-pad for the inner BGA balls. Escape routing needs 4-5 routing layers to break out 331 user I/Os plus power/ground. Use the Altera Cyclone III U484 board design guidelines for layer stack-up and via pattern. Maintain 50 Ohm single-ended and 100 Ohm differential impedance for LVDS and SSTL signals.
Common pitfalls with the EP3C40U484C8N: (1) configuration mode strapping pins (MSEL[3:0]) must be tied correctly for AS/PS/FPP/JTAG modes - floating MSEL pins prevent configuration; (2) the nCONFIG pin must be held high during power-up; (3) JTAG chain order must match the .cdf file for multi-device programming; (4) I/O bank VCCIO voltages must be sequenced to avoid latch-up; (5) the C8 speed grade may not meet timing if your design was previously closed on C6 - always re-run TimeQuest after speed-grade change. Source: Altera Cyclone III configuration handbook and errata sheet.
The 484-UBGA package has a theta_JA of approximately 12-15 C/W on a standard 4-layer JEDEC test board (with 0 m/s airflow) and 8-10 C/W with 1 m/s airflow. Estimated: at 1.5 W power dissipation, junction temperature rise is 18-22 C above ambient with 1 m/s airflow - well within the 0-85C commercial range for 60C ambient deployments. For 85C ambient operation, derate I/O toggle rate or use the I-grade -40-100C variant. Apply thermal relief on inner BGA balls and connect thermal vias to internal ground planes.
合規資訊
RoHS compliant per the 'N' suffix in EP3C40U484C8N. Lead-free (SnAgCu) ball finish. Halogen-free status not explicitly stated in the verified distributor data and should be confirmed against the Intel material declaration document (MDDS). AEC-Q100 not applicable for FPGAs - automotive variants use the 'A' temperature suffix (EP3C40U484A7N).
