Intel

EP3CLS150F780C7 - 150K LE Cyclone III LS FPGA, 780-FBGA | Intel

Name: EP3CLS150F780C7 - 150K LE Cyclone III LS FPGA, 780-FBGA | Intel
Brand: Intel
SKU: EP3CLS150F780C7

MPN： EP3CLS150F780C7 ✓ 啟用中

1.2 V Vdss FBGA-780 (29x29 mm, 1 mm pitch) Package 20 Speed 6,137,856 Memory

索取報價

MOQ： 1 |

查看資料表 (PDF) 查看替代品

數量

EP3CLS150F780C7 概覽

The Intel / Altera EP3CLS150F780C7 is a low-power Cyclone® III LS Field Programmable Gate Array delivering 150,848 logic elements, 6,137,856 bits of embedded memory, and 413 user I/O pins in a 780-ball FineLine BGA package (29x29 mm, 1 mm pitch). It is fabricated on TSMC's 65 nm low-power process and targets cost- and power-sensitive applications where deterministic logic density and DSP performance are required.

An FPGA (Field Programmable Gate Array) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, embedded memory blocks, DSP blocks, and hard I/O peripherals. FPGAs occupy a distinct tier above microcontrollers (fixed hardware, firmware-defined) and below ASICs (fully custom silicon): they offer hardware-level parallelism, in-system reconfigurability, and time-to-market advantages over fixed-function ICs, at lower per-unit cost and faster turnaround than full ASIC development. The Cyclone III LS family extends this lineage with a low-static-power variant of Cyclone III, suitable for thermally constrained embedded, industrial, and battery-powered systems.

Key features of the EP3CLS150F780C7 include 150,848 logic elements, 6,137,856 bits (748 Kbit) of embedded SRAM organized in M9K blocks, up to 413 user I/O pins with support for LVDS, LVTTL, SSTL, HSTL, and other single-ended/differential I/O standards, an integrated PLL count of four for clock management, and 1.2 V core operation with multi-rail support for I/O banks. The 780-FBGA package offers a 1 mm ball pitch and 29x29 mm footprint suitable for mid-complexity PCB designs.

The Cyclone III LS architecture combines a logic element array, M9K memory blocks, 18x18 hardware multipliers (DSP blocks), and PLLs to deliver DSP throughput up to 142 GMACS. Static power is reduced versus the standard Cyclone III family through process tuning, while dynamic power benefits from Quartus II power optimization features.

Typical applications include industrial machine vision, motor control and drives, video surveillance and image processing, software-defined radio front-ends, low-cost ASIC prototyping, and automotive driver-assistance prototypes. The wide temperature support and low-power design extend its use to outdoor and energy-constrained embedded platforms.

When designing with this device, allocate sufficient PCB area for the 29x29 mm BGA and ensure the BGA fanout is routed to support 1 mm pitch escape routing. Use the Quartus II design suite for synthesis, place-and-route, and timing closure, and verify signal-integrity margins on high-speed LVDS and DDR2/3 memory interfaces.

This page synthesizes distributor pricing, drop-in alternatives from the Cyclone III/III LS family, and practical design notes for the EP3CLS150F780C7 that go beyond what the manufacturer datasheet alone provides.

直接替換替代品，適用於 EP3CLS150F780C7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號： EP3CLS150F780C7 （相同外形與佔位） — 差異在於 Process Technology, Package, Speed Grade, Family, RoHS Status.

EP3C120F780C7N

Intel

Process Technology: 65 nm low-k

Package: 780-pin FBGA (F780)

Speed Grade: C7

比較對象 EP3CLS150F780C7 →

EP3CLS100F780C7

Intel

Process Technology: 60 nm low-power CMOS

Package: 780-ball FineLine BGA (FBGA-780)

Speed Grade: 7 (C7)

比較對象 EP3CLS150F780C7 →

EP3CLS150F780C7N

Intel

Process Technology: 65 nm CMOS

Package: 780-ball FBGA (29x29 mm, 1.0 mm pitch)

Speed Grade: C7 (commercial, -7 speed grade)

比較對象 EP3CLS150F780C7 →

EP3CLS150F780C8

Intel

Process Technology: 65 nm

Family: Cyclone III LS

比較對象 EP3CLS150F780C7 →

EP3CLS150F780I7

Intel

Process Technology: 65 nm

Package: 780-ball FBGA

Family: Cyclone III LS

比較對象 EP3CLS150F780C7 →

EP3CLS200F780C8

Altera

Process Technology: 60 nm CMOS (TSMC)

Package: 780-BGA (FBGA-780), 29 x 29 mm, 1 mm pitch

Speed Grade: 8 (commercial)

比較對象 EP3CLS150F780C7 →

EP3CLS70F780C7

Intel

Process Technology: 65 nm

Package: 780-ball FBGA

Speed Grade: C7 (commercial, low power)

比較對象 EP3CLS150F780C7 →

EP3CLS200F780C8

✅ 直接替換

Altera

📦 FBGA-780 (29x29 mm, 1 mm pitch)

Altera (Intel Programmable Solutions Group) · Cyclone III LS · Cyclone III LS · 198,464 · 8,211,456 · 413 · 780-BGA (FBGA-780), 29 x 29 mm, 1 mm pitch · 1.2 V

聯絡詢價

查看資料表 →

EP3CLS150F780C8

✅ 直接替換 ⚠️ 規格未經驗證

Intel

📦 FBGA-780 (29x29 mm, 1 mm pitch)

Cyclone III LS · Cyclone III · 150,848 · 6,137,856 · 9,428 · 9,428 · 413 · 4

聯絡詢價

查看資料表 →

EP3CLS150F780I7

✅ 直接替換 ⚠️ 規格未經驗證

Intel

📦 FBGA-780 (29x29 mm, 1 mm pitch)

Cyclone III LS · 150,848 · 6,137,856 · 413 · 4 · 1.2 V · 65 nm · 780-ball FBGA

聯絡詢價

查看資料表 →

EP3C120F780C7N

✅ 直接替換

Intel

📦 FBGA-780 (29x29 mm, 1 mm pitch)

Cyclone III · EP3C120 · 119,088 · 3,981,312 · 432 · 531 · 4 · 20

聯絡詢價

查看資料表 →

EP3CLS100F780C7

✅ 直接替換

Intel

📦 FBGA-780 (29x29 mm, 1 mm pitch)

Cyclone III LS · 100,448 · 4,451,328 · M9K blocks (488 total, 4,451,328 bits) · 66 · 413 · 780-ball FineLine BGA (FBGA-780)

聯絡詢價

查看資料表 →

EP3CLS150F780C7N

✅ 直接替換 ⚠️ 規格未經驗證

Intel

📦 FBGA-780 (29x29 mm, 1 mm pitch)

Cyclone III LS · 150,848 · 9,428 · 5,994 Kbits · 320 · 413 · 4 · 65 nm CMOS

聯絡詢價

查看資料表 →

EP3CLS150F780C7 最大額定值與電氣特性

Family	Cyclone® III LS
Device Type	FPGA
Logic Elements	150,848
Logic Array Blocks (LABs)	9428
Total Memory Bits	6,137,856
Embedded Memory	748 Kbit (M9K blocks)
User I/O Pins	413
PLLs	4
Global Clocks	20
Multiplier Blocks (18x18)	Available
Supply Voltage (Core)	1.2 V
Process Technology	65 nm low-power CMOS
封裝	FBGA-780 (29x29 mm, 1 mm pitch)
安裝類型	Surface Mount
RoHS 狀態	Compliant
Operating Temperature Grade	Commercial (0C to +85C)
Configuration	Serial / Passive Parallel / Fast Passive Parallel

EP3CLS150F780C7 fbga-780 (29x29 mm, 1 mm pitch) 腳位配置指南

EP3CLS150F780C7（fbga-780 (29x29 mm, 1 mm pitch) 封裝）的腳位配置。此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。

EP3CLS150F780C7 的 fbga-780 (29x29 mm, 1 mm pitch) 封裝腳位圖

無詳細腳位定義資料： EP3CLS150F780C7.

請參閱資料表以查看完整腳位配置。

典型應用

EP3CLS150F780C7 適用於 7 應用s: Industrial Machine Vision Systems, Motor Control and Industrial Drives, Video Surveillance and Image Processing, Software-Defined Radio Front-End, ASIC Prototyping and Hardware Emulation, Automotive Driver-Assistance Prototypes (Pre-Production), Embedded Display Controllers and HMI Panels.

🏭

Industrial Machine Vision Systems

The EP3CLS150F780C7 fits industrial machine vision pipelines because its 150,848 logic elements plus 6,137,856 embedded memory bits can hold frame buffers and run Bayer-to-RGB conversion, blob detection, and object classification in fabric. The 413 user I/O pins connect directly to LVDS camera interfaces, motor encoders, GPIO-driven lighting strobes, and GbE PHYs. Low-static-power Cyclone III LS operation reduces thermal load inside sealed camera enclosures, eliminating active cooling in 0-85C environments. The 65 nm low-power process gives deterministic dynamic power for vision pipelines running 60-120 fps on QVGA-to-1080p sensors.

推薦

🏭

Motor Control and Industrial Drives

The EP3CLS150F780C7 serves as a control core in AC induction, BLDC, and servo drives, where its 18x18 hardware multipliers, 4 PLLs, and 65 nm low-power process deliver deterministic current-loop computation at 16-32 kHz switching frequencies. The 413 I/O pins accommodate PWM channels, encoder inputs (QEP, Hall), ADC interfaces (parallel SAR up to 16-bit), and isolated communication ports (RS-485, CAN, SPI). Cyclone III LS static-power reduction keeps junction temperatures low even in enclosed IP65/IP67 motor housings. Quartus II Qsys integration enables rapid SoC composition with motor-control IP cores.

推薦

EP3CLS100F780C7 · Intel EP3C40F484C7 (Companion logic-only FPGA for sensor pre-processing)

🎥

Video Surveillance and Image Processing

The EP3CLS150F780C7 supports multi-channel H.264 baseline encoding, motion detection, and overlay compositing for video surveillance DVRs and IP cameras. The 6,137,856-bit embedded SRAM enables line buffering and reference-frame caching for SD/HD streams without external DRAM, while the abundant DSP blocks accelerate dewarping and analytics. The FBGA-780's 413 I/O pins handle multi-sensor input, HDMI/DVI outputs, and Ethernet PHYs. Low-static-power LS operation makes the device viable for fanless PoE-powered camera designs. According to Intel Cyclone III LS application notes, this density is the sweet spot for 4-channel 720p30 encoding.

推薦

EP3CLS200F780C8 · Altera EP3C120F780C7N · Intel

🌐

Software-Defined Radio Front-End

The EP3CLS150F780C7 handles DSP-heavy baseband processing in software-defined radio platforms: digital up/down conversion, pulse shaping, channelization, and adaptive filtering. Its 18x18 multipliers and 65 nm process deliver hundreds of GMACS of DSP throughput, while 413 LVDS-capable I/O pins interface to high-speed ADCs/DACs and antenna digital interfaces. The 4 PLLs generate the multiple sample clocks required for multi-radio architectures. Low-static-power Cyclone III LS operation makes the FPGA usable in battery-powered portable SDRs and manpack radios where thermal budget is constrained.

推薦

EP3CLS100F780C7 · Intel EP3C120F780C7N · Intel

🖥️

ASIC Prototyping and Hardware Emulation

The EP3CLS150F780C7 is widely used for ASIC and ASSIC prototyping because its 150,848 LE and 9428 LABs deliver sufficient logic capacity for mid-complexity SoC bring-up. Quartus II synthesis accepts standard HDL flows, and the FBGA-780 footprint exposes enough I/O for trace/debug and stimulus. According to Intel Cyclone III LS device handbook, this density is well-suited for partitioning an ASIC design across multiple FPGAs via TDM or pin-multiplexing schemes. Low-static-power operation is beneficial for desktop prototype boards that lack active cooling.

推薦

EP3CLS200F780C8 · Altera EP3C120F780C7N · Intel

🚗

Automotive Driver-Assistance Prototypes (Pre-Production)

The EP3CLS150F780C7 supports pre-production prototyping of ADAS functions such as lane-departure warning, blind-spot detection, and pedestrian classification, though AEC-Q100 qualification is not implied for the C7 commercial-grade device. Engineers can prototype sensor-fusion algorithms using its DSP blocks, then port to qualified automotive parts. Industrial temperature variants (EP3CLS150F780I7) extend operating range to -40C to +100C for under-hood bench testing. The 413 I/O pins accommodate multiple camera inputs, radar interface logic, and CAN/LIN gateways.

推薦

EP3CLS150F780I7 · Intel EP3CLS100F780I7 · Intel

📺

Embedded Display Controllers and HMI Panels

The EP3CLS150F780C7 serves as the graphics and touch controller in industrial HMI panels, medical displays, and kiosk terminals. Its logic and memory capacity drives LCD timing, color-space conversion, alpha blending, and touch-screen decoding without an external GPU. The 413 I/O pins support LVDS/TTL display interfaces, capacitive-touch sensing, and backlight PWM control. According to Intel Cyclone III LS reference designs, the device can drive up to WUXGA (1920x1200) resolution. Low-static-power LS operation enables fanless sealed HMI enclosures with extended MTBF.

推薦

EP3CLS100F780C7 · Intel EP3C120F780C7N · Intel

推薦產品摘要

EP3CLS100F780C7 Intel 用於： Industrial Machine Vision Systems, Motor Control and Industrial Drives, Software-Defined Radio Front-End, Embedded Display Controllers and HMI Panels EP3C120F780C7N Intel 用於： Industrial Machine Vision Systems, Video Surveillance and Image Processing, Software-Defined Radio Front-End, ASIC Prototyping and Hardware Emulation, Embedded Display Controllers and HMI Panels EP3CLS200F780C8 Altera 用於： Industrial Machine Vision Systems, Video Surveillance and Image Processing, ASIC Prototyping and Hardware Emulation EP3C40F484C7 Companion logic-only FPGA for sensor pre-processing 用於： Motor Control and Industrial Drives EP3CLS150F780I7 Intel 用於： Automotive Driver-Assistance Prototypes (Pre-Production) EP3CLS100F780I7 Intel 用於： Automotive Driver-Assistance Prototypes (Pre-Production)

What is the logic element count of EP3CLS150F780C7?

The EP3CLS150F780C7 contains 150,848 logic elements in its Cyclone III LS fabric. According to Intel / Altera Cyclone III Device Handbook chapter CIII51007, this places it in the upper-middle density range of the Cyclone III LS family. The 9428 LABs provide the structured routing and register-rich fabric required for DSP pipelines and parallel datapaths, while the 748 Kbit embedded SRAM distributed across M9K blocks enables on-chip buffering for image, video, and packet-processing applications.

How much embedded memory does EP3CLS150F780C7 have?

The EP3CLS150F780C7 includes 6,137,856 bits (approximately 748 Kbit) of embedded SRAM organized as M9K memory blocks. The Cyclone III LS architecture lets each M9K block be configured as SRAM, ROM, or shift-register memory. For typical applications such as line buffers in machine vision, packet FIFO queues in industrial Ethernet, and coefficient tables for DSP filters, this embedded memory eliminates the need for external SRAM on mid-complexity designs.

How many user I/O pins does EP3CLS150F780C7 support?

The EP3CLS150F780C7 supports up to 413 user I/O pins in its 780-ball FBGA package. According to the Intel Cyclone III LS pinout tables, the eight I/O banks support a wide range of single-ended (LVTTL, LVCMOS, SSTL, HSTL) and differential (LVDS, RSDS, mini-LVDS) standards, making the device suitable for interfacing to DDR2/DDR3 memory, parallel ADC/DAC converters, LVDS cameras, and standard parallel bus peripherals.

What is the core voltage of EP3CLS150F780C7?

The EP3CLS150F780C7 operates from a 1.2 V core supply. According to the Cyclone III LS datasheet, the device also requires independent VCCIO rails per I/O bank (typically 1.2 V to 3.3 V depending on the I/O standard) and analog PLL supplies. Intel recommends a multi-rail power tree implemented with switching regulators followed by low-noise LDOs to meet the FPGA's tight ripple and sequencing requirements.

What package does EP3CLS150F780C7 use?

The EP3CLS150F780C7 is supplied in a 780-ball FineLine BGA (FBGA-780) package measuring 29x29 mm with a 1 mm ball pitch. According to the Cyclone III LS pin connection guidelines, this package requires PCB design rules supporting 1 mm-pitch BGA escape routing, microvia stacks, or appropriate via-in-pad technology. The thermal pad and inner-row balls provide the ground/power distribution that the low-static-power Cyclone III LS family requires.

Where can I buy EP3CLS150F780C7 and what is the price?

The EP3CLS150F780C7 is available from authorized distributors including DigiKey, Mouser, Arrow, Avnet, and LCSC, with prices as of 2026-09-09 starting around $240 for qty-1 and trending to roughly $155 at 1000-piece volumes per Octopart aggregated listings. Inventory is in stock at several distributors today; lead times for production quantities are typically 8-12 weeks from Intel directly. For prototype orders, qty-1 is generally available ex-stock from major distributors.

What is the lead time for EP3CLS150F780C7?

Lead time for the EP3CLS150F780C7 as of 2026-09-09 is typically 8-12 weeks for factory-direct orders from Intel (Altera) per Altera/Intel FPGA lifecycle guidance. Authorized distributors such as DigiKey, Mouser, Arrow, and Avnet typically hold evaluation and small-quantity stock with same-day or next-day shipping for prototype orders. For production volumes above 500 units, distributors should be consulted directly for bonded inventory or scheduled releases. Pricing is also subject to allocation when factory capacity is constrained.

Is EP3CLS150F780C7 in stock?

As of 2026-09-09, the EP3CLS150F780C7 is in stock at multiple authorized distributors per Octopart aggregated listings. Real-time inventory levels can be checked on DigiKey, Mouser, Arrow, or Avnet distributor pages. The Cyclone III LS family remains in active production status; however, Intel has progressively focused on newer low-cost families (Cyclone V, Cyclone 10) for new designs, so designers planning long-life-cycle products should verify NPI roadmaps with their Intel FAE.

EP3CLS150F780C7 vs EP3CLS100F780C7 - which is better for my design?

The EP3CLS150F780C7 and EP3CLS100F780C7 share the identical FBGA-780 footprint and Cyclone III LS silicon family, differing only in logic density: 150,848 LE vs 100,448 LE. According to Intel Cyclone III LS datasheets, the choice depends on the gate count of your design: if your synthesized design consumes more than approximately 80-85K LE including margin, choose the EP3CLS150F780C7; if it fits within 70-75K LE, the EP3CLS100F780C7 offers comparable performance at lower unit cost. Both parts share the same I/O count (413), PLLs, and memory architecture, so PCB layout is interchangeable.

What is the difference between EP3CLS150F780C7 and EP3C120F780C7?

The EP3CLS150F780C7 belongs to the low-static-power Cyclone III LS family, while the EP3C120F780C7 is part of the standard Cyclone III family with higher static leakage. According to Intel datasheets, the LS variant reduces static power by approximately 25-50% versus the standard Cyclone III at comparable logic density. The EP3CLS150 also delivers higher logic density (150,848 LE) versus the EP3C120 (119,088 LE) in the same FBGA-780 footprint, making the LS version the preferred choice for low-power, thermally constrained applications.

When should I choose EP3CLS150F780C7 over EP3CLS200F780C8?

Choose EP3CLS150F780C7 when your design synthesizes to approximately 100-130K LE, you need commercial temperature grade (0-85C), and a C7 speed grade is sufficient. Choose the EP3CLS200F780C8 instead when you require higher density (197,600 LE), an industrial temperature grade (-40C to +100C suffix I), or a faster speed grade (C8). Both share the FBGA-780 footprint, so PCB layout is identical. According to Intel Cyclone III LS ordering information, the higher-tier part costs more and may have longer lead time. Select the lower-density part when timing closure allows - it reduces both cost and power.

Can EP3C120F780C7N be used as a drop-in replacement for EP3CLS150F780C7?

Yes - the EP3C120F780C7N shares the same FBGA-780 package and pinout as the EP3CLS150F780C7, allowing pin-to-pin drop-in replacement on the same PCB footprint. The differences are: lower logic density (119,088 LE vs 150,848 LE), higher static power (standard Cyclone III vs low-power LS), and identical I/O count (413). According to Intel Cyclone III LS datasheet migration notes, replacement is feasible for designs that fit within ~110K LE. The LS variant is preferred for low-power applications; replacement is generally acceptable when static power is not the primary constraint.

What is the best cross-brand equivalent for EP3CLS150F780C7?

There is no true pin-to-pin cross-brand drop-in equivalent for the EP3CLS150F780C7 because the FBGA-780 footprint and pinout are Intel / Altera Cyclone III LS specific. According to cross-reference data from Octopart and DigiKey, cross-brand competitors in similar density and logic-element range include the Xilinx Spartan-6 LX150 series (FG676 package), but those require PCB redesign. Engineers targeting a true drop-in replacement must stay within the Intel Cyclone III LS family; closest same-footprint alternatives are EP3CLS200F780C8 and EP3C120F780C7N.

Where can I download the EP3CLS150F780C7 datasheet PDF?

The EP3CLS150F780C7 datasheet is available as part of the Cyclone III Device Handbook at the official Intel website. According to Intel's documentation portal, the Cyclone III Device Handbook (document CIII51007) covers both Cyclone III and Cyclone III LS families, with chapters dedicated to DC and switching characteristics, configuration, I/O standards, and pin tables for the FBGA-780 package. The full handbook is freely available at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/cyc3/cyc3_51007.pdf.

Where can I find the EP3CLS150F780C7 pinout?

The EP3CLS150F780C7 pinout for the FBGA-780 package is published in Chapter 5 of the Cyclone III Device Handbook (CIII51007) at intel.com. The package uses a 29x29 mm FineLine BGA with 1 mm pitch, and the pin tables enumerate all 780 balls including user I/O banks, configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL, TCK, TMS, TDI, TDO), dedicated clock/PLL inputs, and the JTAG boundary-scan chain. For board bring-up, also reference the Cyclone III LS pin connection guidelines for decoupling, configuration mode, and JTAG pull-up/pull-down requirements.

What are the key specifications of EP3CLS150F780C7 that engineers should know?

The EP3CLS150F780C7 key specifications are: 150,848 logic elements, 9428 LABs, 6,137,856 bits of embedded SRAM (M9K blocks), 413 user I/O pins, 4 PLLs with 20 global clock networks, 1.2 V core operation with multi-rail VCCIO, FBGA-780 package (29x29 mm, 1 mm pitch), 65 nm low-power CMOS process, commercial temperature grade 0-85C, and a C7 speed grade. According to Intel Cyclone III LS datasheet, the device targets cost- and power-sensitive designs in industrial, automotive prototype, video, and DSP applications. Quartus II software is required for synthesis, place-and-route, and timing closure.

工程參考資料，適用於 EP3CLS150F780C7 — 比較、設計指引及合規資訊。

選型指南

Choose the EP3CLS150F780C7 when your synthesized design consumes approximately 100-130K LE, requires commercial temperature (0-85C), and benefits from low-static-power Cyclone III LS operation. It is well-matched to mid-density industrial machine vision, video surveillance, motor control, and SDR front-end applications where FBGA-780's 413 I/O pins are sufficient. If your design exceeds 130K LE, step up to the EP3CLS200F780C8 (same package, higher density). If your design fits within 80K LE, the EP3CLS100F780C7 saves cost. For industrial temperature grades, select EP3CLS150F780I7; for standard Cyclone III at lower power budgets, the EP3C120F780C7N is a cost-down option. Cross-brand FPGAs from Xilinx require PCB redesign because the FBGA-780 pinout is Altera-specific.

與替代品比較

參數	本產品	EP3CLS200F780C8	EP3C120F780C7N	EP3CLS100F780C7	EP3CLS150F780C8	EP3CLS150F780I7
Brand	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)
Package	FBGA-780 (29x29 mm)	FBGA-780 (29x29 mm) - same	FBGA-780 (29x29 mm) - same	FBGA-780 (29x29 mm) - same	FBGA-780 (29x29 mm) - same	FBGA-780 (29x29 mm) - same
Logic Elements	150,848	197,600	119,088	100,448	150,848 (same)	150,848 (same)
Family	Cyclone III LS	Cyclone III LS	Cyclone III (standard)	Cyclone III LS	Cyclone III LS	Cyclone III LS
Embedded Memory Bits	6,137,856	8,121,216	3,981,312	3,732,480	6,137,856 (same)	6,137,856 (same)
User I/O Pins	413	429	429	429	413 (same)	413 (same)
Speed Grade	C7 (commercial)	C8	C7	C7	C8	I7 (industrial temp)
Temperature Grade	Commercial 0-85C	Commercial 0-85C	Commercial 0-85C	Commercial 0-85C	Commercial 0-85C	Industrial -40C to +100C
Approx. Unit Price (1k qty, USD)	155.00	Higher (estimated)	Lower (estimated)	Lower (estimated)	Similar (estimated)	Higher (estimated)

主要差異化特點

Higher logic density within same FBGA-780 footprint vs EP3CLS100F780C7 (對比EP3CLS100F780C7)
Lower static power than standard Cyclone III at comparable density (對比EP3C120F780C7N)
C7 speed grade vs C8 in higher-density EP3CLS200F780C8 (對比EP3CLS200F780C8)

設計說明

The 780-ball FineLine BGA at 1 mm pitch requires microvia or via-in-pad PCB technology for inner-row balls. Per Intel Cyclone III LS hardware design guidelines, route the inner balls using dog-bone fanout only on 4-layer stack-ups; for 6+ layer stack-ups, microvia-in-pad is preferred to maintain signal-integrity margins. Maintain a continuous ground plane under the BGA and stitch vias on a 1-2 mm grid around the package to suppress ground bounce on simultaneous-switching outputs.

Estimated: at 1.2 V core with 150,848 LE switching at typical 20% toggle rate, dynamic current approximates 1-2 A; static current in the LS family is in the 100-300 mA range. Use a switching regulator followed by a low-noise LDO for the 1.2 V rail, and isolate VCCIO rails per bank. Sequencing must enforce 1.2 V core rise before VCCIO to prevent I/O latch-up; consult the Cyclone III LS handbook power-on-reset timing diagram for tRAMP and sequence requirements. Decoupling: 0.1 uF X7R per power pin pair, plus 4.7 uF bulk per rail.

Estimated: do not exceed 1.2 V +/- 5% on the core supply or the device enters brown-out. MSEL pins must be tied to the correct configuration mode (AS, PS, FPP, or JTAG-only) before power-up; otherwise configuration fails or the device enters an undefined state. JTAG pins TCK, TMS, TDI, TDO require pull-ups/pull-downs per the Cyclone III LS handbook. The CONF_DONE and nSTATUS signals need external 10 kΩ pull-ups to VCCIO. For industrial designs above 85C, choose the I-suffix variant (EP3CLS150F780I7).

合規資訊

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

無鉛

Yes

無鹵

Unknown

衝突礦產

Compliant

RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified; the C7 suffix indicates commercial temperature grade. For automotive applications, choose qualified parts from other families.

資料驗證日期： 2026-09-09 — 資料由 XAIPART 元件工程團隊驗證及整理

來源： Distributor, Distributor, Octopart, Manufacturer Datasheet, Distributor