EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
MPN: EP3SE110F1152C4 ⚠ Lần mua cuốiEP3SE110F1152C4 Tóm tắt
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic function is defined after manufacture through configuration memory (SRAM cells). FPGAs combine programmable logic elements, configurable interconnect, embedded memory blocks, DSP slices, and high-speed transceivers into a single die, occupying the application-specific integrated circuit (ASIC) prototyping and parallel-computing tier of the broader digital IC hierarchy. Within Intel's product lineup, the Stratix III family is positioned as a mid-to-high density, low-power 65nm generation that preceded Stratix IV and Stratix V families.
The EP3SE110F1152C4 delivers up to 896 embedded multiplier 18x18 blocks, dedicated high-speed DSP blocks, and modular I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, SSTL, and other differential signaling standards. It features dynamic on-chip termination, programmable output delay, and configurable current strength, all of which are engineered for best-in-class signal integrity at multi-gigabit rates.
Architecturally, the Stratix III E variant emphasizes memory density and multiplier count for data-centric applications, distinguishing it from the L (logic-optimized) and GX (transceiver-rich) siblings. The 1152-ball FCBGA package offers high pin escape for high I/O count designs, and the 1.1V core voltage reduces dynamic power relative to earlier 90nm Stratix II devices.
Typical applications include high-performance digital signal processing, ASIC prototyping, military and aerospace signal processing, telecom baseband processing, high-speed data acquisition systems, and industrial imaging and video processing platforms. The Stratix III E memory and DSP ratio particularly suits FFT, FIR, and video codec pipelines.
When designing with the EP3SE110F1152C4, careful power-rail sequencing is required because the Stratix III family mandates a specific core and I/O ramp profile. Use Intel's PowerPlay early power estimator tool before PCB layout to budget decoupling capacitor count and copper area.
This page synthesizes distributor pricing, drop-in package equivalents, and practical design notes not found in the standalone manufacturer datasheet, enabling faster sourcing and engineering decisions for legacy designs.
Bộ thay thế dễ dàng lắp đặt cho EP3SE110F1152C4 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3SE110F1152C4 (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, Speed Grade, Family, Process Technology.
EP3SE110F1152C3N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3SE110F1152C3
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3SE110F1152C2N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3SE110F1152C2
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3SE110F1152C2NES
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3SE110F1152C4 Tỷ lệ tối đa & tính chất điện
| Family | Stratix III E |
| Logic Elements | 107,500 |
| Embedded Memory | 8,936,448 bits |
| Maximum User I/Os | 744 |
| Process Technology | 65 nm |
| Core Voltage | 1.1 V |
| Maximum Performance | 450 MHz |
| Package Type | 1152-ball FCBGA (Flip-Chip BGA) |
| Operating Temperature Grade | Commercial (C4) |
| Configuration Memory | SRAM-based (volatile) |
| On-chip Termination | Dynamic, programmable |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL |
| Trạng thái RoHS | Compliant |
Hướng dẫn cấu hình chân EP3SE110F1152C4 1152-ball fcbga (flip-chip bga)
Cấu hình chân cho EP3SE110F1152C4 (1152-ball fcbga (flip-chip bga) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP3SE110F1152C4.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP3SE110F1152C4 phù hợp cho 6 Áp dụngs: High-Performance DSP Pipelines, ASIC Prototyping and Emulation, Telecom Baseband Processing, High-Speed Data Acquisition Systems, Industrial Video and Image Processing, Military and Aerospace Signal Processing.
High-Performance DSP Pipelines
The EP3SE110F1152C4's 107,500 logic elements and high embedded memory density (8,936,448 bits) make it well suited for multi-channel DSP pipelines such as radar baseband processing, multi-carrier wireless demodulation, and medical imaging front-ends. The Stratix III E family's elevated multiplier-to-logic ratio accelerates FFT, FIR, and matrix-multiply kernels; in a 256-point FFT the device sustains >450MHz DSP slice throughput per the Stratix III Device Handbook. Pair with a TI ADS62P49 ADC front-end for a complete signal chain. The 1152-ball FCBGA package exposes enough I/O for parallel LVDS ADC/DAC interfaces without multiplexing.
Được đề xuất
ASIC Prototyping and Emulation
Designers use the EP3SE110F1152C4 as an ASIC prototype target because the 107.5K LE fabric maps RTL designs up to several million gates when combined with embedded memory blocks for FIFO and register-file emulation. Compared with ASIC tape-out, a Stratix III E prototype cuts bring-up time from months to weeks and supports in-system debug via SignalTap II embedded logic analyzer. The 744 I/O count accommodates wide bus prototyping, and the FCBGA package allows high-speed SERDES-style edge rates for ASIC clock tree validation.
Được đề xuất
Telecom Baseband Processing
In LTE and WCDMA baseband boards, the EP3SE110F1152C4 handles channel-card DSP, scrambling, FEC decode, and MAC-layer scheduling in a single fabric. The 1.1V core voltage limits dynamic power relative to 90nm Stratix II, which is critical for densely populated base-station line cards. The 1152-ball FCBGA package supports CPRI or OBSAI optical backhaul links through LVDS I/O banks, and the device's 8.9Mbit embedded RAM holds working sets for HARQ soft-combining without external SRAM access.
Được đề xuất
High-Speed Data Acquisition Systems
Multi-channel data acquisition cards pair the EP3SE110F1152C4 with high-speed ADCs and DACs over LVDS links, leveraging the device's 744 I/O count to ingest 16+ parallel ADC lanes without time-division multiplexing. The embedded RAM (8.9Mbit) serves as deep capture buffers between ADC bursts and downstream PCIe or Ethernet transfer, eliminating external SRAM in many designs. Designers should budget thermal dissipation carefully: at 450MHz utilization the FCBGA package typically requires forced-air cooling per Intel PowerPlay estimator guidance.
Được đề xuất
Industrial Video and Image Processing
Machine-vision and broadcast video routers exploit the EP3SE110F1152C4's memory bandwidth to perform real-time SD/HD/3G-SDI bridging, color-space conversion, and frame-rate conversion. The embedded DSP blocks accelerate 2D convolution and Sobel edge detection kernels commonly used in defect-inspection cameras. With 744 I/Os the device can directly interface to multiple Camera Link or CoaXPress channels, simplifying PCB routing compared with smaller FPGAs that require channel multiplexing.
Được đề xuất
Military and Aerospace Signal Processing
Defense and avionics platforms use the EP3SE110F1152C4 for radar pulse compression, electronic-warfare (EW) channelization, and software-defined radio (SDR) baseband processing where high logic density, large memory, and abundant I/O are critical. The commercial (C4) temperature grade limits deployment to benign environments; for harsh-environment programs, designers should pair this device with ruggedized carrier boards and use industrial-grade (-40C to +100C) sibling parts such as EP3SE110F1152I4. The 65nm Stratix III process and SRAM-based configuration support secure bitstream loading and reconfiguration in field.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP3SE110F1152C4 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP3SE110F1152C3N | EP3SE110F1152C3 | EP3SE110F1152C2N | EP3SE110F1152C2 | EP3SE110F1152C2NES |
|---|---|---|---|---|---|---|
| Package | 1152-ball FCBGA | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 |
| Speed Grade | C4 (slowest commercial) | C3 (faster by one bin) | C3 | C2 (slower by one bin) | C2 | C2 |
| Embedded Memory (bits) | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 |
| Maximum User I/Os | 744 | 744 | 744 | 744 | 744 | 744 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
Bảo phân biệt quan trọng
- Stratix III E family - memory and DSP rich variant (vsEP3SL110F1152C4 (Stratix III L))
- Commercial C4 speed grade - lowest-cost option (vsEP3SE110F1152C3N (C3 speed grade))
- 1152-ball FCBGA - highest I/O count in EP3SE110 family (vsSmaller-package EP3SE110 variants (e.g. 780-pin F780))
Ghi chú thiết kế
Estimated: At full 107.5K LE utilization and 450MHz clock, the EP3SE110F1152C4 can draw up to ~10-15W from the 1.1V core rail based on toggle-rate assumptions used in Altera PowerPlay. Use a 4-6 phase buck regulator with at least 20A capability on VCCINT and place decoupling capacitors (0402 or 0201 ceramics) within 2mm of every VCC/VSS pair per Intel's Stratix III power distribution guidelines.
Estimated: The 1152-ball FCBGA package has a typical theta_JB of approximately 0.5 C/W when mounted on a 12-layer PCB with full thermal via array under the die. At 12W dissipation the junction-to-board rise is roughly 6C; however, at 18W this rises to 9C, so for high-utilization designs a heatsink or forced airflow of at least 200 LFM is recommended to keep Tj below 100C in commercial operation.
The 1152-ball FCBGA requires high-density interconnect (HDI) PCB fabrication with at least 1oz copper on outer layers and microvia-in-pad or stacked-via structures. Use Intel's Stratix III pin connection guidelines to identify which balls require connection vs. which can be left NC (no-connect), and follow the recommended 8-layer stack-up with dedicated ground and power planes adjacent to the signal layers to control return-path impedance.
Do not assume the EP3SE110F1152C4 can be substituted for a Stratix III GX or SL variant even when the package matches - the I/O bank count and SERDES availability differ. Verify pin compatibility in the Quartus II Pin Planner before committing to a substitution. Also note that the SRAM-based configuration memory requires a configuration device (EPCS) or JTAG programming on every power-up.
Thông tin tuân thủ
RoHS compliance inferred from Intel/Altera Stratix III family documentation. Reach, halogen-free, and conflict-minerals status were not explicitly stated in the verified web data and remain unknown.
