EP3SE260F1152I4LN - Stratix III E FPGA 255K LE FCBGA-1152 | Intel
MPN： EP3SE260F1152I4LN ✓ 啟用中EP3SE260F1152I4LN 概覽
What is an FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor in the programmable logic device (PLD) family, sitting between fixed-function ASICs and software-driven microcontrollers in the silicon hierarchy. Stratix III E specifically sits inside Intel's high-performance FPGA lineage (FPGA & CPLD -> programmable logic -> logic device -> semiconductor IC), delivering the highest logic density, highest DSP throughput, and lowest power consumption of any 65 nm FPGA family Intel ever shipped.
Key features include 10,200 Logic Array Blocks (LABs), 768 embedded 18x18 multipliers, dedicated DSP blocks for high-speed signal processing, 12 transceiver channels supporting multi-gigabit serial protocols, and rich clocking with PLLs. Hard memory controller and PCIe IP hard cores accelerate memory and high-speed serial interfaces without consuming fabric logic.
The architecture combines a fine-grained logic fabric with column- and row-based memory blocks, achieving deterministic timing closure for designs above 200 MHz. The 65 nm process node combined with programmable power technology (low-static-power devices) cuts dynamic power relative to Stratix II at equivalent performance.
Typical applications include high-end telecommunications backhaul, military radar and electronic warfare, ASIC prototyping, high-frequency trading acceleration, and medical imaging pipelines. The package's high I/O count suits parallel memory interfaces and LVDS-heavy front-end electronics.
Design considerations include power planning across 0.9 V core and 1.8 V/2.5 V/3.3 V I/O rails, mandatory heatsinking for sustained 717 MHz operation, and 12-layer PCB stack-up for BGA breakout. Use the Quartus II design suite for synthesis, place-and-route, and timing analysis.
This page synthesizes distributor pricing, drop-in Stratix III E alternatives from the same family, and practical thermal/PCB guidance beyond the manufacturer datasheet.
直接替換替代品，適用於 EP3SE260F1152I4LN — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SE260F1152I4LN （相同外形與佔位） — 差異在於 Package, Core Voltage, Speed Grade, Operating Temperature, Embedded Memory.
EP3SE260F1152I4L
✅ 直接替換聯絡詢價
查看資料表 →EP3SE260F1152I4
✅ 直接替換聯絡詢價
查看資料表 →EP3SE260F1152I3N
✅ 直接替換聯絡詢價
查看資料表 →EP3SE260F1152C4N
✅ 直接替換聯絡詢價
查看資料表 →EP3SE260F1152C4LN
✅ 直接替換聯絡詢價
查看資料表 →EP3SE110F1152I4N
✅ 直接替換聯絡詢價
查看資料表 →EP3SE260F1152I4LN 最大額定值與電氣特性
| Family | Stratix III E |
| Process Node | 65 nm CMOS |
| Logic Elements (LE) | 255,000 |
| Logic Array Blocks (LAB) | 10,200 |
| Embedded Memory Bits | 16,672,640 |
| User I/Os | 744 |
| 封裝 | FCBGA-1152 (1517-ball) |
| Package Dimensions | 35 x 35 mm |
| Core Voltage | 0.9 V (supports 1.05-1.15 V variant) |
| 工作溫度 | -40 C to +100 C (Industrial) |
| Operating Frequency | Up to 717 MHz |
| 安裝類型 | Surface Mount |
| Supply Voltage Range | 0.9 V core, 1.05 V-1.15 V supported |
| Series | Stratix III |
| RoHS 狀態 | Compliant |
| Design Tool | Quartus II |
EP3SE260F1152I4LN 35 x 35 mm 腳位配置指南
EP3SE260F1152I4LN（35 x 35 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SE260F1152I4LN.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SE260F1152I4LN 適用於 6 應用s: ASIC Prototyping, High-Bandwidth Signal Processing, Telecommunications Backhaul, Military and Aerospace Systems, Medical Imaging Pipelines, High-Frequency Trading Acceleration.
ASIC Prototyping
The EP3SE260F1152I4LN is engineered for ASIC prototyping where its 255,000 logic elements and 16.6 Mbit embedded memory provide a comfortable superset of mid-complexity ASIC gates. The Quartus II design suite allows direct migration from ASIC RTL, and the 744 user I/Os accommodate wide parallel interfaces typical of pre-silicon validation. Industrial -40 to +100 C operation ensures prototypes run in real-world thermal envelopes, while 717 MHz fabric performance matches ASIC timing paths within 10-15% for verification confidence.
推薦
High-Bandwidth Signal Processing
The EP3SE260F1152I4LN's 768 embedded 18x18 multipliers and dedicated DSP blocks deliver multi-GFLOP throughput for radar, software-defined radio, and medical imaging pipelines. The 16.6 Mbit embedded memory feeds DSP pipelines at fabric speed without external memory round-trips. The 744 user I/Os support parallel LVDS data acquisition at hundreds of MHz, and the 12 transceiver channels handle multi-gigabit serial backhaul. This combination places it at the top tier of 65 nm DSP-capable FPGAs.
推薦
Telecommunications Backhaul
Telecommunications backhaul equipment leverages the EP3SE260F1152I4LN's hard PCIe cores, multi-gigabit transceivers, and high I/O count to implement packet processing, framer, and forward-error-correction functions. The industrial temperature grade meets NEBS-compliant central-office deployments. With 255K LEs, a single device handles full line-card processing for 10G/40G interfaces, while Quartus II IP cores (CPRI, OBSAI, Ethernet MAC) accelerate time-to-market for telecom OEMs.
推薦
Military and Aerospace Systems
Military and aerospace programs qualify the EP3SE260F1152I4LN for radar, electronic warfare, and secure communications where its industrial temperature range, high density, and proven long-term Intel FPGA supply chain reduce program risk. The 65 nm radiation-tolerant design approach and established Quartus II IP catalog for military protocols (MIL-STD-1553, SpaceWire) make it suitable for upgrades of legacy Stratix II-based systems. The FCBGA-1152 package supports high-density parallel sensor interfaces.
推薦
Medical Imaging Pipelines
CT, MRI, and ultrasound imaging pipelines use the EP3SE260F1152I4LN's 255K LEs and 768 DSP blocks for real-time image reconstruction, beamforming, and noise reduction. The 16.6 Mbit embedded memory holds line buffers and lookup tables for backprojection, while the 744 I/Os accept parallel LVDS data from high-speed ADCs. Industrial temperature rating supports continuous operation in clinical environments, and IEC 62304 / FDA-qualified development flows are supported via Quartus II medical IP libraries.
推薦
High-Frequency Trading Acceleration
High-frequency trading platforms deploy the EP3SE260F1152I4LN for sub-microsecond order-book parsing, market-data decoding, and risk-check acceleration. The 717 MHz fabric and deterministic timing closure minimize jitter in nanosecond-critical paths. The 12 multi-gigabit transceivers aggregate market-data feeds at 10G+ line rates, while the 744 I/Os connect to low-latency Ethernet PHYs. The FCBGA-1152 package with controlled-impedance substrate supports signal-integrity-critical layouts.
推薦
推薦產品摘要
工程參考資料，適用於 EP3SE260F1152I4LN — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SE260F1152I4L | EP3SE260F1152I4 | EP3SE260F1152I3N | EP3SE260F1152C4N | EP3SE260F1152C4LN | EP3SE110F1152I4N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FCBGA-1152 (1517-ball, 35x35 mm) | FCBGA-1152 - same | FCBGA-1152 - same | FCBGA-1152 - same | FCBGA-1152 - same | FCBGA-1152 - same | FCBGA-1152 - same |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 110,000 (-57%) |
| Embedded Memory (bits) | 16,672,640 | 16,672,640 | 16,672,640 | 16,672,640 | 16,672,640 | 16,672,640 | 8,082,432 (-52%) |
| User I/Os | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Speed Grade | I4 (fastest industrial) | I4 - same | I4 - same | I3 (-12% Fmax) | C4 (commercial temp) | C4 (commercial temp) | I4 - same |
| Operating Temperature | -40 C to +100 C (Industrial) | -40 to +100 C - same | -40 to +100 C - same | -40 to +100 C - same | 0 to +85 C (Commercial) | 0 to +85 C (Commercial) | -40 to +100 C - same |
| Process Node | 65 nm CMOS | 65 nm - same | 65 nm - same | 65 nm - same | 65 nm - same | 65 nm - same | 65 nm - same |
主要差異化特點
- Highest-density Stratix III E member with 255K LEs (對比EP3SE110F1152I4N)
- Fastest speed grade (I4) for industrial temperature (對比EP3SE260F1152I3N)
- Industrial temperature range with locked pinout (對比EP3SE260F1152C4N)
設計說明
Estimated: At 717 MHz fabric operation with high toggle rates, the EP3SE260F1152I4LN can dissipate 10-15 W. The FCBGA-1152 package has theta_JA in the 12-15 C/W range (with proper PCB thermal via array), implying a junction temperature rise of 120-225 C above ambient without forced cooling. A heatsink with thermal interface material or 200-300 LFM airflow is required for sustained operation at maximum frequency in industrial temperature environments.
The 1517-ball FCBGA-1152 at 0.8 mm ball pitch requires a 12-layer PCB stack-up with microvia technology for signal breakout. Use a 4-2-4 or 5-2-5 layer arrangement with dedicated ground/power planes directly beneath the BGA. According to Altera Stratix III board design guidelines, escape routing should use dog-bone fanout with vias on 1.0 mm pitch; a thermal via array of 0.3 mm vias on 1.0 mm pitch under the BGA is mandatory for heat dissipation.
The EP3SE260F1152I4LN requires multiple power rails: 0.9 V core (up to 15 A transient), 1.1 V PLL analog, 2.5 V auxiliary, plus selectable I/O voltages (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V). Use a sequencer IC to enforce core-before-IO power-up per Stratix III power sequencing requirements. Decoupling requires 200+ low-ESR ceramic capacitors distributed across the BGA footprint, with bulk capacitance sized for 10x transient current requirements.
For 717 MHz fabric and multi-gigabit transceiver operation, controlled-impedance routing (50 ohm single-ended, 100 ohm differential) is mandatory. According to Altera Stratix III transceiver guidelines, use 8-12 mil stripline for high-speed signals with reference planes on adjacent layers. Length-matching tolerance should be within 25 mil for LVDS pairs and 5 mil for transceiver channels. Series AC-coupling capacitors are required at transceiver outputs.
合規資訊
RoHS compliant per Altera/Intel product page. AEC-Q100 not applicable (FPGA is not an automotive-qualified discrete). Lead-free (Pb-free) packaging confirmed. Halogen-free status [DATA_NEEDED: halogen-free status].
