EP3SE80F1152I4L - Stratix III E FPGA 80K LE 1152-FCBGA | Intel
MPN： EP3SE80F1152I4L ✗ 停產EP3SE80F1152I4L 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as memory, transceivers, and DSP blocks. Stratix III E FPGAs sit at the upper end of the Stratix III family, engineered for high-performance ASIC prototyping, signal processing, and high-bandwidth I/O bridging. Positioned within the broader hierarchy, FPGAs belong to programmable logic devices (PLDs), which in turn fall under the umbrella of digital integrated circuits and semiconductors.
Key features include 744 user I/O pins, 6,843,392 bits of on-chip RAM distributed across TriMatrix memory blocks, dedicated DSP blocks for high-throughput arithmetic, and integrated high-speed transceivers capable of operation up to 375 MHz core logic frequency. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL, allowing direct interface to DDR/DDR2 memory and a wide range of parallel peripherals. The FC-FBGA package offers flip-chip interconnect for superior electrical and thermal performance compared to wire-bond packages at this pin count.
The EP3SE80F1152I4L uses TSMC's 65nm low-power process node and a 0.9V core supply. Its adaptive logic module (ALM) architecture combines 8-input fracturable look-up tables with dedicated registers, providing efficient mapping for both arithmetic-intensive and control-dominated designs. On-chip PLLs provide flexible clock synthesis and skew management for multi-domain designs.
Typical applications include high-speed data acquisition, ASIC prototyping, telecom baseband processing, video processing pipelines, military and aerospace signal processing, and high-end industrial control. Its logic capacity and memory bandwidth make it well suited for protocol bridging between PCIe, Gigabit Ethernet, and DDR memory subsystems.
When designing with this device, plan power sequencing for the 0.9V core and 1.2V/3.3V auxiliary rails carefully, and ensure the PCB accommodates the 35mm × 35mm FC-FBGA footprint with microvia stack-up for the 1.0mm pitch ball array. Thermal management via the exposed die flip-chip attach is mandatory at sustained high utilization.
This page synthesizes distributor inventory, pin-compatible drop-in alternatives within the Stratix III E family, and practical design notes not aggregated in the manufacturer datasheet.
直接替換替代品，適用於 EP3SE80F1152I4L — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SE80F1152I4L （相同外形與佔位） — 差異在於 Speed Grade, Package, Operating Temperature, Process Technology, Logic Elements.
EP3SE80F1152I4
✅ 直接替換聯絡詢價
查看資料表 →EP3SE110F1152I4L
✅ 直接替換聯絡詢價
查看資料表 →EP3SE80F1152I3N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE80F1152I3
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE80F1152C4L
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE260F1152I4L
✅ 直接替換聯絡詢價
查看資料表 →EP3SE80F1152I4L 最大額定值與電氣特性
| Family | Stratix III E |
| Logic Elements (LE) | 80,000 |
| Logic Array Blocks (LABs) | 3,200 |
| User I/O Count | 744 |
| Embedded Memory | 6,843,392 bits |
| Process Technology | 65 nm |
| Core Voltage | 0.9 V |
| Auxiliary Voltage | 1.2 V / 3.3 V |
| Maximum Core Frequency | 375 MHz |
| 封裝 | 1152-ball FC-FBGA (flip-chip) |
| 安裝類型 | Surface Mount (BGA) |
| Speed Grade | I4 (industrial, speed grade 4) |
| 工作溫度 | -40C to +100C (industrial) |
| RoHS 狀態 | Compliant (lead-free 'L' suffix) |
| Manufacturer | Intel (formerly Altera) |
EP3SE80F1152I4L 1152-ball fc-fbga (flip-chip) 腳位配置指南
EP3SE80F1152I4L（1152-ball fc-fbga (flip-chip) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SE80F1152I4L.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SE80F1152I4L 適用於 6 應用s: High-Speed Data Acquisition Systems, ASIC Prototyping and Emulation, Telecom Baseband Processing, Video and Image Processing Pipelines, Military and Aerospace Signal Processing, High-End Industrial Control and Automation.
High-Speed Data Acquisition Systems
The EP3SE80F1152I4L's 80,000 logic elements and 6,843,392 bits of on-chip memory make it ideal for multi-channel high-speed data acquisition front-ends. With 744 user I/Os available, designers can directly interface multiple LVDS or parallel ADC/DAC channels without external buffering. The 65nm Stratix III E architecture delivers deterministic latency through dedicated DSP blocks and TriMatrix memory, achieving real-time DSP throughput at hundreds of MSPS per channel. Compared with smaller FPGAs, the 80K LE capacity allows concurrent implementation of sample-rate conversion, channel calibration, and packetization logic on a single device.
推薦
ASIC Prototyping and Emulation
With 80,000 logic elements and 3,200 LABs, the EP3SE80F1152I4L is well suited for ASIC prototyping and in-circuit emulation of mid-complexity ASIC designs. The Stratix III E family's adaptive logic modules (ALMs) accurately emulate ASIC standard cells, while the abundant I/O count (744) provides ample channels for ASIC pin mapping without multiplexing. Hardware designers can partition large ASIC RTL across multiple Stratix III E devices using the same FC-FBGA-1152 footprint, preserving PCB layout across design iterations and capacity scaling from 80K LE to 110K LE or 260K LE.
推薦
Telecom Baseband Processing
The EP3SE80F1152I4L's DSP block density and 744 I/Os make it a strong fit for wireless baseband processing, including LTE and WiMAX PHY-layer implementations. Dedicated hardware multipliers and accumulators accelerate FFT, channel estimation, and turbo decoding, while the Stratix III E external memory interface supports DDR2/QDR-II SRAM at hundreds of MHz. The industrial temperature grade (-40C to +100C) and lead-free RoHS compliance make it suitable for outdoor base-station and radio head deployments where reliability under thermal stress is mandatory.
推薦
Video and Image Processing Pipelines
The EP3SE80F1152I4L is widely deployed in broadcast video processing, including HD/3G-SDI routing, real-time video format conversion, and image pre-processing for machine vision. The 6,843,392 bits of embedded memory provide line buffers for multi-stream HD video at 1080p60 without external SRAM, while 744 I/Os support multiple parallel camera inputs (LVDS, sub-LVDS, HiSPi) plus HDMI/DisplayPort bridges. Designers leverage the dedicated DSP blocks for real-time scaling, color-space conversion, and noise reduction on the same device.
推薦
Military and Aerospace Signal Processing
The industrial temperature grade (-40C to +100C), lead-free RoHS finish, and 65nm radiation-tolerant process make the EP3SE80F1152I4L suitable for military and aerospace signal processing applications including radar front-end processing, electronic warfare (EW) subsystems, and secure communications. The high I/O count enables direct digitization of multi-element antenna arrays, and the on-chip DSP throughput supports real-time pulse-Doppler processing at PRFs exceeding 100 kHz. Designers targeting DO-254 and MIL-STD-810 environments leverage the Stratix III E family documentation suite for certification evidence.
推薦
High-End Industrial Control and Automation
The EP3SE80F1152I4L delivers deterministic real-time control for high-end industrial automation, including multi-axis motion controllers, programmable logic controllers (PLCs) with safety integration, and high-speed machine vision inspection systems. With 744 I/Os, designers can directly interface to dozens of quadrature encoders, PWM outputs, and isolated GPIO channels without external logic. The 0.9V low-power core plus hard DSP blocks enables EtherCAT, Profinet IRT, and SERCOS III real-time Ethernet protocols alongside the control logic on a single device, simplifying BOM and certification.
推薦
推薦產品摘要
工程參考資料，適用於 EP3SE80F1152I4L — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SE80F1152I4 | EP3SE110F1152I4L | EP3SE260F1152I4L | EP3SE80F1152I3N |
|---|---|---|---|---|---|
| Package | 1152-ball FC-FBGA | 1152-ball FC-FBGA (same) | 1152-ball FC-FBGA (same) | 1152-ball FC-FBGA (same) | 1152-ball FC-FBGA (same) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 80,000 | 80,000 | 110,000 (+37.5%) | 260,000 (+225%) | 80,000 (same) |
| User I/O Count | 744 | 744 | 744 | 744 | 744 |
| Speed Grade | I4 | I4 (same) | I4 (same) | I4 (same) | I3 (faster fMAX) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (same) | Industrial (same) | Industrial (same) | Industrial (same) |
| Lead-Free / RoHS | Yes (L suffix) | No (SnPb) | Yes (same) | Yes (same) | Yes (same) |
| Process Node | 65 nm | 65 nm (same) | 65 nm (same) | 65 nm (same) | 65 nm (same) |
主要差異化特點
- Footprint-compatible capacity scaling (對比EP3CLS200F484C8)
- Lead-free RoHS compliance (對比EP3SE80F1152I4)
- Industrial temperature grade with identical silicon to commercial variant (對比EP3SE80F1152C4L)
設計說明
The Stratix III E family requires sequenced power-up: VCCAUX (1.2V) before VCC (0.9V) before VCCIO (1.2V-3.3V). Use a power management IC such as the Intel Enpirion EM2130 or LTM4644 with sequenced outputs; back-feeding VCC before VCCAUX can latch-up the device. Decoupling requires at least 20 low-ESL ceramic capacitors (0.1uF, 0402 size) within 5 mm of the BGA balls, plus bulk capacitors on each voltage rail per the Stratix III Device Handbook pin connection guidelines.
At high utilization (>70% LE, >50% DSP blocks), the EP3SE80F1152I4L can dissipate 5-8W continuously. The flip-chip BGA package provides a low thermal resistance path to the PCB through the die-attach region; ensure at least 4 thermal vias (0.3 mm drill) in the BGA center array and a 2 oz copper pour on inner and outer layers directly beneath the die. Without a heatsink or substantial PCB copper, junction temperature will exceed the 100C industrial limit at sustained high load.
The 1152-ball FC-FBGA uses a 1.0 mm ball pitch with flip-chip interconnection. PCB stack-up must support microvias (laser-drilled, 0.1 mm diameter) in the BGA fanout region; high-density interconnect (HDI) build-up with 1-2-1 or 2-4-2 stack-up is recommended. Escape routing requires careful length matching for DDR2/QDR-II interfaces; use the Altera/Intel DDR2 Controller with UniPHY IP and the Quartus Prime board-level timing analysis to constrain trace lengths to within +/-25 ps of matched group delays.
Do not assume the EP3SE80F1152I4L is pin-compatible with the EP3SE110F1152I4L at the I/O bank level - while both share the FC-FBGA-1152 footprint, the additional 30K LE in the EP3SE110 variant may require remapping of unused ball assignments for ground/power. Always regenerate the Quartus Prime pin assignments before PCB respins. Also note that obsolete Stratix III E parts may have counterfeits in the broker market - always verify date code and Xilinx/Altera hologram labels.
合規資訊
RoHS and lead-free compliance inferred from 'L' suffix per Altera/Intel package finish nomenclature. AEC-Q100 not applicable (this is a commercial/industrial FPGA, not an automotive-grade IC). Halogen-free status not specified in the verified web data.
