EP3SL110F780I4N - Stratix III L FPGA, 107.5K LE, 780-FCBGA | Intel
MPN： EP3SL110F780I4N ✗ 停產EP3SL110F780I4N 概覽
An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable routing, and dedicated silicon resources such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs occupy a tier in the programmable logic hierarchy: programmable logic > FPGA > SRAM-based FPGA > high-density FPGA. They bridge the gap between general-purpose CPUs (sequential, software-defined) and ASICs (fixed-function, mass-produced), offering hardware-level parallelism with re-programmability. The Stratix III family specifically targets high-end applications requiring both logic density and high-speed serial connectivity.
Key features of the EP3SL110F780I4N include support for up to 488 user I/Os, embedded transceiver capability for high-speed serial protocols, on-chip memory of nearly 5 Mbits, and up to 384 multipliers (18x18) for DSP workloads. The 780-pin FCBGA package provides high interconnect density required for routing hundreds of I/Os while maintaining a manageable footprint suitable for multi-layer PCB designs. Power management is enhanced through Stratix III's programmable power technology, which reduces dynamic power versus prior generations.
Typical uses include high-speed digital signal processing, telecommunications infrastructure, video processing and broadcast equipment, high-performance ASIC prototyping, and aerospace/defense systems. The industrial temperature grade makes it suitable for outdoor or industrial-control applications where commercial-grade parts would fail. Its large logic capacity also enables integration of entire subsystems (CPU soft-cores, memory controllers, protocol bridges) into a single device, reducing BOM count and board complexity.
When designing with the EP3SL110F780I4N, observe Stratix III power-up and configuration scheme requirements (typically using an external EPCS or enhanced configuration device, or JTAG). Maintain multi-layer PCB stack-up with continuous power and ground planes beneath the FCBGA to manage simultaneous-switching noise and to provide low thermal resistance for the top-side thermal pad. Always verify pin assignments against the latest Intel Quartus II pinout files before committing to layout.
This page synthesizes distributor availability, Stratix III family member drop-in alternatives, and practical design notes not consolidated in any single manufacturer datasheet or catalog page.
直接替換替代品，適用於 EP3SL110F780I4N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SL110F780I4N （相同外形與佔位） — 差異在於 RoHS Status, Family, Logic Elements, Package, Process Technology.
EP3SL110F780I4L
✅ 直接替換📋 參考替代品（不在目錄中）
EP3SL110F780I3N
✅ 直接替換📋 參考替代品（不在目錄中）
EP3SL150F780C4N
✅ 直接替換📋 參考替代品（不在目錄中）
EP3SL150F780C4LN
✅ 直接替換📋 參考替代品（不在目錄中）
EP3SE110F780I3
✅ 直接替換聯絡詢價
查看資料表 →EP3SL110F780I4N 最大額定值與電氣特性
| Series | Stratix III L |
| Logic Elements (LE) | 107500 |
| Logic Array Blocks (LAB) | 4300 |
| Total RAM Bits | 4992000 |
| User I/O Count | 488 |
| Number of Terminals | 780 |
| 封裝 | 780-BBGA, FCBGA |
| Package Family | FC-FBGA |
| Terminal Form | BALL |
| Package Code | BGA |
| Package Shape | SQUARE |
| 工作溫度 | -40C to +100C (industrial) |
| 安裝類型 | Surface Mount |
| Process Technology | 65 nm CMOS |
| Lead Free | Yes (per "N" suffix) |
| RoHS 狀態 | Compliant |
EP3SL110F780I4N square 腳位配置指南
EP3SL110F780I4N（square 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SL110F780I4N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SL110F780I4N 適用於 6 應用s: Telecommunications Infrastructure, High-Performance Digital Signal Processing, Video Processing and Broadcast Equipment, ASIC Prototyping and Emulation, Industrial Control and Factory Automation, Aerospace and Defense Signal Processing.
Telecommunications Infrastructure
The EP3SL110F780I4N fits telecom-infrastructure baseband and fronthaul designs where 107,500 LEs and 488 user I/Os handle multi-channel PHY bridging, custom packet processing, and CPRI/OBSAI fronthaul glue logic simultaneously. Its industrial -40C to +100C operating range (suffix "I4") tolerates outdoor cabinet and base-station thermal environments without derating. The 4,992 Kbits of embedded RAM plus on-chip DSP blocks accelerate FEC, scrambling and encryption pipelines in 4G/5G small-cell and backhaul equipment. Compared to a fixed ASIC, the FPGA gives operators a re-programmable platform to track evolving standards (e.g. eCPRI, O-RAN) without respinning the board, while the 780-ball FCBGA keeps the layout manageable on standard 12-layer telecom PCBs.
推薦
High-Performance Digital Signal Processing
The EP3SL110F780I4N's combination of 107,500 LEs, on-chip 18x18 multipliers and 4,992 Kbits of block RAM makes it well suited for radar, sonar, software-defined radio (SDR) and medical imaging DSP workloads that demand hundreds of GMACs. The 780-ball FCBGA provides sufficient I/O bandwidth for multi-channel ADC/DAC interfaces (LVDS, JESD204B-style parallel buses) while keeping the die thermally manageable with a proper top-side thermal pad and continuous inner ground/power planes. Industrial temperature grade supports outdoor and field-deployed signal-intelligence and condition-monitoring systems. Designers can implement FFTs, FIR filters, beamforming weights and matrix decompositions directly in fabric, avoiding expensive DSP clusters.
推薦
Video Processing and Broadcast Equipment
The EP3SL110F780I4N's 488 user I/Os provide ample headroom for multi-stream video interfaces (TTL/CMOS parallel video, LVDS, and SDI bridges) plus on-chip memory to buffer full-HD frames. In broadcast switchers, multi-viewers and contribution encoders, the 107.5K LEs handle chroma-keying, scaling, de-interlacing and overlay composition in real time without external frame buffers. The 780-ball FCBGA supports the high pin count required for parallel video buses while keeping the PCB under standard broadcast-equipment form factors. Industrial temperature rating ensures reliability in unconditioned control rooms and outside-broadcast trucks where temperature swings are common.
推薦
ASIC Prototyping and Emulation
With 107,500 LEs and abundant block-RAM, the EP3SL110F780I4N serves as a building block in multi-FPGGA ASIC prototyping and emulation platforms. Designers map RTL partitions into the FPGA, exercise the design under realistic stimuli, and de-risk tape-out before committing to silicon. The 488 user I/Os are split between inter-FPGA traces, target-ASIC I/O replication, and speed-monitoring probes. Stratix III's high-speed serial transceivers (where enabled) also support chip-to-chip emulators running multi-Gbps traffic. Industrial temperature rating supports the long burn-in sessions used for SoC verification.
推薦
Industrial Control and Factory Automation
The EP3SL110F780I4N's industrial -40C to +100C operating range (suffix "I4") and high logic density fit programmable logic controllers (PLCs), motion controllers and machine-vision systems running in factory floors. Its 488 I/Os interface directly to encoder counters, ADC front-ends, galvanically-isolated digital I/O and real-time EtherCAT/PROFINET MACs. On-chip block RAM holds motion trajectories and look-up tables, and on-chip DSP blocks accelerate high-speed closed-loop control maths. The 65 nm Stratix III process balances performance and power for always-on industrial equipment that must run 24/7 in elevated ambient temperatures.
推薦
Aerospace and Defense Signal Processing
Defense and aerospace programs traditionally rely on the EP3SL110F780I4N family for radar front-ends, electronic-warfare subsystems and secure communications where high logic density, fast time-to-flight and ruggedized temperature ranges are required. The industrial -40C to +100C grade survives unpressurized avionics bays and military vehicle electronics, while 107,500 LEs implement multi-channel digital receivers, adaptive beamforming and crypto primitives. The 780-ball FCBGA allows tight PCB integration with companion high-speed ADCs/DACs and DAC81416-class analog. Long-term defense programs also benefit from Stratix III's mature Quartus II tool flow, which is widely supported across defense integrator supply chains.
推薦
推薦產品摘要
工程參考資料，適用於 EP3SL110F780I4N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SL110F780I4L | EP3SL110F780I3N | EP3SL150F780C4N | EP3SL150F780C4LN | EP3SE110F780I3 |
|---|---|---|---|---|---|---|
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same |
| Brand | Intel (formerly Altera) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) |
| Series | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E (enhanced) |
| Logic Elements | 107500 | 107500 (identical) | 107500 (identical) | ~150000 (+40%) | ~150000 (+40%) | ~110000 (~+2%) |
| Process / Core Voltage | 65 nm / 1.1 V core | 65 nm / 1.1 V (identical) | 65 nm / 1.1 V (identical) | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V (Stratix III E variant) |
| Temperature Grade | Industrial -40C to +100C | Industrial (per "I4" suffix) | Industrial (per "I3" suffix) | Commercial (per "C4" suffix) | Commercial (per "C4" suffix) | Industrial (per "I3" suffix) |
主要差異化特點
- Identical 107.5K LE logic capacity on the same 780-ball FCBGA footprint as EP3SL110F780I4L with no PCB rework required (對比EP3SL110F780I4L)
- Higher logic capacity (~150K LEs vs 107.5K) on the same 780-ball FCBGA footprint (對比EP3SL150F780C4N)
- Low-power Stratix III L architecture versus enhanced Stratix III E variant (對比EP3SE110F780I3)
設計說明
Estimated: the EP3SL110F780I4N draws roughly 1-3 W quiescent and may exceed 10 W under full logic utilization at 500 MHz core. Provide at least four dedicated 1.1 V core supply planes and dedicated 2.5 V/3.0 V auxiliary planes. Decouple each supply pin with 0.1 uF + 10 uF ceramic capacitors placed within 100 mils of the pin, and add bulk polymer or tantalum capacitors at the regulator outputs. Use Stratix III's programmable power technology (via Quartus II PowerPlay) to lower dynamic power on non-critical logic paths.
Use a high-layer-count board (>=12 layers) with continuous solid ground and power planes directly beneath the 780-ball FCBGA to control simultaneous-switching noise and provide a low-impedance return path for the high-speed transceivers. Maintain 50 ohm single-ended (100 ohm differential) controlled impedance for high-speed serial and parallel memory buses. Escape the BGA with via-in-pad or microvia technology to break out all signals on standard 4-mil trace/space rules; failing to do so will force larger BGA fanout that violates the package keep-out zones.
Common pitfalls: (1) failing to follow the Intel-defined power-up and power-down sequencing of Stratix III, which can cause permanent device damage or configuration CRC errors; (2) using the wrong configuration mode - EP3SL110F780I4N typically uses an EPCS or enhanced configuration device plus JTAG; (3) ignoring MSL3 moisture-sensitivity requirements for the FCBGA, leading to pop-corning during reflow; (4) overlooking that the "I4" industrial grade is -40C to +100C junction, not ambient - always refer to Stratix III Device Handbook for derating curves.
Estimated: the 780-ball FCBGA exposes a top-side thermal pad that must be soldered to a copper pad with thermal vias to the inner ground plane. With 5-10 W dissipation, a 2 oz copper inner plane with 0.5 mm thermal via array (0.3 mm pitch) is sufficient to keep junction temperature below 100C in still air. For full-utilization designs (>15 W) consider a heatsink attached with thermal interface material; always verify junction temperature via the on-die temperature sensing diode in Quartus II.
合規資訊
RoHS compliance inferred from "N" lead-free suffix designator per Intel/Altera legacy nomenclature. REACH and conflict-mineral compliance per Intel corporate policy; please verify on request. AEC-Q100 is not applicable - this is a high-end FPGA, not an automotive-qualified IC.