EP3SL110F780I4N - Stratix III L FPGA, 107.5K LE, 780-FCBGA | Intel
N.º da peça: EP3SL110F780I4N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1450 | $1.450,00 |
| 10 | $1380 | $13.800,00 |
| 100 | $1295 | $129.500,00 |
| 500 | $1210 | $605.000,00 |
| 1.000 | $1145 | $1.145.000,00 |
EP3SL110F780I4N Visão geral
An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable routing, and dedicated silicon resources such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs occupy a tier in the programmable logic hierarchy: programmable logic > FPGA > SRAM-based FPGA > high-density FPGA. They bridge the gap between general-purpose CPUs (sequential, software-defined) and ASICs (fixed-function, mass-produced), offering hardware-level parallelism with re-programmability. The Stratix III family specifically targets high-end applications requiring both logic density and high-speed serial connectivity.
Key features of the EP3SL110F780I4N include support for up to 488 user I/Os, embedded transceiver capability for high-speed serial protocols, on-chip memory of nearly 5 Mbits, and up to 384 multipliers (18x18) for DSP workloads. The 780-pin FCBGA package provides high interconnect density required for routing hundreds of I/Os while maintaining a manageable footprint suitable for multi-layer PCB designs. Power management is enhanced through Stratix III's programmable power technology, which reduces dynamic power versus prior generations.
Typical uses include high-speed digital signal processing, telecommunications infrastructure, video processing and broadcast equipment, high-performance ASIC prototyping, and aerospace/defense systems. The industrial temperature grade makes it suitable for outdoor or industrial-control applications where commercial-grade parts would fail. Its large logic capacity also enables integration of entire subsystems (CPU soft-cores, memory controllers, protocol bridges) into a single device, reducing BOM count and board complexity.
When designing with the EP3SL110F780I4N, observe Stratix III power-up and configuration scheme requirements (typically using an external EPCS or enhanced configuration device, or JTAG). Maintain multi-layer PCB stack-up with continuous power and ground planes beneath the FCBGA to manage simultaneous-switching noise and to provide low thermal resistance for the top-side thermal pad. Always verify pin assignments against the latest Intel Quartus II pinout files before committing to layout.
This page synthesizes distributor availability, Stratix III family member drop-in alternatives, and practical design notes not consolidated in any single manufacturer datasheet or catalog page.
Alternativas drop-in para EP3SL110F780I4N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3SL110F780I4N (mesmo formato e footprint) — diferindo em RoHS Status, Family, Logic Elements, Package, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3SL110F780I4L
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP3SL110F780I3N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP3SL150F780C4N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP3SL150F780C4LN
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP3SE110F780I3
✅ Drop-In✓ Em estoque
$1395 / unidade
Ver ficha técnica →EP3SL110F780I4N Classificações máximas e características elétricas
| Series | Stratix III L |
| Logic Elements (LE) | 107500 |
| Logic Array Blocks (LAB) | 4300 |
| Total RAM Bits | 4992000 |
| User I/O Count | 488 |
| Number of Terminals | 780 |
| Encapsulamento | 780-BBGA, FCBGA |
| Package Family | FC-FBGA |
| Terminal Form | BALL |
| Package Code | BGA |
| Package Shape | SQUARE |
| Temperatura de operação | -40C to +100C (industrial) |
| Tipo de montagem | Surface Mount |
| Process Technology | 65 nm CMOS |
| Lead Free | Yes (per "N" suffix) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do EP3SL110F780I4N square
Configuração de pinos para EP3SL110F780I4N (pacote square). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP3SL110F780I4N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP3SL110F780I4N é adequado para 6 aplicaçãos: Telecommunications Infrastructure, High-Performance Digital Signal Processing, Video Processing and Broadcast Equipment, ASIC Prototyping and Emulation, Industrial Control and Factory Automation, Aerospace and Defense Signal Processing.
Telecommunications Infrastructure
The EP3SL110F780I4N fits telecom-infrastructure baseband and fronthaul designs where 107,500 LEs and 488 user I/Os handle multi-channel PHY bridging, custom packet processing, and CPRI/OBSAI fronthaul glue logic simultaneously. Its industrial -40C to +100C operating range (suffix "I4") tolerates outdoor cabinet and base-station thermal environments without derating. The 4,992 Kbits of embedded RAM plus on-chip DSP blocks accelerate FEC, scrambling and encryption pipelines in 4G/5G small-cell and backhaul equipment. Compared to a fixed ASIC, the FPGA gives operators a re-programmable platform to track evolving standards (e.g. eCPRI, O-RAN) without respinning the board, while the 780-ball FCBGA keeps the layout manageable on standard 12-layer telecom PCBs.
Recomendado
High-Performance Digital Signal Processing
The EP3SL110F780I4N's combination of 107,500 LEs, on-chip 18x18 multipliers and 4,992 Kbits of block RAM makes it well suited for radar, sonar, software-defined radio (SDR) and medical imaging DSP workloads that demand hundreds of GMACs. The 780-ball FCBGA provides sufficient I/O bandwidth for multi-channel ADC/DAC interfaces (LVDS, JESD204B-style parallel buses) while keeping the die thermally manageable with a proper top-side thermal pad and continuous inner ground/power planes. Industrial temperature grade supports outdoor and field-deployed signal-intelligence and condition-monitoring systems. Designers can implement FFTs, FIR filters, beamforming weights and matrix decompositions directly in fabric, avoiding expensive DSP clusters.
Recomendado
Video Processing and Broadcast Equipment
The EP3SL110F780I4N's 488 user I/Os provide ample headroom for multi-stream video interfaces (TTL/CMOS parallel video, LVDS, and SDI bridges) plus on-chip memory to buffer full-HD frames. In broadcast switchers, multi-viewers and contribution encoders, the 107.5K LEs handle chroma-keying, scaling, de-interlacing and overlay composition in real time without external frame buffers. The 780-ball FCBGA supports the high pin count required for parallel video buses while keeping the PCB under standard broadcast-equipment form factors. Industrial temperature rating ensures reliability in unconditioned control rooms and outside-broadcast trucks where temperature swings are common.
Recomendado
ASIC Prototyping and Emulation
With 107,500 LEs and abundant block-RAM, the EP3SL110F780I4N serves as a building block in multi-FPGGA ASIC prototyping and emulation platforms. Designers map RTL partitions into the FPGA, exercise the design under realistic stimuli, and de-risk tape-out before committing to silicon. The 488 user I/Os are split between inter-FPGA traces, target-ASIC I/O replication, and speed-monitoring probes. Stratix III's high-speed serial transceivers (where enabled) also support chip-to-chip emulators running multi-Gbps traffic. Industrial temperature rating supports the long burn-in sessions used for SoC verification.
Recomendado
Industrial Control and Factory Automation
The EP3SL110F780I4N's industrial -40C to +100C operating range (suffix "I4") and high logic density fit programmable logic controllers (PLCs), motion controllers and machine-vision systems running in factory floors. Its 488 I/Os interface directly to encoder counters, ADC front-ends, galvanically-isolated digital I/O and real-time EtherCAT/PROFINET MACs. On-chip block RAM holds motion trajectories and look-up tables, and on-chip DSP blocks accelerate high-speed closed-loop control maths. The 65 nm Stratix III process balances performance and power for always-on industrial equipment that must run 24/7 in elevated ambient temperatures.
Recomendado
Aerospace and Defense Signal Processing
Defense and aerospace programs traditionally rely on the EP3SL110F780I4N family for radar front-ends, electronic-warfare subsystems and secure communications where high logic density, fast time-to-flight and ruggedized temperature ranges are required. The industrial -40C to +100C grade survives unpressurized avionics bays and military vehicle electronics, while 107,500 LEs implement multi-channel digital receivers, adaptive beamforming and crypto primitives. The 780-ball FCBGA allows tight PCB integration with companion high-speed ADCs/DACs and DAC81416-class analog. Long-term defense programs also benefit from Stratix III's mature Quartus II tool flow, which is widely supported across defense integrator supply chains.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3SL110F780I4N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3SL110F780I4L | EP3SL110F780I3N | EP3SL150F780C4N | EP3SL150F780C4LN | EP3SE110F780I3 |
|---|---|---|---|---|---|---|
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same |
| Brand | Intel (formerly Altera) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) |
| Series | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E (enhanced) |
| Logic Elements | 107500 | 107500 (identical) | 107500 (identical) | ~150000 (+40%) | ~150000 (+40%) | ~110000 (~+2%) |
| Process / Core Voltage | 65 nm / 1.1 V core | 65 nm / 1.1 V (identical) | 65 nm / 1.1 V (identical) | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V (Stratix III E variant) |
| Temperature Grade | Industrial -40C to +100C | Industrial (per "I4" suffix) | Industrial (per "I3" suffix) | Commercial (per "C4" suffix) | Commercial (per "C4" suffix) | Industrial (per "I3" suffix) |
Principais diferenciais
- Identical 107.5K LE logic capacity on the same 780-ball FCBGA footprint as EP3SL110F780I4L with no PCB rework required (vs EP3SL110F780I4L)
- Higher logic capacity (~150K LEs vs 107.5K) on the same 780-ball FCBGA footprint (vs EP3SL150F780C4N)
- Low-power Stratix III L architecture versus enhanced Stratix III E variant (vs EP3SE110F780I3)
Notas de projeto
Estimated: the EP3SL110F780I4N draws roughly 1-3 W quiescent and may exceed 10 W under full logic utilization at 500 MHz core. Provide at least four dedicated 1.1 V core supply planes and dedicated 2.5 V/3.0 V auxiliary planes. Decouple each supply pin with 0.1 uF + 10 uF ceramic capacitors placed within 100 mils of the pin, and add bulk polymer or tantalum capacitors at the regulator outputs. Use Stratix III's programmable power technology (via Quartus II PowerPlay) to lower dynamic power on non-critical logic paths.
Use a high-layer-count board (>=12 layers) with continuous solid ground and power planes directly beneath the 780-ball FCBGA to control simultaneous-switching noise and provide a low-impedance return path for the high-speed transceivers. Maintain 50 ohm single-ended (100 ohm differential) controlled impedance for high-speed serial and parallel memory buses. Escape the BGA with via-in-pad or microvia technology to break out all signals on standard 4-mil trace/space rules; failing to do so will force larger BGA fanout that violates the package keep-out zones.
Common pitfalls: (1) failing to follow the Intel-defined power-up and power-down sequencing of Stratix III, which can cause permanent device damage or configuration CRC errors; (2) using the wrong configuration mode - EP3SL110F780I4N typically uses an EPCS or enhanced configuration device plus JTAG; (3) ignoring MSL3 moisture-sensitivity requirements for the FCBGA, leading to pop-corning during reflow; (4) overlooking that the "I4" industrial grade is -40C to +100C junction, not ambient - always refer to Stratix III Device Handbook for derating curves.
Estimated: the 780-ball FCBGA exposes a top-side thermal pad that must be soldered to a copper pad with thermal vias to the inner ground plane. With 5-10 W dissipation, a 2 oz copper inner plane with 0.5 mm thermal via array (0.3 mm pitch) is sufficient to keep junction temperature below 100C in still air. For full-utilization designs (>15 W) consider a heatsink attached with thermal interface material; always verify junction temperature via the on-die temperature sensing diode in Quartus II.
Informações de conformidade
RoHS compliance inferred from "N" lead-free suffix designator per Intel/Altera legacy nomenclature. REACH and conflict-mineral compliance per Intel corporate policy; please verify on request. AEC-Q100 is not applicable - this is a high-end FPGA, not an automotive-qualified IC.