EP3SE110F780I3 - 107.5K LE Stratix III E FPGA, 488 I/O | Intel
MPN： EP3SE110F780I3 ✓ 啟用中EP3SE110F780I3 概覽
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy the top tier of the digital design hierarchy between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism and reconfigurability for prototyping, low-volume production, and time-to-market-critical designs. The Stratix III E family is positioned in the high-performance segment, originally engineered for ASIC prototyping, high-throughput signal processing, and high-bandwidth telecommunications infrastructure.
Key features of the EP3SE110F780I3 include 107500 logic elements, 4 partitions of memory totaling 8936448 bits, a maximum operating frequency of 500 MHz, 488 dedicated user I/Os, and integrated high-speed serial transceiver capability. The device is housed in a 780-ball fine-pitch FC-FBGA (Fine-pitch Chip-scale Ball Grid Array, also called FineLine BGA) package and supports vertical migration within the same package footprint to other Stratix III densities.
Architecturally, the Stratix III E device combines adaptive logic modules (ALMs), TriMatrix embedded memory blocks (MLAB, M9K, M144K), DSP blocks, and up to 12.5 Gbps transceivers (model-dependent). It uses a 1.1 V core supply on a 65 nm process, giving the EP3SE110F780I3 a favorable logic-element-per-watt ratio for its era. Configuration is supported via JTAG, Active Serial, Active Parallel, Fast Passive Parallel, and Passive Serial modes through the dedicated configuration pins.
Typical applications include ASIC prototyping, high-performance DSP pipelines, broadcast video processing, high-speed serial backplane interfacing, military and aerospace signal processing, and high-end test and measurement equipment. When designing with the EP3SE110F780I3, ensure the Quartus II design tool version supports this specific device ID and observe the recommended power sequencing order across VCC, VCCPD, VCCPGM, and transceiver supply rails.
直接替換替代品，適用於 EP3SE110F780I3 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SE110F780I3 （相同外形與佔位） — 差異在於 Package, Operating Temperature, Speed Grade, Process Technology, RoHS Status.
EP3SE110F780I2N
✅ 直接替換聯絡詢價
查看資料表 →EP3SE110F780C4N
✅ 直接替換聯絡詢價
查看資料表 →EP3SE110F780C3N
✅ 直接替換聯絡詢價
查看資料表 →EP3SE110F780C3
✅ 直接替換聯絡詢價
查看資料表 →EP3SL110F780I3N
✅ 直接替換📋 參考替代品（不在目錄中）
EP3CLS200F780I7N
✅ 直接替換聯絡詢價
查看資料表 →EP3SE110F780I3 最大額定值與電氣特性
| Family | Stratix III E |
| Logic Elements | 107500 |
| Number of LABs/CLBs | 4300 |
| Number of Logic Elements/Cells | 107500 |
| Total RAM Bits | 8936448 |
| Number of I/O | 488 |
| Voltage - Supply | 1.1 V core |
| Process Technology | 65 nm |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40C to +100C (industrial) |
| 封裝 / 外殼 | 780-BBGA, FCBGA (FineLine BGA) |
| Supplier Device Package | 780-FBGA |
| RoHS 狀態 | unknown |
| 濕度敏感等級 (MSL) | unknown |
| Grade | Industrial |
EP3SE110F780I3 780-fbga 腳位配置指南
EP3SE110F780I3（780-fbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SE110F780I3.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SE110F780I3 適用於 6 應用s: ASIC Prototyping, High-Performance DSP Pipelines, Broadcast Video Processing, High-Speed Serial Backplane Interfaces, Military & Aerospace Signal Processing, Test & Measurement Instrumentation.
ASIC Prototyping
The EP3SE110F780I3's 107500 logic elements and 8.9 Mbits of embedded memory make it a strong fit for ASIC prototyping where engineers need to validate register-transfer level (RTL) designs before tap-out. Per Stratix III datasheet benchmarks, the device delivers multi-MHz performance on datapath-heavy ASIC blocks and supports rapid design iteration through Quartus II incremental compilation. The 488 I/O pins accommodate wide bus interfaces to the target ASIC's external memory and peripherals, and the 780-FBGA footprint provides generous escape routing for high-pin-count ASIC designs. Trade-off: the E family consumes more static power than the L variant, so a thermal budget is required for high-utilization designs.
推薦
High-Performance DSP Pipelines
The Stratix III E family's dedicated DSP blocks support 18x18 and 36x36 multipliers with high parallelism, which aligns with the EP3SE110F780I3's role in FFT, FIR, and matrix-multiply pipelines. Per the Stratix III datasheet, each DSP block can run above 300 MHz, and the device's 8.9 Mbits of TriMatrix memory aggregate bandwidth to feed multiple DSP blocks per clock. The 488 user I/Os provide ample LVDS pairs for ADC/DAC interfacing, and the 1.1 V core keeps dynamic power manageable. Engineers should budget for 65 nm leakage current at high junction temperatures and use PowerPlay early-estimation tools.
推薦
Broadcast Video Processing
Broadcast video systems such as SD/HD/3G-SDI routers, frame synchronizers, and color-space converters benefit from the EP3SE110F780I3's 107500 logic elements and 8.9 Mbits of on-chip buffering. Per Stratix III documentation, the device supports SDI PHY interfaces through dedicated LVDS-capable I/O and provides ample internal line-store memory to handle horizontal/vertical blanking intervals. The 780-FBGA package's 488 I/Os accommodate multiple SDI data streams plus GPIO for control and housekeeping. Designers should verify that the chosen speed grade (I3 vs I4) meets the pixel-clock rate of the highest-resolution stream being processed.
推薦
High-Speed Serial Backplane Interfaces
The Stratix III E family supports multi-gigabit transceivers suitable for serial backplane links such as Aurora, PCIe Gen1/Gen2, Serial RapidIO, and proprietary SERDES protocols. The EP3SE110F780I3's transceiver count and 1.1 V core combine to deliver line rates up to several Gbps per channel while sustaining signal integrity over backplane channels. The 780-FBGA package exposes enough transceiver pins for 4-12 lanes depending on channel-bonding configuration. Engineers must apply reference-clock jitter budgets and follow Intel's Stratix III transceiver PCB layout guidelines for 100-ohm differential routing.
推薦
Military & Aerospace Signal Processing
The EP3SE110F780I3 industrial temperature grade (-40C to +100C) and high logic density position it for signal-processing payloads in military and aerospace platforms such as radar front-ends, electronic warfare subsystems, and telemetry recorders. Per the Stratix III datasheet, the device's TriMatrix memory supports large windowing buffers for radar pulse compression, and its 488 I/Os accommodate LVDS connections to RF ADCs and DACs. Designers in this space typically pair the FPGA with industrial-grade SRAM, flash, and voltage regulators qualified to MIL-STD or DO-160. Long-term obsolescence management is critical because Stratix III is not a current-generation part.
推薦
Test & Measurement Instrumentation
High-end test and measurement equipment - logic analyzers, protocol testers, and arbitrary waveform generators - uses the EP3SE110F780I3's 107500 logic elements to implement deep acquisition memory, parallel stimulus generation, and protocol decoding in a single device. Per Stratix III documentation, the 8.9 Mbits of TriMatrix memory serve as deep sample buffers, while the 488 I/Os support multi-channel acquisition at rates up to LVDS-grade speeds. The 780-FBGA package offers thermal headroom for sustained full-load operation. Trade-off: design teams should plan a clear migration path to newer FPGA families since Stratix III is no longer a current-generation device.
推薦
推薦產品摘要
工程參考資料，適用於 EP3SE110F780I3 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SE110F780I2N | EP3SE110F780C4N | EP3SE110F780C3N | EP3SE110F780C3 | EP3SL110F780I3N | EP3CLS200F780I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (FineLine BGA) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Family | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III L (low power) | Cyclone III LS |
| Logic Elements | 107500 | 107500 | 107500 | 107500 | 107500 | 107500 | 198464 |
| Embedded Memory (bits) | 8936448 | 8936448 | 8936448 | 8936448 | 8936448 | 8936448 | 7304832 |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 | 429 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial | Commercial | Industrial | Industrial |
| Speed Grade | I3 | I2 (slower) | C4 (faster commercial) | C3 (commercial) | C3 (commercial) | I3 (low-power family) | I7 |
| Process / Core Voltage | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.2 V |
主要差異化特點
- Identical 780-FBGA footprint enables vertical migration across densities (對比EP3SE110F780C3N)
- Higher DSP and transceiver count than the L variant (對比EP3SL110F780I3N)
- 8.9 Mbits of embedded memory via TriMatrix architecture (對比EP3CLS200F780I7N)
- Slower speed grade enables lower dynamic power (對比EP3SE110F780C4N)
設計說明
The Stratix III E family has multiple power rails: VCC (1.1 V core), VCCPD (3.0/2.5 V pre-driver), VCCPGM (1.8/2.5/3.0 V configuration), and per-bank VCCIO. Per Intel's Stratix III device family datasheet, power sequencing must hold VCC before VCCPD to prevent I/O latch-up. Estimated: at full 107500-LE utilization with 488 LVDS pairs toggling, total power may reach 8-12 W; use a 4-layer PCB with at least 1 oz copper and a synchronous buck regulator per rail.
The 780-FBGA package has a thermal resistance (theta_JA) of approximately 15-20 C/W with 4-layer PCB and sufficient thermal vias under the package center pad, per typical Stratix III FBGA thermal data. Estimated: at 10 W total dissipation, junction temperature rise is 150-200C above ambient, requiring active airflow or a heatsink for industrial temperature operation. Use the Quartus II PowerPlay Power Analyzer tool for early thermal budgeting.
PCB layout for the 780-FBGA requires microvia technology or 0.4 mm pitch escape routing. Per Stratix III hardware design guidelines, BGA breakout should use via-in-pad with filled-and-capped vias for clean return paths, and the high-speed transceiver lanes must maintain 100-ohm differential impedance over the entire route. Decoupling capacitors must be placed within 100 mils of every VCC/VCCPD/VCCPGM ball pair.
Common Stratix III design pitfalls include (1) forgetting to configure MSEL[3:0] pins correctly for the desired configuration mode, (2) using the wrong JTAG chain ordering when multiple devices share TCK/TMS, (3) under-estimating configuration time for large bitstreams (EP3SE110 can exceed 25 Mbits, requiring Active Parallel flash for fast boot), and (4) ignoring AS/PS configuration mode strap pins at power-up. Reference the Stratix III Configuration Handbook for the complete checklist.
合規資訊
RoHS, REACH, lead-free, and halogen-free status not explicitly stated in the verified distributor data; designers should confirm compliance with the manufacturer datasheet or contact Intel/Altera sales for the specific lot.