EP3SL150F1152C4N - 142.5K LE, 744 I/O Stratix III L FPGA | Intel
MPN： EP3SL150F1152C4N ✓ 啟用中EP3SL150F1152C4N 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, DSP blocks, and embedded memory. FPGAs sit within the broader hierarchy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors, allowing designers to implement arbitrary digital hardware that can be re-programmed in the field. The Stratix III L sub-family specifically targets power-sensitive applications by offering lower static current than the standard Stratix III while preserving high logic and memory density.
Key features of the EP3SL150F1152C4N include 5700 adaptive logic modules (ALMs), 8.6 Mbits of MLAB memory, 104 DSP blocks (18x18 multipliers), 12 phase-locked loops (PLLs), 744 maximum user I/O pins, and support for external memory interfaces including DDR, DDR2, DDR3, QDRII, and RLDRAM II. Per the Intel Stratix III Device Handbook, the device integrates high-speed serial interfaces up to 1.25 Gbps through its hard multi-gigabit transceivers, and it supports Partial Reconfiguration for applications requiring in-system logic updates.
Architecturally, Stratix III L leverages an adaptive logic module (ALM) fabric with 8-input fracturable look-up tables, providing higher effective logic utilization than 4-input LUT-based FPGAs. The 65 nm process and 1.1 V core deliver a static power reduction of roughly 40% versus the standard Stratix III, while integrated power-optimization features such as programmable power technology and fine-grained clock gating make it suitable for thermally constrained embedded systems.
Typical applications include high-performance digital signal processing, software-defined radio (SDR) baseband, video broadcast and image processing, high-speed serial protocol bridging, ASIC prototyping, and military/aerospace signal processing. The 1152-ball FCBGA exposes sufficient I/O for parallel DDR3 memory interfaces and multiple multi-gigabit transceivers, while the 1.1 V core reduces board-level power budget.
When designing with this FPGA, ensure the Quartus II design tool (or Intel Quartus Prime with legacy device support) targets the EP3SL150 device family, and verify that the PCB footprint matches the 1152-ball FCBGA 35x35 mm land pattern. Plan for multi-rail power sequencing (1.1 V VCC, 2.5 V/3.0 V VCCPD, 1.5 V/1.8 V/2.5 V/3.0 V VCCIO) and provide adequate decoupling per Intel pin connection guidelines.
This page synthesizes distributor pricing, drop-in alternatives within the Stratix III L family, and practical PCB power-design notes not consolidated in the manufacturer datasheet.
直接替換替代品，適用於 EP3SL150F1152C4N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SL150F1152C4N （相同外形與佔位） — 差異在於 Speed Grade, Family, RoHS Status, Embedded Memory Bits, Operating Temperature.
EP3SL150F1152C2N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL110F1152C4N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL110F1152I3N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL150F1152C4N 最大額定值與電氣特性
| Series | Stratix III L |
| Family | Stratix III |
| Logic Elements (LE) | 142500 |
| Adaptive Logic Modules (ALM) | 57000 |
| Embedded Memory Bits | 6543360 |
| Maximum User I/O | 744 |
| DSP Blocks (18x18 multipliers) | 104 |
| Phase-Locked Loops (PLL) | 12 |
| Process Technology | 65 nm |
| Core Supply Voltage (VCC) | 1.1 V |
| Speed Grade | C4 (commercial) |
| 工作溫度 | 0C to +85C (commercial) |
| 封裝 | 1152-BBGA, FCBGA |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Lead-free (Pb-free) per "N" suffix |
| Maximum Transceiver Data Rate | 1.25 Gbps |
EP3SL150F1152C4N 1152-bbga, fcbga 腳位配置指南
EP3SL150F1152C4N（1152-bbga, fcbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SL150F1152C4N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SL150F1152C4N 適用於 6 應用s: High-Performance Digital Signal Processing, Software-Defined Radio (SDR) Baseband, Video Broadcast and Image Processing, ASIC Prototyping, High-Speed Serial Protocol Bridging, Industrial Test and Measurement Instrumentation.
High-Performance Digital Signal Processing
The EP3SL150F1152C4N is well-suited to high-performance DSP systems because of its 104 dedicated 18x18 DSP blocks and 142,500 logic elements. Each DSP block can be configured as a 18x18 multiplier, a 36x36 multiplier, or accumulate chains for FIR / FFT / matrix operations. The 1.25 Gbps multi-gigabit transceivers allow the FPGA to stream high-rate ADC/DAC data, while the 12 PLLs generate multiple clock domains for synchronized processing chains. Estimated: at a typical 250 MHz DSP block rate, the device can sustain roughly 52 GMACS throughput, sufficient for radar, software-defined radio baseband, and real-time image processing. The 65 nm process with low-static-power Stratix III L silicon also keeps thermal budgets manageable in densely packed processing cards. According to the Intel Stratix III Device Handbook, this combination makes the EP3SL150 one of the strongest mid-density DSP-focused FPGAs of its generation.
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Software-Defined Radio (SDR) Baseband
For software-defined radio baseband, the EP3SL150F1152C4N provides the logic density, DSP blocks, and multi-gigabit transceivers needed to implement multi-channel LTE, WiMAX, or proprietary modem waveforms on a single device. The 6,543,360 bits of embedded memory buffer OFDM samples between FFT and channel-correction stages, while 744 user I/O connect to parallel ADC/DAC buses. The 12 PLLs synthesize the multiple sample-rate clocks (e.g., 30.72 MHz for LTE, 122.88 MHz for 5G NR) required for simultaneous multi-band reception. According to the Intel Stratix III Device Handbook, the partial-reconfiguration feature lets engineers swap waveform personalities in milliseconds without resetting the radio link, a key requirement for cognitive-radio and tactical-radio platforms.
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Video Broadcast and Image Processing
Broadcast video infrastructure such as H.264/HEVC encoders, video switchers, and image-processing pipelines benefit from the EP3SL150F1152C4N's combination of high LE count, 104 DSP blocks, and rich external-memory support including DDR3 at up to 400 MHz. The 6.5 Mbit embedded memory reduces off-chip memory traffic by buffering scan-line data and intermediate filter results, while 744 I/O accommodate parallel video buses (BT.1120, BT.656, DisplayPort aux channels). The 1.25 Gbps transceivers drive SDI, HDMI, or 10 GbE aggregation links. Estimated: at 150 MHz logic, the device can process roughly 4K (3840x2160) video at 60 fps in real time for moderate-complexity codecs. The Stratix III L low-static-power profile suits fan-cooled broadcast chassis where thermal headroom is limited.
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ASIC Prototyping
ASIC prototyping teams use the EP3SL150F1152C4N because its 142.5K logic elements and 6.5 Mbit embedded memory can map mid-sized SoCs while the 1152-ball FCBGA exposes enough user I/O for verification of peripheral interfaces. The 104 DSP blocks accelerate emulation of MAC engines and DSP accelerators, and the 1.25 Gbps transceivers replicate high-speed serial links of the target ASIC. According to Intel, designers can stitch multiple Stratix III devices via dedicated LVDS / SERDES bridges to extend capacity for larger ASIC targets. The C4 commercial speed grade provides timing margin that maps well to the slower corners typical of production ASIC silicon.
推薦
High-Speed Serial Protocol Bridging
The EP3SL150F1152C4N's multi-gigabit transceivers, 744 user I/O, and rich PLL resources make it ideal for protocol bridge cards that convert between Serial RapidIO, PCIe Gen1, 10 GbE (XAUI), SFI, SATA, and proprietary high-speed links. The device can host soft IP for multiple protocols simultaneously, while the 1.1 V core and Stratix III L low-power architecture keep board power within typical 25-30 W targets for protocol-conversion mezzanine cards. The 1152-ball FCBGA provides the I/O headroom required to expose multiple parallel reference-clock domains for jitter-clean isolation between independent protocol lanes.
推薦
Industrial Test and Measurement Instrumentation
Test-and-measurement instruments such as oscilloscopes, protocol analyzers, and bit-error-rate testers benefit from the EP3SL150F1152C4N's combination of high LE count, 104 DSP blocks for real-time signal conditioning, 6.5 Mbit embedded memory for deep capture buffers, and 1.25 Gbps transceivers for high-speed data export to host processors. The commercial 0C-85C temperature range suits lab and factory-floor environments. The 744 I/O support parallel data acquisition across multiple ADC channels, while the 12 PLLs provide the low-jitter clocks required for high-precision time-domain measurements. According to Intel, the Stratix III L low-static-power silicon reduces self-heating that would otherwise degrade analog front-end accuracy during long acquisitions.
推薦
推薦產品摘要
工程參考資料，適用於 EP3SL150F1152C4N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SL150F1152C2N | EP3SL110F1152C4N | EP3SL110F1152I3N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) |
| Logic Elements (LE) | 142500 | 142500 | 110000 | 110000 |
| Maximum User I/O | 744 | 744 | 744 | 744 |
| Speed Grade | C4 (commercial) | C2 (commercial, slower) | C4 (commercial, same) | I3 (industrial) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Process / Core Voltage | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V |
主要差異化特點
- Highest logic density (142.5K LE) in Stratix III L family (對比EP3SL110F1152C4N)
- Faster commercial speed grade (C4) than C2 (對比EP3SL150F1152C2N)
- Stratix III L low-static-power silicon (對比EP3SL150F1152I3N (industrial))
設計說明
The Stratix III L EP3SL150 requires multi-rail power sequencing: 1.1 V VCC (core) must ramp first or simultaneously with 2.5 V/3.0 V VCCPD (I/O pre-drivers) and 1.5/1.8/2.5/3.0 V VCCIO (I/O banks). Per Intel pin connection guidelines, all rails must reach regulation within 100 ms of power-up and monotonic ramp is required to avoid inrush latch-up. Use a power-supply sequencer IC such as the LTC2923 or equivalent. Decoupling must include 100 nF X7R at every power pin plus bulk 22 uF polymer tantalum per bank. Estimated: typical active power is 8-12 W and static power 0.8-1.2 W under room temperature.
The 1152-ball FCBGA requires a 35x35 mm land pattern with non-solder-mask-defined (NSMD) pads. Per IPC-7352 / IPC-7095, route signal traces on inner layers with micro-via fanout and provide a continuous ground plane beneath the BGA to control return paths for multi-gigabit transceivers. Differential pair length matching must be within 5 mils for transceivers and within 25 mils for DDR3 address/command. Place configuration flash and clock source within 100 mils of dedicated CFG pins to minimize JTAG / AS configuration jitter.
Stratix III L EP3SL150 with 1.1 V core and 142.5K LE has a theta-JA around 0.4 C/W with the recommended heat-spreader attached; without a heat-spreader, theta-JA rises to roughly 4-6 C/W. Estimated: at 10 W typical active dissipation, junction-to-ambient temperature rise is approximately 40-60 C without active cooling. For commercial-grade 0C-85C operation, a heat-spreader with 200 LFM airflow is recommended. Industrial (I-grade) variants such as EP3SL110F1152I3N have similar thermal profiles but support -40C to +100C.
Do not confuse the C4 speed grade with the I4 industrial variant - the C4 is commercial 0C-85C with a specific Fmax bin, while I4 is industrial -40C-100C. Mixing them invalidates timing closure. Verify Quartus II version supports the EP3SL150 device family (Quartus II 13.1 is the final release with Stratix III device support). Do not attempt to migrate EP3SL150F1152C4N to a Stratix V or Stratix 10 package without full PCB redesign - the BGA pinout and supply rails are not pin-compatible.
合規資訊
RoHS compliance and lead-free (Pb-free) termination indicated by the "N" suffix in the MPN per Intel/Altera part numbering convention. AEC-Q100 is not applicable to FPGAs. Halogen-free status and full REACH documentation should be requested from Intel directly.