EP3SL150F1152C4N - 142.5K LE, 744 I/O Stratix III L FPGA | Intel
부품 번호: EP3SL150F1152C4N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2862.37 | $2,862.37 |
| 10 | $2685 | $26,850.00 |
| 100 | $2410 | $241,000.00 |
| 250 | $2285 | $571,250.00 |
| 500 | $2150 | $1,075,000.00 |
EP3SL150F1152C4N 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, DSP blocks, and embedded memory. FPGAs sit within the broader hierarchy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors, allowing designers to implement arbitrary digital hardware that can be re-programmed in the field. The Stratix III L sub-family specifically targets power-sensitive applications by offering lower static current than the standard Stratix III while preserving high logic and memory density.
Key features of the EP3SL150F1152C4N include 5700 adaptive logic modules (ALMs), 8.6 Mbits of MLAB memory, 104 DSP blocks (18x18 multipliers), 12 phase-locked loops (PLLs), 744 maximum user I/O pins, and support for external memory interfaces including DDR, DDR2, DDR3, QDRII, and RLDRAM II. Per the Intel Stratix III Device Handbook, the device integrates high-speed serial interfaces up to 1.25 Gbps through its hard multi-gigabit transceivers, and it supports Partial Reconfiguration for applications requiring in-system logic updates.
Architecturally, Stratix III L leverages an adaptive logic module (ALM) fabric with 8-input fracturable look-up tables, providing higher effective logic utilization than 4-input LUT-based FPGAs. The 65 nm process and 1.1 V core deliver a static power reduction of roughly 40% versus the standard Stratix III, while integrated power-optimization features such as programmable power technology and fine-grained clock gating make it suitable for thermally constrained embedded systems.
Typical applications include high-performance digital signal processing, software-defined radio (SDR) baseband, video broadcast and image processing, high-speed serial protocol bridging, ASIC prototyping, and military/aerospace signal processing. The 1152-ball FCBGA exposes sufficient I/O for parallel DDR3 memory interfaces and multiple multi-gigabit transceivers, while the 1.1 V core reduces board-level power budget.
When designing with this FPGA, ensure the Quartus II design tool (or Intel Quartus Prime with legacy device support) targets the EP3SL150 device family, and verify that the PCB footprint matches the 1152-ball FCBGA 35x35 mm land pattern. Plan for multi-rail power sequencing (1.1 V VCC, 2.5 V/3.0 V VCCPD, 1.5 V/1.8 V/2.5 V/3.0 V VCCIO) and provide adequate decoupling per Intel pin connection guidelines.
This page synthesizes distributor pricing, drop-in alternatives within the Stratix III L family, and practical PCB power-design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: EP3SL150F1152C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL150F1152C4N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Family, RoHS Status, Embedded Memory Bits, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL150F1152C2N
✅ 드롭인✓ 재고 있음
$1280 / 개
데이터시트 보기 →EP3SL110F1152C4N
✅ 드롭인✓ 재고 있음
$3500 / 개
데이터시트 보기 →EP3SL110F1152I3N
✅ 드롭인✓ 재고 있음
$335 / 개
데이터시트 보기 →EP3SL150F1152C4N 최대 정격 & 전기적 특성
| Series | Stratix III L |
| Family | Stratix III |
| Logic Elements (LE) | 142500 |
| Adaptive Logic Modules (ALM) | 57000 |
| Embedded Memory Bits | 6543360 |
| Maximum User I/O | 744 |
| DSP Blocks (18x18 multipliers) | 104 |
| Phase-Locked Loops (PLL) | 12 |
| Process Technology | 65 nm |
| Core Supply Voltage (VCC) | 1.1 V |
| Speed Grade | C4 (commercial) |
| 동작 온도 | 0C to +85C (commercial) |
| 패키지 | 1152-BBGA, FCBGA |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Lead-free (Pb-free) per "N" suffix |
| Maximum Transceiver Data Rate | 1.25 Gbps |
EP3SL150F1152C4N 1152-bbga, fcbga 핀 구성 가이드
EP3SL150F1152C4N(1152-bbga, fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL150F1152C4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL150F1152C4N 적합 용도: 6 애플리케이션s: High-Performance Digital Signal Processing, Software-Defined Radio (SDR) Baseband, Video Broadcast and Image Processing, ASIC Prototyping, High-Speed Serial Protocol Bridging, Industrial Test and Measurement Instrumentation.
High-Performance Digital Signal Processing
The EP3SL150F1152C4N is well-suited to high-performance DSP systems because of its 104 dedicated 18x18 DSP blocks and 142,500 logic elements. Each DSP block can be configured as a 18x18 multiplier, a 36x36 multiplier, or accumulate chains for FIR / FFT / matrix operations. The 1.25 Gbps multi-gigabit transceivers allow the FPGA to stream high-rate ADC/DAC data, while the 12 PLLs generate multiple clock domains for synchronized processing chains. Estimated: at a typical 250 MHz DSP block rate, the device can sustain roughly 52 GMACS throughput, sufficient for radar, software-defined radio baseband, and real-time image processing. The 65 nm process with low-static-power Stratix III L silicon also keeps thermal budgets manageable in densely packed processing cards. According to the Intel Stratix III Device Handbook, this combination makes the EP3SL150 one of the strongest mid-density DSP-focused FPGAs of its generation.
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Software-Defined Radio (SDR) Baseband
For software-defined radio baseband, the EP3SL150F1152C4N provides the logic density, DSP blocks, and multi-gigabit transceivers needed to implement multi-channel LTE, WiMAX, or proprietary modem waveforms on a single device. The 6,543,360 bits of embedded memory buffer OFDM samples between FFT and channel-correction stages, while 744 user I/O connect to parallel ADC/DAC buses. The 12 PLLs synthesize the multiple sample-rate clocks (e.g., 30.72 MHz for LTE, 122.88 MHz for 5G NR) required for simultaneous multi-band reception. According to the Intel Stratix III Device Handbook, the partial-reconfiguration feature lets engineers swap waveform personalities in milliseconds without resetting the radio link, a key requirement for cognitive-radio and tactical-radio platforms.
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Video Broadcast and Image Processing
Broadcast video infrastructure such as H.264/HEVC encoders, video switchers, and image-processing pipelines benefit from the EP3SL150F1152C4N's combination of high LE count, 104 DSP blocks, and rich external-memory support including DDR3 at up to 400 MHz. The 6.5 Mbit embedded memory reduces off-chip memory traffic by buffering scan-line data and intermediate filter results, while 744 I/O accommodate parallel video buses (BT.1120, BT.656, DisplayPort aux channels). The 1.25 Gbps transceivers drive SDI, HDMI, or 10 GbE aggregation links. Estimated: at 150 MHz logic, the device can process roughly 4K (3840x2160) video at 60 fps in real time for moderate-complexity codecs. The Stratix III L low-static-power profile suits fan-cooled broadcast chassis where thermal headroom is limited.
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ASIC Prototyping
ASIC prototyping teams use the EP3SL150F1152C4N because its 142.5K logic elements and 6.5 Mbit embedded memory can map mid-sized SoCs while the 1152-ball FCBGA exposes enough user I/O for verification of peripheral interfaces. The 104 DSP blocks accelerate emulation of MAC engines and DSP accelerators, and the 1.25 Gbps transceivers replicate high-speed serial links of the target ASIC. According to Intel, designers can stitch multiple Stratix III devices via dedicated LVDS / SERDES bridges to extend capacity for larger ASIC targets. The C4 commercial speed grade provides timing margin that maps well to the slower corners typical of production ASIC silicon.
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High-Speed Serial Protocol Bridging
The EP3SL150F1152C4N's multi-gigabit transceivers, 744 user I/O, and rich PLL resources make it ideal for protocol bridge cards that convert between Serial RapidIO, PCIe Gen1, 10 GbE (XAUI), SFI, SATA, and proprietary high-speed links. The device can host soft IP for multiple protocols simultaneously, while the 1.1 V core and Stratix III L low-power architecture keep board power within typical 25-30 W targets for protocol-conversion mezzanine cards. The 1152-ball FCBGA provides the I/O headroom required to expose multiple parallel reference-clock domains for jitter-clean isolation between independent protocol lanes.
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Industrial Test and Measurement Instrumentation
Test-and-measurement instruments such as oscilloscopes, protocol analyzers, and bit-error-rate testers benefit from the EP3SL150F1152C4N's combination of high LE count, 104 DSP blocks for real-time signal conditioning, 6.5 Mbit embedded memory for deep capture buffers, and 1.25 Gbps transceivers for high-speed data export to host processors. The commercial 0C-85C temperature range suits lab and factory-floor environments. The 744 I/O support parallel data acquisition across multiple ADC channels, while the 12 PLLs provide the low-jitter clocks required for high-precision time-domain measurements. According to Intel, the Stratix III L low-static-power silicon reduces self-heating that would otherwise degrade analog front-end accuracy during long acquisitions.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL150F1152C4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL150F1152C2N | EP3SL110F1152C4N | EP3SL110F1152I3N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) |
| Logic Elements (LE) | 142500 | 142500 | 110000 | 110000 |
| Maximum User I/O | 744 | 744 | 744 | 744 |
| Speed Grade | C4 (commercial) | C2 (commercial, slower) | C4 (commercial, same) | I3 (industrial) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Process / Core Voltage | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V |
주요 차별점
- Highest logic density (142.5K LE) in Stratix III L family (vs EP3SL110F1152C4N)
- Faster commercial speed grade (C4) than C2 (vs EP3SL150F1152C2N)
- Stratix III L low-static-power silicon (vs EP3SL150F1152I3N (industrial))
설계 노트
The Stratix III L EP3SL150 requires multi-rail power sequencing: 1.1 V VCC (core) must ramp first or simultaneously with 2.5 V/3.0 V VCCPD (I/O pre-drivers) and 1.5/1.8/2.5/3.0 V VCCIO (I/O banks). Per Intel pin connection guidelines, all rails must reach regulation within 100 ms of power-up and monotonic ramp is required to avoid inrush latch-up. Use a power-supply sequencer IC such as the LTC2923 or equivalent. Decoupling must include 100 nF X7R at every power pin plus bulk 22 uF polymer tantalum per bank. Estimated: typical active power is 8-12 W and static power 0.8-1.2 W under room temperature.
The 1152-ball FCBGA requires a 35x35 mm land pattern with non-solder-mask-defined (NSMD) pads. Per IPC-7352 / IPC-7095, route signal traces on inner layers with micro-via fanout and provide a continuous ground plane beneath the BGA to control return paths for multi-gigabit transceivers. Differential pair length matching must be within 5 mils for transceivers and within 25 mils for DDR3 address/command. Place configuration flash and clock source within 100 mils of dedicated CFG pins to minimize JTAG / AS configuration jitter.
Stratix III L EP3SL150 with 1.1 V core and 142.5K LE has a theta-JA around 0.4 C/W with the recommended heat-spreader attached; without a heat-spreader, theta-JA rises to roughly 4-6 C/W. Estimated: at 10 W typical active dissipation, junction-to-ambient temperature rise is approximately 40-60 C without active cooling. For commercial-grade 0C-85C operation, a heat-spreader with 200 LFM airflow is recommended. Industrial (I-grade) variants such as EP3SL110F1152I3N have similar thermal profiles but support -40C to +100C.
Do not confuse the C4 speed grade with the I4 industrial variant - the C4 is commercial 0C-85C with a specific Fmax bin, while I4 is industrial -40C-100C. Mixing them invalidates timing closure. Verify Quartus II version supports the EP3SL150 device family (Quartus II 13.1 is the final release with Stratix III device support). Do not attempt to migrate EP3SL150F1152C4N to a Stratix V or Stratix 10 package without full PCB redesign - the BGA pinout and supply rails are not pin-compatible.
규정 준수 정보
RoHS compliance and lead-free (Pb-free) termination indicated by the "N" suffix in the MPN per Intel/Altera part numbering convention. AEC-Q100 is not applicable to FPGAs. Halogen-free status and full REACH documentation should be requested from Intel directly.