EP3SL200H780C2 - Stratix III L FPGA, 200K LE, 780-BGA | Intel
MPN： EP3SL200H780C2 ✗ 停產EP3SL200H780C2 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable routing that the designer programs after manufacturing. Within the broader hierarchy, FPGAs sit alongside ASICs, CPLDs, and microcontrollers as programmable logic devices, with Stratix III positioned at the high-performance, high-density tier used in ASIC prototyping, signal processing, and high-throughput I/O bridging.
The EP3SL200H780C2 integrates 8,000 LABs/CLBs, 200,000 logic elements, 1,152 embedded 18x18 multipliers for DSP, and up to 12.7 Mbit of embedded RAM. Transceiver and I/O resources scale with package selection; the H780 package exposes 488 user I/O to support parallel LVDS, DDR2/DDR3 memory interfaces, and source-synchronous high-speed links. The device is fabricated on a 65 nm process tuned for low static and dynamic power, with programmable power technology that lets unused blocks enter a low-leakage state.
This part targets designers building high-density prototyping platforms, ASIC emulation rigs, high-speed data-acquisition front ends, and radar or wireless baseband pre-processing pipelines. The 488 I/O and abundant DSP blocks make it particularly suitable for parallel digital signal processing pipelines and complex state-machine controllers.
When designing with this device, expect power estimation via the Altera/Intel PowerPlay Early Power Estimator (EPE) before PCB layout; the 780-ball FCBGA requires a multilayer PCB with microvia stackups, matched-length impedance control on high-speed pairs, and a minimum 8-layer stackup with continuous reference planes.
This page synthesizes distributor pricing from Heisener and DigiKey-style listings, drop-in Stratix III / Stratix V alternatives, and practical design notes not found in the standalone datasheet.
直接替換替代品，適用於 EP3SL200H780C2 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SL200H780C2 （相同外形與佔位） — 差異在於 Package, Speed Grade, Operating Temperature, Family, Embedded Memory Bits.
EP3SL200H780C2N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SL200H780C2LN
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP3SL200H780C3N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SL200H780C3
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SL200H780C4N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP3SL200H780C4
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SL200H780I3N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SL200H780C2 最大額定值與電氣特性
| Series | Stratix III L |
| Logic Elements | 200,000 |
| LABs / CLBs | 8000 |
| Total Memory Bits | 10,901,504 |
| User I/O Count | 488 |
| 封裝 | 780-BBGA, FCBGA |
| 工作溫度 | 0C to +85C (Commercial) |
| 安裝類型 | Surface Mount |
| Process Node | 65 nm |
| RoHS 狀態 | Compliant |
| Lead Free | Yes |
EP3SL200H780C2 780-bbga, fcbga 腳位配置指南
EP3SL200H780C2（780-bbga, fcbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SL200H780C2.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SL200H780C2 適用於 6 應用s: ASIC Prototyping and Emulation, High-Speed Data Acquisition Front End, Wireless Baseband Pre-Processing, Radar Signal Processing Pipelines, Industrial Imaging and Machine Vision, High-Speed Test and Measurement Instrumentation.
ASIC Prototyping and Emulation
The EP3SL200H780C2 is well suited to ASIC prototyping where designers partition multi-million-gate ASIC netlists across multiple FPGAs. With 200,000 logic elements and 8,000 LABs/CLBs, each device holds a substantial slice of the ASIC design, while 488 user I/O enable high-pin-count chip-to-chip interconnect via LVDS or HSTC. The 65 nm low-power process reduces prototype heat generation, simplifying chassis design versus older 90 nm FPGAs. Programmable Power Technology lets unused blocks enter a low-leakage state, so the prototype closely matches real ASIC power when most logic is active. Designers use the Quartus II design tools to compile, partition, and time-budget their prototype across 2-4 EP3SL200H780C2 devices, accelerating software development before tapeout.
推薦
High-Speed Data Acquisition Front End
With 488 user I/O supporting parallel LVDS pairs and 10,901,504 bits of embedded memory, the EP3SL200H780C2 works well as the FPGA core of a multi-channel data acquisition board. The 65 nm process gives the device high enough Fmax at speed grade 2 to capture and pre-process data from parallel ADCs, while embedded DSP blocks implement FIR filters and FFTs in real time. The 780-ball FCBGA exposes enough general-purpose I/O to interface with DDR2/DDR3 buffers that act as deep capture memory. Designers using the EP3SL200H780C2 in data acquisition typically pair it with an external clock-distribution network and ADC such as the AD9255; the FPGA can multiplex, down-sample, and forward packets over Ethernet or PCIe.
推薦
Wireless Baseband Pre-Processing
Wireless baseband pre-processing benefits from the EP3SL200H780C2's 200,000 logic elements and embedded DSP blocks, which let engineers implement channelization, pulse shaping, and pre-FFT processing in FPGA fabric. The 488 user I/O give enough pins to receive digitized IF data from multiple ADC channels, while the embedded 18x18 multipliers accelerate correlators and matched filters. Stratix III L's low-power focus reduces heat in dense base-station enclosures, an advantage when several EP3SL200H780C2 devices share a chassis. Designers implement the radio PHY layer on the EP3SL200H780C2 and forward decoded data to a host processor via SERDES or parallel LVDS.
推薦
Radar Signal Processing Pipelines
Radar pulse-compression and beamforming pipelines fit the EP3SL200H780C2 well: 200,000 logic elements and embedded DSP blocks accelerate FFTs, FIR matched filters, and adaptive beamformers, while 10.9 Mbit of embedded RAM serves as ping-pong buffers between processing stages. The 780-ball FCBGA package exposes 488 user I/O for high-speed digitizer and DAC connections, and the low-power 65 nm process keeps the FPGA within the thermal envelope of airborne or vehicle-mounted enclosures. Designers implement the pulse-compression engine on EP3SL200H780C2, feeding processed data downstream to a tracking processor over a parallel or SERDES link.
推薦
Industrial Imaging and Machine Vision
Industrial imaging systems leverage the EP3SL200H780C2 to ingest data from multiple high-resolution image sensors and run real-time pre-processing such as demosaicing, gamma correction, and defect detection. The 488 I/O accept parallel Camera Link or LVDS sensor outputs, while embedded DSP blocks handle 2D filter kernels at line rate. The 65 nm process yields predictable thermal performance in factory-floor cabinets where ambient temperatures can vary widely. Designers combine the EP3SL200H780C2 with external DDR2/DDR3 frame buffers and route processed image regions over Ethernet or PCIe to a host controller.
推薦
High-Speed Test and Measurement Instrumentation
Test and measurement instruments such as protocol analyzers and logic analyzers depend on the EP3SL200H780C2's combination of 488 user I/O and 200,000 logic elements to capture and decode parallel bus traffic in real time. The device's embedded memory (10.9 Mbit) holds deep capture buffers, while embedded DSP blocks accelerate protocol decoding (PCIe, SATA, USB, custom). The H780 FCBGA footprint exposes enough I/O for 32-bit parallel probes plus trigger/clock channels. Designers use the EP3SL200H780C2 as the central FPGA in a high-end logic analyzer, then upload traces to a host PC over USB or Ethernet for software analysis.
推薦
推薦產品摘要
工程參考資料，適用於 EP3SL200H780C2 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SL200H780C2N | EP3SL200H780C3N | EP3SL200H780I3N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-BBGA FCBGA | 780-BBGA FCBGA - same | 780-BBGA FCBGA - same | 780-BBGA FCBGA - same |
| Logic Elements | 200,000 | 200,000 | 200,000 | 200,000 |
| LABs/CLBs | 8,000 | 8,000 | 8,000 | 8,000 |
| User I/O | 488 | 488 | 488 | 488 |
| Speed Grade | 2 (Commercial) | 2 (Commercial) | 3 (Commercial) | 3 (Industrial) |
| Temperature Range | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | -40C to +100C |
| Process Node | 65 nm low-power | 65 nm low-power | 65 nm low-power | 65 nm low-power |
| Lead Free | Yes | Yes | Yes | Yes |
主要差異化特點
- Same-footprint speed grade flexibility within Stratix III L family (對比EP3SL200H780C3N)
- Commercial vs industrial temperature grade availability (對比EP3SL200H780I3N)
- Lower static and dynamic power vs standard Stratix III (對比EP3S200F780C2)
設計說明
Estimated: Stratix III L devices at 200K LE with sustained logic activity around 70-80% can dissipate 8-12 W. The 780-ball FCBGA package has a theta_JA of approximately 8-12 C/W with the recommended thermal via array and 4 oz copper on inner layers, yielding a junction temperature rise of 65-145 C above ambient. For reliable operation, designers must provide a thermal via array under the central ground balls and at least a 6x6 grid of inner-layer copper pour pads, per the Stratix III Device Handbook thermal design guidelines.
The 780-ball FCBGA requires a high-density interconnect PCB stackup. Use at least an 8-layer board with HDI (microvia) construction to fan out the 1.0 mm pitch BGA. Match trace impedance to 50 ohm single-ended or 100 ohm differential for LVDS pairs, and apply length-matching to within 10-20 mil on byte-lane signals to DDR2/DDR3 memory interfaces. Continuous reference planes on layers L2 and L7 are essential; route high-speed signals on stripline layers (L3-L6) referenced to solid ground.
Do not omit the configuration flash or JTAG header: the EP3SL200H780C2 needs an EPCS or EPCQ configuration device or JTAG-driven programming for production boards. Power sequencing of VCCINT before VCCIO is mandatory - apply VCCINT (typically 0.9 V or 1.1 V) before VCCIO (1.2-3.3 V) within the Altera-specified ramp window, or the device may latch up. Use the PowerPlay Early Power Estimator (EPE) before schematic freeze to validate regulator sizing.
合規資訊
RoHS-compliant per Altera/Intel product page. Lead-free. Reach and halogen-free status not explicitly stated in Verified Web Data; marked unknown. AEC-Q100 not applicable (FPGA, not an automotive-grade IC).