EP3SL200H780C2 - Stratix III L FPGA, 200K LE, 780-BGA | Intel
부품 번호: EP3SL200H780C2 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8559.95 | $8,559.95 |
| 10 | $8200 | $82,000.00 |
| 100 | $7800 | $780,000.00 |
| 500 | $7350 | $3,675,000.00 |
| 1,000 | $6950 | $6,950,000.00 |
EP3SL200H780C2 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable routing that the designer programs after manufacturing. Within the broader hierarchy, FPGAs sit alongside ASICs, CPLDs, and microcontrollers as programmable logic devices, with Stratix III positioned at the high-performance, high-density tier used in ASIC prototyping, signal processing, and high-throughput I/O bridging.
The EP3SL200H780C2 integrates 8,000 LABs/CLBs, 200,000 logic elements, 1,152 embedded 18x18 multipliers for DSP, and up to 12.7 Mbit of embedded RAM. Transceiver and I/O resources scale with package selection; the H780 package exposes 488 user I/O to support parallel LVDS, DDR2/DDR3 memory interfaces, and source-synchronous high-speed links. The device is fabricated on a 65 nm process tuned for low static and dynamic power, with programmable power technology that lets unused blocks enter a low-leakage state.
This part targets designers building high-density prototyping platforms, ASIC emulation rigs, high-speed data-acquisition front ends, and radar or wireless baseband pre-processing pipelines. The 488 I/O and abundant DSP blocks make it particularly suitable for parallel digital signal processing pipelines and complex state-machine controllers.
When designing with this device, expect power estimation via the Altera/Intel PowerPlay Early Power Estimator (EPE) before PCB layout; the 780-ball FCBGA requires a multilayer PCB with microvia stackups, matched-length impedance control on high-speed pairs, and a minimum 8-layer stackup with continuous reference planes.
This page synthesizes distributor pricing from Heisener and DigiKey-style listings, drop-in Stratix III / Stratix V alternatives, and practical design notes not found in the standalone datasheet.
드롭인 대체품: EP3SL200H780C2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL200H780C2 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Family, Embedded Memory Bits.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL200H780C2N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$6050 / 개
데이터시트 보기 →EP3SL200H780C2LN
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3SL200H780C3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4995 / 개
데이터시트 보기 →EP3SL200H780C3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5900 / 개
데이터시트 보기 →EP3SL200H780C4N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3SL200H780C4
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1210 / 개
데이터시트 보기 →EP3SL200H780I3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$7200 / 개
데이터시트 보기 →EP3SL200H780C2 최대 정격 & 전기적 특성
| Series | Stratix III L |
| Logic Elements | 200,000 |
| LABs / CLBs | 8000 |
| Total Memory Bits | 10,901,504 |
| User I/O Count | 488 |
| 패키지 | 780-BBGA, FCBGA |
| 동작 온도 | 0C to +85C (Commercial) |
| 실장 유형 | Surface Mount |
| Process Node | 65 nm |
| RoHS 상태 | Compliant |
| Lead Free | Yes |
EP3SL200H780C2 780-bbga, fcbga 핀 구성 가이드
EP3SL200H780C2(780-bbga, fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL200H780C2.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL200H780C2 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, High-Speed Data Acquisition Front End, Wireless Baseband Pre-Processing, Radar Signal Processing Pipelines, Industrial Imaging and Machine Vision, High-Speed Test and Measurement Instrumentation.
ASIC Prototyping and Emulation
The EP3SL200H780C2 is well suited to ASIC prototyping where designers partition multi-million-gate ASIC netlists across multiple FPGAs. With 200,000 logic elements and 8,000 LABs/CLBs, each device holds a substantial slice of the ASIC design, while 488 user I/O enable high-pin-count chip-to-chip interconnect via LVDS or HSTC. The 65 nm low-power process reduces prototype heat generation, simplifying chassis design versus older 90 nm FPGAs. Programmable Power Technology lets unused blocks enter a low-leakage state, so the prototype closely matches real ASIC power when most logic is active. Designers use the Quartus II design tools to compile, partition, and time-budget their prototype across 2-4 EP3SL200H780C2 devices, accelerating software development before tapeout.
추천
High-Speed Data Acquisition Front End
With 488 user I/O supporting parallel LVDS pairs and 10,901,504 bits of embedded memory, the EP3SL200H780C2 works well as the FPGA core of a multi-channel data acquisition board. The 65 nm process gives the device high enough Fmax at speed grade 2 to capture and pre-process data from parallel ADCs, while embedded DSP blocks implement FIR filters and FFTs in real time. The 780-ball FCBGA exposes enough general-purpose I/O to interface with DDR2/DDR3 buffers that act as deep capture memory. Designers using the EP3SL200H780C2 in data acquisition typically pair it with an external clock-distribution network and ADC such as the AD9255; the FPGA can multiplex, down-sample, and forward packets over Ethernet or PCIe.
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Wireless Baseband Pre-Processing
Wireless baseband pre-processing benefits from the EP3SL200H780C2's 200,000 logic elements and embedded DSP blocks, which let engineers implement channelization, pulse shaping, and pre-FFT processing in FPGA fabric. The 488 user I/O give enough pins to receive digitized IF data from multiple ADC channels, while the embedded 18x18 multipliers accelerate correlators and matched filters. Stratix III L's low-power focus reduces heat in dense base-station enclosures, an advantage when several EP3SL200H780C2 devices share a chassis. Designers implement the radio PHY layer on the EP3SL200H780C2 and forward decoded data to a host processor via SERDES or parallel LVDS.
추천
Radar Signal Processing Pipelines
Radar pulse-compression and beamforming pipelines fit the EP3SL200H780C2 well: 200,000 logic elements and embedded DSP blocks accelerate FFTs, FIR matched filters, and adaptive beamformers, while 10.9 Mbit of embedded RAM serves as ping-pong buffers between processing stages. The 780-ball FCBGA package exposes 488 user I/O for high-speed digitizer and DAC connections, and the low-power 65 nm process keeps the FPGA within the thermal envelope of airborne or vehicle-mounted enclosures. Designers implement the pulse-compression engine on EP3SL200H780C2, feeding processed data downstream to a tracking processor over a parallel or SERDES link.
추천
Industrial Imaging and Machine Vision
Industrial imaging systems leverage the EP3SL200H780C2 to ingest data from multiple high-resolution image sensors and run real-time pre-processing such as demosaicing, gamma correction, and defect detection. The 488 I/O accept parallel Camera Link or LVDS sensor outputs, while embedded DSP blocks handle 2D filter kernels at line rate. The 65 nm process yields predictable thermal performance in factory-floor cabinets where ambient temperatures can vary widely. Designers combine the EP3SL200H780C2 with external DDR2/DDR3 frame buffers and route processed image regions over Ethernet or PCIe to a host controller.
추천
High-Speed Test and Measurement Instrumentation
Test and measurement instruments such as protocol analyzers and logic analyzers depend on the EP3SL200H780C2's combination of 488 user I/O and 200,000 logic elements to capture and decode parallel bus traffic in real time. The device's embedded memory (10.9 Mbit) holds deep capture buffers, while embedded DSP blocks accelerate protocol decoding (PCIe, SATA, USB, custom). The H780 FCBGA footprint exposes enough I/O for 32-bit parallel probes plus trigger/clock channels. Designers use the EP3SL200H780C2 as the central FPGA in a high-end logic analyzer, then upload traces to a host PC over USB or Ethernet for software analysis.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL200H780C2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL200H780C2N | EP3SL200H780C3N | EP3SL200H780I3N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-BBGA FCBGA | 780-BBGA FCBGA - same | 780-BBGA FCBGA - same | 780-BBGA FCBGA - same |
| Logic Elements | 200,000 | 200,000 | 200,000 | 200,000 |
| LABs/CLBs | 8,000 | 8,000 | 8,000 | 8,000 |
| User I/O | 488 | 488 | 488 | 488 |
| Speed Grade | 2 (Commercial) | 2 (Commercial) | 3 (Commercial) | 3 (Industrial) |
| Temperature Range | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | -40C to +100C |
| Process Node | 65 nm low-power | 65 nm low-power | 65 nm low-power | 65 nm low-power |
| Lead Free | Yes | Yes | Yes | Yes |
주요 차별점
- Same-footprint speed grade flexibility within Stratix III L family (vs EP3SL200H780C3N)
- Commercial vs industrial temperature grade availability (vs EP3SL200H780I3N)
- Lower static and dynamic power vs standard Stratix III (vs EP3S200F780C2)
설계 노트
Estimated: Stratix III L devices at 200K LE with sustained logic activity around 70-80% can dissipate 8-12 W. The 780-ball FCBGA package has a theta_JA of approximately 8-12 C/W with the recommended thermal via array and 4 oz copper on inner layers, yielding a junction temperature rise of 65-145 C above ambient. For reliable operation, designers must provide a thermal via array under the central ground balls and at least a 6x6 grid of inner-layer copper pour pads, per the Stratix III Device Handbook thermal design guidelines.
The 780-ball FCBGA requires a high-density interconnect PCB stackup. Use at least an 8-layer board with HDI (microvia) construction to fan out the 1.0 mm pitch BGA. Match trace impedance to 50 ohm single-ended or 100 ohm differential for LVDS pairs, and apply length-matching to within 10-20 mil on byte-lane signals to DDR2/DDR3 memory interfaces. Continuous reference planes on layers L2 and L7 are essential; route high-speed signals on stripline layers (L3-L6) referenced to solid ground.
Do not omit the configuration flash or JTAG header: the EP3SL200H780C2 needs an EPCS or EPCQ configuration device or JTAG-driven programming for production boards. Power sequencing of VCCINT before VCCIO is mandatory - apply VCCINT (typically 0.9 V or 1.1 V) before VCCIO (1.2-3.3 V) within the Altera-specified ramp window, or the device may latch up. Use the PowerPlay Early Power Estimator (EPE) before schematic freeze to validate regulator sizing.
규정 준수 정보
RoHS-compliant per Altera/Intel product page. Lead-free. Reach and halogen-free status not explicitly stated in Verified Web Data; marked unknown. AEC-Q100 not applicable (FPGA, not an automotive-grade IC).