EP3SL340F1517C2 - Stratix III L FPGA, 337.5K LE, FCBGA-1517 | Altera
MPN： EP3SL340F1517C2 ✓ 啟用中EP3SL340F1517C2 概覽
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/Os interconnected by a routed fabric. FPGAs occupy the programmable logic layer of the broader semiconductor hierarchy: FPGA -> programmable logic -> digital IC -> integrated circuit. Unlike fixed-function ASICs, FPGAs are post-fabrication reprogrammable, enabling rapid prototyping, hardware acceleration, and design iteration.
Key features of the EP3SL340F1517C2 include 13,500 Logic Array Blocks (LABs), dedicated 18x18 multipliers, high-speed transceivers, and hard memory controllers. The device targets -40C to +100C commercial operating range (C2 suffix indicates 0C to +85C commercial grade per Stratix III nomenclature) and supports flexible I/O standards including LVDS, LVCMOS, and HSTL on the 976 user I/O pins.
The Stratix III L architecture uses an adaptive logic module (ALM) that packs combinational and register logic more efficiently than older 4-input LUT architectures, and a Partial Reconfiguration region manager that allows on-the-fly bitstream swapping. Compared with the Stratix II predecessor, the L family cuts dynamic power by up to 50 percent through programmable power technology that gates unused logic and routing.
Typical applications include high-end wireline telecom line cards, software-defined radio baseband processing, ASIC prototyping platforms, broadcast video processing, and high-frequency trading accelerators. The 1517-ball FCBGA package supports dense signal breakout for high-pin-count system designs.
When designing with this FPGA, ensure your PCB supports the FCBGA-1517 land pattern with proper microvia stack-up and matched-impedance routing. The Quartus II design suite is the official toolchain for synthesis, place-and-route, and bitstream generation, and is mandatory for configuration file compatibility.
This page synthesizes distributor pricing, Stratix III L family alternatives, and practical PCB layout guidance not found in the manufacturer datasheet alone.
直接替換替代品，適用於 EP3SL340F1517C2 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SL340F1517C2 （相同外形與佔位） — 差異在於 Package, Operating Temperature, Speed Grade, Embedded Memory Bits, Mounting Type.
EP3SL340F1517C2N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL340F1517C3
✅ 直接替換聯絡詢價
查看資料表 →EP3SL340F1517C4
✅ 直接替換聯絡詢價
查看資料表 →EP3SL340F1517C4N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL340F1517C7N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP4SE340F1517C2
✅ 直接替換📋 參考替代品（不在目錄中）
EP3SL340F1517C2 最大額定值與電氣特性
| Family | Stratix III L |
| Logic Elements | 337,500 |
| Logic Array Blocks (LABs) | 13,500 |
| Embedded Memory Bits | 18,822,144 (approx. 22.4 Mbit) |
| User I/Os | 976 |
| Maximum Operating Frequency | 600 MHz |
| Process Technology | 65 nm |
| Core Voltage (Vccint) | 1.1 V |
| 封裝 | 1517-ball FCBGA |
| 安裝類型 | Surface Mount |
| 工作溫度 | 0C to +85C (Commercial grade C2) |
| Speed Grade | C2 |
| Lead-Free / RoHS | Compliant |
| MSL 等級 | 3 |
| Manufacturer | Altera (now Intel FPGA) |
EP3SL340F1517C2 1517-ball fcbga 腳位配置指南
EP3SL340F1517C2（1517-ball fcbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SL340F1517C2.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SL340F1517C2 適用於 7 應用s: ASIC Prototyping Platform, Telecom Line Card Processing, Software-Defined Radio Baseband, Broadcast Video Processing, High-Frequency Trading Accelerators, Medical Imaging Accelerator, Industrial Automation Control.
ASIC Prototyping Platform
The EP3SL340F1517C2's 337,500 logic elements and 18.8 Mbit embedded memory provide enough capacity to map full SoC ASIC RTL onto a single device. Engineers partition the ASIC into multiple FPGAs using this part as the high-density master, with the FCBGA-1517 footprint supporting hundreds of I/Os needed to bridge between FPGAs. Compared with smaller Cyclone V parts, the EP3SL340F1517C2 supports multi-million-gate ASIC prototypes with a single chip, reducing board complexity. Quartus II synthesis and the Standard Pin-out File format enable seamless migration from prototype to production silicon.
推薦
Telecom Line Card Processing
Wireline telecom line cards use the EP3SL340F1517C2 for packet classification, traffic shaping, and high-throughput forward-error-correction engines. Its 600 MHz core clock and embedded DSP blocks implement multi-channel Reed-Solomon and Viterbi decoders at wire speed. The 976 user I/Os accommodate parallel SFI/XFI interfaces and backplane SerDes channels. Compared with ASIC line-card solutions, the FPGA allows post-deployment algorithm updates - critical when chasing evolving telecom standards like OTU4 and FlexE.
推薦
Software-Defined Radio Baseband
Software-defined radio (SDR) platforms rely on the EP3SL340F1517C2 to implement wideband multi-standard baseband processing including LTE, WiMAX, and proprietary waveforms. The device's hard multipliers support FFT engines and channelization filters at real-time rates, while the embedded memory holds tap coefficients and sample buffers. With 18.8 Mbit on-chip RAM, designers avoid external memory fetches in the inner loops. The FPGA outperforms typical DSP processors by 10-100x on parallel FIR/FFT kernels.
推薦
Broadcast Video Processing
Broadcast video infrastructure uses the EP3SL340F1517C2 for real-time 4K/UHD video processing, color-space conversion, scaling, and frame-rate conversion. The device handles multiple SDI streams simultaneously using its high I/O count and embedded memory as line buffers. Compared with GPU-based video pipelines, the FPGA approach delivers deterministic latency and frame-accurate output - essential for live broadcast contribution links. Quartus II video IP cores accelerate development.
推薦
High-Frequency Trading Accelerators
High-frequency trading (HFT) platforms leverage the EP3SL340F1517C2 for FPGA-based market-data feed handling and order-book processing with sub-microsecond latency. The 1.1 V core and Stratix III L low-power architecture minimize dynamic power, allowing dense FPGA compute farms in air-cooled racks. Hard PCIe Gen2 endpoints connect directly to host servers. Compared with CPU-only HFT stacks, FPGA accelerators reduce decision latency from microseconds to nanoseconds - the decisive edge in modern market microstructure.
推薦
Medical Imaging Accelerator
The EP3SL340F1517C2 powers CT, MRI, and ultrasound image reconstruction pipelines where beamforming, back-projection, and FIR filtering must execute at real-time rates. Its embedded memory bandwidth accommodates streaming pixel data from high-speed ADC front-ends, and the DSP blocks accelerate iterative reconstruction algorithms. Compared with discrete DSP farms, a single EP3SL340F1517C2 replaces multiple processor cards while reducing system latency and power - critical for portable and bedside diagnostic imaging systems.
推薦
Industrial Automation Control
The EP3SL340F1517C2 serves as the central controller for complex industrial automation cells requiring deterministic multi-axis motion control, EtherCAT/CAN-FD bridging, and machine-vision preprocessing. With 976 user I/Os, the FPGA interfaces directly to dozens of encoders, ADCs, and PWM outputs without external I/O expanders. Compared with PLC-based controllers, the FPGA delivers deterministic sub-microsecond cycle times essential for high-speed pick-and-place and semiconductor wafer-handling robots. Industrial temperature variants (I3/I4 speed grade) extend operating range to -40C to +100C.
推薦
推薦產品摘要
工程參考資料，適用於 EP3SL340F1517C2 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SL340F1517C2N | EP3SL340F1517C3 | EP3SL340F1517C4 | EP3SL340F1517C4N | EP4SE340F1517C2 |
|---|---|---|---|---|---|---|
| Package | 1517-ball FCBGA | 1517-ball FCBGA | 1517-ball FCBGA | 1517-ball FCBGA | 1517-ball FCBGA | 1517-ball FCBGA |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 340,000 |
| Speed Grade | C2 | C2 | C3 | C4 | C4 | C2 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| User I/Os | 976 | 976 | 976 | 976 | 976 | 976 |
| Process / Core Voltage | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 40 nm / 0.9 V |
| Max Frequency (approx.) | 600 MHz | 600 MHz | ~625 MHz | ~650 MHz | ~650 MHz | ~850 MHz |
主要差異化特點
- Highest-density Stratix III L variant in the FCBGA-1517 package (對比EP3SL200F1517I4N)
- Low-power 65 nm architecture compared with later-generation FPGAs (對比EP4SE340F1517C2)
- Pin-compatible upgrade path from C2 to C4 speed grade (對比EP3SL340F1517C4)
設計說明
The FCBGA-1517 package requires a high-density PCB stack-up with microvia (laser-drilled) technology for inner-layer fan-out. Standard 4-layer FR-4 is insufficient; design for at least 8 layers with 1 oz copper and matched 50-ohm impedance on high-speed transceiver pairs. Decoupling capacitor selection is critical: use 0402-size 0.1 uF and 10 uF ceramics distributed beneath the device following the reference capacitor map in the Stratix III pin-out file. Estimated: power delivery network impedance target is below 5 mOhm at 100 MHz to handle simultaneous switching noise from 976 I/Os.
At full logic utilization (337,500 LE switching) and 600 MHz operation, junction power can approach 25-30 W. The FCBGA-1517 package has a theta_JC of approximately 0.15 C/W and requires a forced-air heatsink plus thermal interface material. Estimated: with a 4 m/s airflow and a properly attached heatsink, junction-to-ambient thermal resistance is approximately 1.2 C/W, yielding a temperature rise of 36 C above ambient at 30 W. For passive cooling, consider the -I3 or -I4 speed grade variants at slightly lower clock frequencies.
Do not mix Quartus II versions across team members when targeting this device; bitstream compatibility breaks between major Quartus versions. Verify the configuration mode (Passive Serial, Fast Passive Parallel, or Active Serial) matches the design's configuration PROM or download cable. Most importantly, follow the Stratix III power-sequencing order in chapter 4 of the handbook - mis-sequencing Vccint before Vccpd can cause long-term reliability degradation that may not show up in bench testing but fails in the field within months.
High-speed transceiver channels (if used) require length-matched differential pairs with a skew budget under 5 ps. Use 100-ohm differential impedance and follow the DTR (Documenting the Routing) constraints exported by Quartus II during board layout. Cross-talk mitigation: maintain at least 3W spacing between adjacent TX/RX pairs and avoid routing signals over splits in reference planes. The FCBGA-1517 package's BGA escape routing typically requires blind/buried vias - plan your fabrication house's capabilities early.
合規資訊
RoHS compliance per Altera product page. C2 speed grade indicates commercial operating temperature (0C to +85C). AEC-Q100 not applicable for non-automotive FPGA. Intel/Altera maintains conflict-mineral compliance programs.